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Contents

README

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HC3M0021120K

HXY MOSFET · Silicon Carbide Field Effect Transistor (MOSFET) · TO-247-4L

HC3M0021120K from HXY MOSFET, in a TO-247-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Drain passive Drain of the SiC MOSFET, rated VDS max 1200 V (VGS = 0 V, ID = 100 µA) with continuous drain current of 100 A at VGS = 15 V and TC = 25 °C; the TAB is also the drain.
2 Power Source passive Main power source terminal, separate from the driver source pin; the datasheet gives no separate electrical limit for this pin.
3 Driver Source passive Separate driver source pin provided by the optimized package, which the datasheet associates with reduced switching losses and minimized gate ringing; the datasheet gives no separate electrical limit for this pin.
4 Gate input Gate input with static gate-source voltage limits of -4/+15 V and dynamic gate-source voltage limits of -8/+19 V (AC, f > 1 Hz).

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package TO-247-4L
Category Silicon Carbide (SiC) Devices
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDSmax 1200 V VGS = 0 V, ID = 100 μA 1
Gate-Source Voltage (dynamic) VGSmax -8 19 V AC (f >1 Hz) 1
Gate-Source Voltage (static) VGSop -4 15 V Static 1
Continuous Drain Current ID 100 A VGS = 15 V, TC = 25˚C 1
Continuous Drain Current ID 74 A VGS = 15 V, TC = 100˚C 1
Pulsed Drain Current ID(pulse) 200 A Pulse width tP limited by Tjmax 1
Power Dissipation PD 469 W TC=25˚C, TJ = 175 ˚C 1
Operating Junction and Storage Temperature TJ, Tstg -40 175 ˚C 1
Solder Temperature TL 260 ˚C 1.6mm (0.063”) from case for 10s 1
Gate Threshold Voltage VGS(th) 1.8 2.5 3.6 V VDS = VGS, ID = 17.7 mA 2
Zero Gate Voltage Drain Current IDSS 50 μA VDS = 1200 V, VGS = 0 V 2
Gate-Source Leakage Current IGSS 250 nA VGS = 15 V, VDS = 0 V 2
Drain-Source On-State Resistance RDS(on) 28.8 mΩ VGS = 15 V, ID = 50 A 2
Thermal Resistance from Junction to Case RθJC 0.32 °C/W Fig. 21 3
Thermal Resistance From Junction to Ambient RθJA 40 °C/W 3

CAD (KiCad official)

  • Symbol: HC3M0021120K
  • Footprint: Package_TO_SOT_THT:TO-247-4_Vertical
  • 3D model: TO-247-4L (KiCad packages3D, STEP)
  • 3D model files: hc3m0021120k-etched.step / hc3m0021120k-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hc3m0021120k.step / hc3m0021120k.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (10 pp, sha256 86bac69a701a9ef2, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF