# HCB1608KF-070T50

**TAI TECH** · Ferrite Beads · 0603

HCB1608KF-070T50 from TAI TECH, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised inductor or ferrite bead; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised inductor or ferrite bead; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TAI TECH |
| Package | 0603 |
| Category | Filters |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Impedance tolerance |  | -25 |  | 25 | % |  | 1 |
| DC resistance | RDC |  |  | 0.02 | Ω |  | 1 |
| Rated current |  |  |  | 5000 | mA | Based on temperature rise test | 1 |
| Operating temperature |  | -55 |  | 125 | ℃ | Including self-temperature rise | 1 |
| Storage temperature |  | -55 |  | 125 | ℃ | On board | 2 |
| Temperature rise at rated current | ΔT |  |  | 20 | ℃ | Rated current < 1 A | 2 |
| Temperature rise at rated current | ΔT |  |  | 40 | ℃ | Rated current ≥ 1 A | 2 |
| Life test impedance change | Z | -15 |  | 15 | % | 125±2℃, rated current, 1000±12 hrs | 2 |
| Life test RDC change | RDC | -15 |  | 15 | % | 125±2℃, rated current, 1000±12 hrs; not to exceed spec value | 2 |
| Thermal shock impedance change | Z | -15 |  | 15 | % | -55 to 125℃, 500 cycles | 2 |
| Thermal shock RDC change | RDC | -15 |  | 15 | % | -55 to 125℃, 500 cycles; not to exceed spec value | 2 |
| Vibration impedance change | Z | -15 |  | 15 | % | 10 Hz to 2 kHz to 10 Hz, 20 min, 12 h total | 2 |
| Vibration RDC change | RDC | -15 |  | 15 | % | 10 Hz to 2 kHz to 10 Hz, 20 min, 12 h total; not to exceed spec value | 2 |
| Bending impedance change | Z | -10 |  | 10 | % | FR4 board bending, 10 s | 2 |
| Bending RDC change | RDC | -15 |  | 15 | % | FR4 board bending, 10 s; not to exceed spec value | 2 |
| Shock impedance change | Z | -10 |  | 10 | % | Half-sine 11 ms, 50 g peak | 2 |
| Shock RDC change | RDC | -15 |  | 15 | % | Half-sine 11 ms, 50 g peak; not to exceed spec value | 2 |
| Resistance to soldering heat impedance change | Z | -15 |  | 15 | % | 1 heat cycle | 3 |
| Resistance to soldering heat RDC change | RDC | -15 |  | 15 | % | 1 heat cycle; not to exceed spec value | 3 |
| Terminal strength impedance change | Z | -15 |  | 15 | % | Side force 1 kg for >0805 size, 60 +1 s | 3 |
| Terminal strength RDC change | RDC | -15 |  | 15 | % | Side force 1 kg for >0805 size, 60 +1 s; not to exceed spec value | 3 |
| Reflow peak classification temperature | Tc |  |  | 260 | ℃ | Package thickness <1.6 mm, volume <350 mm3, PB-free reflow | 4 |
| Impedance | Z |  | 7 |  | Ω | Test 60mV/100M | 1 |

## CAD (KiCad official)

- Symbol: `HCB1608KF-070T50`
- Footprint: `Inductor_SMD:L_0603_1608Metric`
- 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files: `hcb1608kf-070t50-etched.step` / `hcb1608kf-070t50-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hcb1608kf-070t50.step` / `hcb1608kf-070t50.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TAI TECH datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590913164421263360) (6 pp, sha256 `78f712debd468cb2`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hcb1608kf-070t50-datasheet.pdf)