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HAOZ8S502BDS-03

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HXY MOSFET Electrostatic And Surge Protection (TVS/ESD), DFN1006-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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HAOZ8S502BDS-03

HXY MOSFET · Electrostatic And Surge Protection (TVS/ESD) · DFN1006-2L

HAOZ8S502BDS-03 from HXY MOSFET, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One terminal of the bi-directional ESD protection diode, connected to the protected line (VRWM 5 V max, IR 0.05 µA max, VBR 6.5 V min at 1 mA).
2 2 passive Other terminal of the bi-directional ESD protection diode, connected to the protected line or ground return (VRWM 5 V max, IR 0.05 µA max, VBR 6.5 V min at 1 mA).

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package DFN1006-2L
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse working voltage VRWM 3.3 V 2
Breakdown voltage VBR 5 V @ IT = 1.0 mA, Note 1 2
Reverse leakage current IR 0.05 µA @ VRWM 2
Clamping voltage at 1 A VC 7 V @ IPP = 1 A, Note 2 2
Clamping voltage at max IPP VC 11 V @ MAX IPP, Note 2 2
Peak pulse current IPP 9 A Note 2 2
Peak pulse power PPK 100 W Note 2 2
Peak pulse power PPP 100 W tp = 8/20 µs 1
Maximum lead temperature for soldering TL 260 °C during 10s 1
Storage temperature range Tstg -55 150 °C 1
Operating temperature range Top -55 150 °C 1
Maximum junction temperature Tj 150 °C 1
ESD air discharge -30 30 KV IEC61000-4-2 1
ESD contact discharge -30 30 KV IEC61000-4-2 1
EFT 40 A IEC61000-4-4 1
Capacitance C 15 pF 2
Dynamic resistance RDYN 0.2 Ω @ tp = 100 ns (TLP) 2

CAD (KiCad official)

  • Symbol: HAOZ8S502BDS-03
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: haoz8s502bds-03-etched.step / haoz8s502bds-03-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); haoz8s502bds-03.step / haoz8s502bds-03.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (4 pp, sha256 a2f6ff4fe96a75e2, retrieved 2026-10-26, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF