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Contents

README

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HC1M40120J

HXY MOSFET · Silicon Carbide Field Effect Transistor (MOSFET) · TO-263-7L

HC1M40120J from HXY MOSFET, in a TO-263-7L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate pin; gate-source voltage absolute maximum is -8/+22 V, with recommended drive of -4/+18 V.
2 KS passive Kelvin source (separate driver source) pin used as the gate-drive return to reduce switching losses and gate ringing.
3 S passive Power source pin, tied together with pins 4, 5, 6 and 7.
4 S passive Power source pin, tied together with pins 3, 5, 6 and 7.
5 S passive Power source pin, tied together with pins 3, 4, 6 and 7.
6 S passive Power source pin, tied together with pins 3, 4, 5 and 7.
7 S passive Power source pin, tied together with pins 3, 4, 5 and 6.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package TO-263-7L
Category Silicon Carbide (SiC) Devices
Pins 7

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS 1200 V TC = 25°C 1
Continuous drain current ID 65 A TC = 25°C, VGS = 15V 1
Continuous drain current ID 46 A TC = 100°C, VGS = 15V 1
Pulsed drain current ID pulse 120 A TC = 25°C, tp limited by Tjmax 1
Gate-Source voltage VGS -4 18 V 1
Gate-Source voltage (absolute maximum values) VGSmax -8 22 V 1
Power dissipation Ptot 326 W TC = 25°C 1
Operating junction and storage temperature Tj, Tstg -40 175 °C 1
Thermal resistance, junction-case RthJC 0.46 °C/W 2
Thermal resistance, junction-ambient RthJA 40 °C/W 2
Drain-source breakdown voltage BVDSS 1200 V VGS=0V, ID=100uA 2
Gate threshold voltage VGS(th) 2.2 3 4 V VDS=VGS, ID=10mA 2
Drain-source on-state resistance RDS(on) 32 40 mΩ VGS=18V, ID=33.3A, TJ=25°C 2
Drain-source on-state resistance RDS(on) 40 52 mΩ VGS=15V, ID=33.3A, TJ=25°C 2
Gate-source leakage current IGSS 100 nA VGS=18V, VDS=0V 2
Drain-source on-state resistance RDS(on) 59 mΩ VGS=18V, ID=33.3A, TJ=175°C 2
Drain-source on-state resistance RDS(on) 62 mΩ VGS=15V, ID=33.3A, TJ=175°C 2
Transconductance gfs 5 S VDS=20V, ID=33.3A 2
Zero gate voltage drain current IDSS 1 μA VDS=1200V, VGS=0V, TC=25°C 2

CAD (KiCad official)

  • Symbol: HC1M40120J
  • Footprint: Package_TO_SOT_SMD:TO-263-7_TabPin4
  • 3D model: TO-263-7L (KiCad packages3D, STEP)
  • 3D model files: hc1m40120j-etched.step / hc1m40120j-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hc1m40120j.step / hc1m40120j.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (9 pp, sha256 4e9e539c5c9041fa, retrieved 2026-10-26, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF