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HAT3004R-VB

Public Made by Adom

by adom

VBsemi Elec MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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HAT3004R-VB

VBsemi Elec · MOSFETs · SO-8

HAT3004R-VB from VBsemi Elec, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of the N-channel MOSFET (channel 1), rated VDS 30 V and ID up to 8 A (package limited).
2 G1 input Gate of the N-channel MOSFET (channel 1), with a maximum gate-source voltage of ±20 V.
3 S2 passive Source of the P-channel MOSFET (channel 2), rated VDS -30 V and ID up to -8 A (package limited).
4 G2 input Gate of the P-channel MOSFET (channel 2), with a maximum gate-source voltage of ±20 V.
5 D2 passive Drain of the P-channel MOSFET (channel 2), tied internally to pins 6; pulsed drain current up to -40 A.
6 D2 passive Drain of the P-channel MOSFET (channel 2), tied internally to pin 5; pulsed drain current up to -40 A.
7 D1 passive Drain of the N-channel MOSFET (channel 1), tied internally to pin 8; pulsed drain current up to 40 A.
8 D1 passive Drain of the N-channel MOSFET (channel 1), tied internally to pin 7; pulsed drain current up to 40 A.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SO-8
Category Triode/MOS Tube/Transistor
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage N-Ch VDS 30 V TA = 25 °C 1
Drain-Source Voltage P-Ch VDS -30 V TA = 25 °C 1
Gate-Source Voltage N-Ch VGS -20 20 V TA = 25 °C 1
Gate-Source Voltage P-Ch VGS -20 20 V TA = 25 °C 1
Continuous Drain Current N-Ch ID 8 A TJ = 150 °C, TC = 25 °C, package limited 1
Continuous Drain Current P-Ch ID -8 A TJ = 150 °C, TC = 25 °C, package limited 1
Continuous Drain Current N-Ch ID 6.8 A TJ = 150 °C, TC = 70 °C 1
Continuous Drain Current P-Ch ID -6.8 A TJ = 150 °C, TC = 70 °C 1
Continuous Drain Current P-Ch ID -6.6 A TA = 25 °C, b, c 1
Continuous Drain Current N-Ch ID 5.4 A TA = 70 °C, b, c 1
Continuous Drain Current P-Ch ID -5.3 A TA = 70 °C, b, c 1
Pulsed Drain Current N-Ch IDM 40 A 10 µs pulse width 1
Pulsed Drain Current P-Ch IDM -40 A 10 µs pulse width 1
Source-Drain Diode Current N-Ch IS 2.6 A TC = 25 °C 1
Source-Drain Diode Current P-Ch IS -2.6 A TC = 25 °C 1
Source-Drain Diode Current N-Ch IS 1.6 A TA = 25 °C, b, c 1
Source-Drain Diode Current P-Ch IS -1.6 A TA = 25 °C, b, c 1
Pulsed Source-Drain Current N-Ch ISM 40 A 1
Pulsed Source-Drain Current P-Ch ISM -40 A 1
Single Pulse Avalanche Current N-Ch IAS 10 A L = 0.1 mH 1
Single Pulse Avalanche Current P-Ch IAS 20 A L = 0.1 mH 1
Maximum Power Dissipation N-Ch PD 3.1 W TC = 25 °C 1
Maximum Power Dissipation P-Ch PD 3.2 W TC = 25 °C 1
Maximum Power Dissipation N-Ch PD 2 W TA = 25 °C, b, c 1
Maximum Power Dissipation P-Ch PD 2 W TA = 25 °C, b, c 1
Maximum Power Dissipation N-Ch PD 1.28 W TA = 70 °C, b, c 1
Maximum Power Dissipation P-Ch PD 1.28 W TA = 70 °C, b, c 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Junction-to-Ambient Thermal Resistance N-Ch RthJA 50 62.5 °C/W t ≤ 10 s, b, d 1
Junction-to-Ambient Thermal Resistance P-Ch RthJA 47 62.5 °C/W t ≤ 10 s, b, d 1
Junction-to-Foot (Drain) Thermal Resistance N-Ch RthJF 30 40 °C/W Steady State 1
Junction-to-Foot (Drain) Thermal Resistance P-Ch RthJF 29 38 °C/W Steady State 1
Drain-Source Breakdown Voltage N-Ch VDS 30 V VGS = 0 V, ID = 250 µA 2
Drain-Source Breakdown Voltage P-Ch VDS -30 V VGS = 0 V, ID = - 250 µA 2
Gate Threshold Voltage N-Ch VGS(th) 1 2 V VDS = VGS, ID = 250 µA 2
Gate Threshold Voltage P-Ch VGS(th) -2 -1 V VDS = VGS, ID = - 250 µA 2
Gate-Body Leakage N-Ch IGSS -100 100 nA VDS = 0 V, VGS = ± 12 V 2
Gate-Body Leakage P-Ch IGSS -100 100 nA VDS = 0 V, VGS = ± 12 V 2
Zero Gate Voltage Drain Current N-Ch IDSS 1 µA VDS = 30 V, VGS = 0 V 2
Zero Gate Voltage Drain Current P-Ch IDSS -1 µA VDS = - 30 V, VGS = 0 V 2
Zero Gate Voltage Drain Current N-Ch IDSS 10 µA VDS = 30 V, VGS = 0 V, TJ = 55 °C 2
Zero Gate Voltage Drain Current P-Ch IDSS -10 µA VDS = - 30 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current N-Ch ID(on) 20 A VDS = 5 V, VGS = 10 V 2
On-State Drain Current P-Ch ID(on) -20 A VDS = - 5 V, VGS = - 10 V 2
Body Diode Voltage N-Ch VSD 0.81 1.2 V IS = 5.4 A 3
Body Diode Voltage P-Ch VSD -0.77 -1.2 V IS = - 2 A 3
Drain-Source On-State Resistance P-Ch RDS(on) 0.04 Ω VGS = - 10 V, ID = - 8 A 2
Drain-Source On-State Resistance N-Ch RDS(on) 0.02 Ω VGS = 8 V, ID = 6.7 A 2
Drain-Source On-State Resistance P-Ch RDS(on) 0.044 Ω VGS = - 8 V, ID = - 6.5 A 2
Drain-Source On-State Resistance N-Ch RDS(on) 0.024 Ω VGS = 4.5 V, ID = 6.6 A 2
Drain-Source On-State Resistance P-Ch RDS(on) 0.05 Ω VGS = - 4.5 V, ID = - 5 A 2
Forward Transconductance N-Ch gfs 27 S VDS = 15 V, ID = 6.8 A 2
Forward Transconductance P-Ch gfs 25 S VDS = - 15 V, ID = - 6.7 A 2
Turn-On Delay Time N-Ch td(on) 4 8 ns VDD = 20 V, RL = 3.7 Ω, ID ≅ 5.4 A, VGEN = 10 V, Rg = 1 Ω 3
Turn-On Delay Time P-Ch td(on) 10 16 ns VDD = - 20 V, RL = 2 Ω, ID ≅ - 10 A, VGEN = - 10 V, Rg = 1 Ω 3
Rise Time P-Ch tr 9 15 ns VDD = - 20 V, RL = 2 Ω, ID ≅ - 10 A, VGEN = - 10 V, Rg = 1 Ω 3
Fall Time N-Ch tf 5 9 ns VDD = 20 V, RL = 3.7 Ω, ID ≅ 5.4 A, VGEN = 10 V, Rg = 1 Ω 3
Fall Time P-Ch tf 10 16 ns VDD = - 20 V, RL = 2 Ω, ID ≅ - 10 A, VGEN = - 10 V, Rg = 1 Ω 3
Turn-On Delay Time P-Ch td(on) 26 35 ns VDD = - 20 V, RL = 2 Ω, ID ≅ - 10 A, VGEN = - 4.5 V, Rg = 1 Ω 3
Body Diode Reverse Recovery Time P-Ch trr 31 57 ns IF = - 5 A, dI/dt = - 100 A/µs, TJ = 25 °C 3
Body Diode Reverse Recovery Charge N-Ch Qrr 10 17 nC IF = 5 A, dI/dt = 100 A/µs, TJ = 25 °C 3
Body Diode Reverse Recovery Charge P-Ch Qrr 29 47 nC IF = - 5 A, dI/dt = - 100 A/µs, TJ = 25 °C 3

CAD (KiCad official)

  • Symbol: HAT3004R-VB
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: hat3004r-vb-etched.step / hat3004r-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hat3004r-vb.step / hat3004r-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (14 pp, sha256 656a9afa498b9528, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF