# HCPL-0900-500E

**Broadcom Limited** · Digital Isolators · SOIC-8

HCPL-0900-500E from Broadcom Limited, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | Input-side power supply 1, recommended 3.0 V to 5.5 V (absolute maximum 7 V), decoupled with a 47 nF low-ESR ceramic capacitor placed close to the pin. |
| 2 | IN1 | input | Logic input signal, with logic high of 2.4 V min up to VDD1, logic low of 0 V to 0.8 V, and input current of ±10 µA max. |
| 3 | NC | unconnected | Not connected. |
| 4 | GND1 | power_in | Ground for the input-side supply VDD1 (Power Supply Ground 1); a ground plane is recommended for data rates above 10 Mb/s. |
| 5 | GND2 | power_in | Ground for the output-side supply VDD2 (Power Supply Ground 2); a ground plane is recommended for data rates above 10 Mb/s. |
| 6 | OUT1 | tri_state | Logic output signal that follows IN1 when VOE is low and goes to high impedance when VOE is high, with an absolute maximum of 10 mA output current drive. |
| 7 | VOE | input | Active-low logic output enable for the single-channel device, where low enables OUT1 and high puts it in high impedance, with an absolute maximum of VDD2 + 0.5 V. |
| 8 | VDD2 | power_in | Output-side power supply 2, recommended 3.0 V to 5.5 V (absolute maximum 7 V), decoupled with a 47 nF low-ESR ceramic capacitor placed close to the pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Broadcom Limited |
| Package | SOIC-8 |
| Category | Signal Isolation Devices |
| Pins | 8 |

## CAD (KiCad official)

- Symbol: `HCPL-0900-500E`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `hcpl-0900-500e-etched.step` / `hcpl-0900-500e-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hcpl-0900-500e.step` / `hcpl-0900-500e.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Broadcom Limited datasheet](docs/hcpl-0900-500e-datasheet.pdf) (18 pp, sha256 `165f65248fb845d7`, retrieved 2026-10-28, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hcpl-0900-500e-datasheet.pdf)