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HCESD1006NC3V3B

HXY MOSFET · Electrostatic And Surge Protection (TVS/ESD) · DFN1006-2L

HCESD1006NC3V3B from HXY MOSFET, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One terminal of the bi-directional ESD protection clamp for a single protected line, which the datasheet describes as protecting one bi-directional line with a 3.3 V VRWM and 100 W peak pulse power at 8/20 µs.
2 2 passive The second terminal of the bi-directional ESD protection clamp for the same protected line, which the datasheet describes as protecting one bi-directional line with a 3.3 V VRWM and 100 W peak pulse power at 8/20 µs.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package DFN1006-2L
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power PPP 100 W tp = 8/20 µs 1
Maximum lead temperature for soldering TL 260 °C during 10 s 1
Storage Temperature Range Tstg -55 150 °C 1
Maximum junction temperature Tj 150 °C 1
IEC61000-4-2 (ESD) air discharge -30 30 kV IEC61000-4-2 air discharge 1
IEC61000-4-2 (ESD) contact discharge -30 30 kV IEC61000-4-2 contact discharge 1
IEC61000-4-4 (EFT) 40 A IEC61000-4-4 (EFT) 1
Breakdown voltage VBR VBR 3.3 V IT = 1.0 mA 2
Breakdown voltage VBR VBR 5 V IT = 1.0 mA 2
Reverse leakage current IR IR 0.05 A @ VRWM 2
Clamping voltage VC at maximum IPP VC 11 V @ MAX IPP (Note 2) 2
Peak pulse current IPP IPP 9 A (Note 2) 2
Peak pulse power PPK PPK 100 W (Note 2) 2
Dynamic resistance RDYN RDYN 0.2 Ω @ tp = 100 ns (TLP) 2
Dynamic resistance RDYN RDYN 6.5 Ω @ tp = 100 ns (TLP) 2
Line capacitance C C 7 pF 2
Clamping voltage VC at IPP = 1 A VC 15 V @ IPP = 1 A (Note 2) 2

CAD (KiCad official)

  • Symbol: HCESD1006NC3V3B
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: hcesd1006nc3v3b-etched.step / hcesd1006nc3v3b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hcesd1006nc3v3b.step / hcesd1006nc3v3b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (4 pp, sha256 72b8429a9389e05c, retrieved 2026-11-02, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF