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HCC6201ST

HXY MOSFET · Hall Switches · SOT-23

HCC6201ST from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Supply voltage pin, operating range 2.5 V to 5.5 V with an absolute maximum of 6.0 V.
2 GND power_in Ground reference pin.
3 VOUT output Push-pull output; low level at most 0.2 V at 1 mA sink, high level at least VDD-0.2 V at 1 mA source, with output current limited to 3.0 mA (low) and -2.0 mA (high) and an absolute maximum of 5 mA.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23
Category Magnetic Sensors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
工作电压 (operating supply voltage) VDD 2.5 5.5 V 3
输出低电压 (output low voltage) VOL 0.2 V IOUT=1mA 3
输出电流 (output current, output low state) IOUT 3 mA 输出低电压时 (output low voltage) 3
输出电流 (output current, output high state) IOUT -2 mA 输出高电压时 (output high voltage) 3
工作电流 (operating current, wake-up) Iawk 2.8 mA 唤醒时 (wake-up) 3
电源平均电流 (average supply current) IDD 50 100 uA 3
唤醒模式时间 (wake-up mode time) Tawk 50 80 us 3
休眠模式时间 (sleep mode time) Tp 3.1 4.6 ms 3
工作频率 (operating frequency) Fw 220 320 Hz 3
响应频率 (response frequency) Fr 110 160 Hz 3
工作点 (operate point) Bop 18 30 42 Gauss 3
释放点 (release point) Brp 8 20 32 Gauss 3
回差 (hysteresis) Bhys 10 Gauss /Bop-Brp/ 3
电源电压 (supply voltage, absolute maximum) VDD 6 V 2
反向电压 (reverse voltage) VDD -0.3 V 2
输出电流 (output current, absolute maximum) IOUT 5 mA 2
输出电压 (output voltage, absolute maximum) VOUT 6 V 2
工作温度范围 (operating temperature range) Ta -40 85 ℃ 2
储存温度范围 (storage temperature range) Ts -50 150 ℃ 2

CAD (KiCad official)

  • Symbol: HCC6201ST
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: hcc6201st-etched.step / hcc6201st-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hcc6201st.step / hcc6201st.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (8 pp, sha256 52bc2f6c96c235ae, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF