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Contents

README

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HCD65R600

HUAKE · MOSFETs · TO-252

HCD65R600 from HUAKE, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage is rated ±30 V, with a threshold of 2.0 to 4.0 V at VDS=VGS, ID=250μA.
2 D passive Drain, connected to the exposed tab (and center position); drain-source voltage is rated 650 V and continuous drain current 7.0 A at Tc=25C.
3 S passive Source; the maximum continuous body-diode forward current is 7.0 A and the pulsed value is 28 A.

Key specifications

Parameter Value
Manufacturer HUAKE
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source Breakdown Voltage BVDSS 650 V VGS=0V, ID=250uA 2
Gate Threshold Voltage VGS(th) 2 4 V VDS= VGS, ID=250uA 2
Static Drain-Source On-Resistance RDS(on) 520 600 mΩ VGS=10 V, ID=3.5A 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=650V,VGS=0V 2
Zero Gate Voltage Drain Current IDSS 10 μA VDS=520V,Tc=125C 2
Gate-Body Leakage Current, Forward IGSSF 100 nA VGS=+30V, VDS=0V 2
Gate-Body Leakage Current, Reverse IGSSR -100 nA VGS=-30V, VDS=0V 2
Maximum Continuous Drain-Source Diode Forward Current IS 7 A 2
Maximum Pulsed Drain-Source Diode Forward Current ISM 28 A 2
Drain-Source Diode Forward Voltage VSD 1.4 V VGS =0V, IS=7.0A 2
Drain-Source Voltage VDSS 650 V 1
Drain Current - Continuous ID 7 A Tc=25C 1
Drain Current - Continuous ID 4.43 A Tc=100C 1
Drain Current - Pulsed IDM 28 A 1
Gate-Source Voltage VGSS -30 30 V 1
Single Pulsed Avalanche Energy (Limit Reference Value) EAS 175 mJ Note2 1
Avalanche Current IAR 3.5 A Note1 1
Repetitive Avalanche Energy EAR 3.9 mJ Note1 1
Peak Diode Recovery dv/dt dv/dt 8.5 V/ns Note3 1
Power Dissipation PD 80 W TC =25C 1
Power Dissipation derating 0.64 W/C Derate above 25C 1
Operating Junction Temperature Tj 150 C 1
Storage Temperature Range Tstg -55 150 C 1
Thermal Resistance, Junction to Case RθJC 1.56 C /W 1
Thermal Resistance, Junction to Ambient RθJA 69 C /W 1

CAD (KiCad official)

  • Symbol: HCD65R600
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: hcd65r600-etched.step / hcd65r600-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hcd65r600.step / hcd65r600.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HUAKE datasheet (6 pp, sha256 6618609ee0e1c275, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF