component
HCB2012KF-102T10
Public Made by Adomby adom
TAI TECH Ferrite Beads, 0805. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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HCB2012KF-102T10
TAI TECH · Ferrite Beads · 0805
HCB2012KF-102T10 from TAI TECH, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised inductor or ferrite bead; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised inductor or ferrite bead; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TAI TECH |
| Package | 0805 |
| Category | Filters |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Impedance (nominal, 100 MHz test) | Z | 1000 | Ω | Test frequency 100M Hz, 60 mV (printed as 60mV/100M) | 2 | ||
| Impedance tolerance | Z | -25 | 25 | % | Printed as 1000±25% | 2 | |
| DC resistance | RDC | 0.2 | Ω | 2 | |||
| Rated current | 1000 | mA | Based on temperature rise test | 2 | |||
| Operating temperature | -40 | 125 | °C | Including self-temperature rise | 3 | ||
| Transportation/storage temperature | -40 | 125 | °C | On board | 3 | ||
| Temperature rise at rated current | ΔT | 40 | Rated current 1A or more; applied allowed DC current | 3 | |||
| Impedance change after resistance to soldering heat | Z | -15 | 15 | % | Preheat 150 °C 60 s; solder Sn99.5%-Cu0.5% 260±5 °C; dip 10±1 s | 3 | |
| Inductance change after resistance to soldering heat | Ls | -10 | 10 | % | Preheat 150 °C 60 s; solder Sn99.5%-Cu0.5% 260±5 °C; dip 10±1 s | 3 | |
| DC resistance change after resistance to soldering heat | RDC | -15 | 15 | % | Preheat 150 °C 60 s; solder 260±5 °C; dip 10±1 s; also must not exceed specification value | 3 | |
| Impedance change after bending | Z | -10 | 10 | % | Size 0805 or larger; FR4 40x100x1.2 mm; bending depth 1.2 mm; 10 s | 3 | |
| Inductance change after bending | Ls | -10 | 10 | % | Size 0805 or larger; FR4 40x100x1.2 mm; bending depth 1.2 mm; 10 s | 3 | |
| Impedance change after vibration | Z | -15 | 15 | % | 10-2K-10 Hz, 20 min, 12 h total, total amplitude 1.52 mm | 3 | |
| Impedance change after shock | Z | -15 | 15 | % | SMD: 1500 g peak, 0.5 ms half-sine | 3 | |
| Impedance change after life test | Z | -15 | 15 | % | 125 °C (bead), rated current, 1000±12 h | 4 | |
| Inductance change after life test | Ls | -10 | 10 | % | 125 °C (bead), rated current, 1000±12 h | 4 | |
| DC resistance change after life test | RDC | -15 | 15 | % | 125 °C (bead), rated current, 1000±12 h | 4 | |
| Impedance change after load humidity | Z | -15 | 15 | % | 85±2 °C, 85±2% R.H., 1000 h min, 100% rated current | 4 | |
| Impedance change after thermal shock | Z | -15 | 15 | % | 500 cycles, -40±2 °C 30 min to +105±2 °C 30 min | 4 | |
| Inductance change after thermal shock | Ls | -10 | 10 | % | 500 cycles, -40±2 °C 30 min to +105±2 °C 30 min | 4 | |
| DC resistance change after thermal shock | RDC | -15 | 15 | % | 500 cycles, -40±2 °C 30 min to +105±2 °C 30 min | 4 | |
| Reflow peak temperature | TP | 260 | °C | Lead-free reflow, 40 s max; reflow times 3 max | 5 | ||
| Iron soldering tip temperature | 350 | °C | Iron soldering, tip diameter 1.0 mm max, 4~5 s, 1 time max | 5 | |||
| Storage temperature (component level) | 40 | °C | Less than 40 °C and 60% RH to maintain solderability; use within 12 months | 6 |
CAD (KiCad official)
- Symbol:
HCB2012KF-102T10 - Footprint:
Inductor_SMD:L_0805_2012Metric - 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files:
hcb2012kf-102t10-etched.step/hcb2012kf-102t10-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hcb2012kf-102t10.step/hcb2012kf-102t10.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TAI TECH datasheet (20 pp, sha256
1246405cf3752126, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HCB2012KF-102T10
**TAI TECH** · Ferrite Beads · 0805
HCB2012KF-102T10 from TAI TECH, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised inductor or ferrite bead; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised inductor or ferrite bead; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TAI TECH |
| Package | 0805 |
| Category | Filters |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Impedance (nominal, 100 MHz test) | Z | | 1000 | | Ω | Test frequency 100M Hz, 60 mV (printed as 60mV/100M) | 2 |
| Impedance tolerance | Z | -25 | | 25 | % | Printed as 1000±25% | 2 |
| DC resistance | RDC | | | 0.2 | Ω | | 2 |
| Rated current | | | | 1000 | mA | Based on temperature rise test | 2 |
| Operating temperature | | -40 | | 125 | °C | Including self-temperature rise | 3 |
| Transportation/storage temperature | | -40 | | 125 | °C | On board | 3 |
| Temperature rise at rated current | ΔT | | | 40 | | Rated current 1A or more; applied allowed DC current | 3 |
| Impedance change after resistance to soldering heat | Z | -15 | | 15 | % | Preheat 150 °C 60 s; solder Sn99.5%-Cu0.5% 260±5 °C; dip 10±1 s | 3 |
| Inductance change after resistance to soldering heat | Ls | -10 | | 10 | % | Preheat 150 °C 60 s; solder Sn99.5%-Cu0.5% 260±5 °C; dip 10±1 s | 3 |
| DC resistance change after resistance to soldering heat | RDC | -15 | | 15 | % | Preheat 150 °C 60 s; solder 260±5 °C; dip 10±1 s; also must not exceed specification value | 3 |
| Impedance change after bending | Z | -10 | | 10 | % | Size 0805 or larger; FR4 40x100x1.2 mm; bending depth 1.2 mm; 10 s | 3 |
| Inductance change after bending | Ls | -10 | | 10 | % | Size 0805 or larger; FR4 40x100x1.2 mm; bending depth 1.2 mm; 10 s | 3 |
| Impedance change after vibration | Z | -15 | | 15 | % | 10-2K-10 Hz, 20 min, 12 h total, total amplitude 1.52 mm | 3 |
| Impedance change after shock | Z | -15 | | 15 | % | SMD: 1500 g peak, 0.5 ms half-sine | 3 |
| Impedance change after life test | Z | -15 | | 15 | % | 125 °C (bead), rated current, 1000±12 h | 4 |
| Inductance change after life test | Ls | -10 | | 10 | % | 125 °C (bead), rated current, 1000±12 h | 4 |
| DC resistance change after life test | RDC | -15 | | 15 | % | 125 °C (bead), rated current, 1000±12 h | 4 |
| Impedance change after load humidity | Z | -15 | | 15 | % | 85±2 °C, 85±2% R.H., 1000 h min, 100% rated current | 4 |
| Impedance change after thermal shock | Z | -15 | | 15 | % | 500 cycles, -40±2 °C 30 min to +105±2 °C 30 min | 4 |
| Inductance change after thermal shock | Ls | -10 | | 10 | % | 500 cycles, -40±2 °C 30 min to +105±2 °C 30 min | 4 |
| DC resistance change after thermal shock | RDC | -15 | | 15 | % | 500 cycles, -40±2 °C 30 min to +105±2 °C 30 min | 4 |
| Reflow peak temperature | TP | | | 260 | °C | Lead-free reflow, 40 s max; reflow times 3 max | 5 |
| Iron soldering tip temperature | | | | 350 | °C | Iron soldering, tip diameter 1.0 mm max, 4~5 s, 1 time max | 5 |
| Storage temperature (component level) | | | | 40 | °C | Less than 40 °C and 60% RH to maintain solderability; use within 12 months | 6 |
## CAD (KiCad official)
- Symbol: `HCB2012KF-102T10`
- Footprint: `Inductor_SMD:L_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `hcb2012kf-102t10-etched.step` / `hcb2012kf-102t10-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hcb2012kf-102t10.step` / `hcb2012kf-102t10.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TAI TECH datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588911982887624704) (20 pp, sha256 `1246405cf3752126`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hcb2012kf-102t10-datasheet.pdf)