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Contents

README

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HA9P5127-5Z

RENESAS · Operational Amplifier · SOIC-8

HA9P5127-5Z from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BAL passive Offset balance terminal that pairs with pin 8 for an external 10k offset-adjust trimmer (typical range ±4mV with RT = 10kΩ).
2 -IN input Inverting input; differential input voltage is limited to 0.7V, and above that the input current must be limited to 25mA.
3 +IN input Non-inverting input; differential input voltage is limited to 0.7V, and above that the input current must be limited to 25mA.
4 V- power_in Negative supply terminal, also the substrate potential; supply between V+ and V- is rated 44V maximum with operation from ±5V to ±15V.
5 NC unconnected No internal connection.
6 OUT output Amplifier output with full short circuit protection, typical output current 25mA and swing of ±13.5V to ±13.8V into 2kΩ.
7 V+ power_in Positive supply terminal; supply between V+ and V- is rated 44V maximum with operation from ±5V to ±15V.
8 BAL passive Offset balance terminal that pairs with pin 1 for an external 10k offset-adjust trimmer whose wiper goes to V+.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Operational Amplifier/Comparator
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage between V+ and V- 44 V 2
Differential input voltage 0.7 V Note 7 2
Maximum junction temperature (plastic) 150 °C Plastic package 2
Storage temperature range -65 150 °C 2
Operating temperature range 0 75 °C HA5127/27A-5 2
Thermal resistance junction-ambient θJA 157 °C/W SOIC package, typical, Note 6 2
Offset Voltage (Full) VOS 70 300 μV VSUPPLY=±15V, Full temp 2
Average Offset Voltage Drift 0.4 1.8 μV/°C Full 2
Bias Current (25°C) IB 15 80 nA 25°C 2
Bias Current (Full) IB 35 150 nA Full 2
Offset Current (25°C) IOS 12 75 nA 25°C 2
Offset Current (Full) IOS 30 135 nA Full 2
Common Mode Range 10.3 11.5 V Full (printed ±10.3 / ±11.5) 2
Differential Input Resistance 0.8 4 MΩ 25°C, Note 8 2
Input Noise Voltage 0.09 0.25 μVP-P 0.1Hz to 10Hz, 25°C 2
Input Noise Voltage Density 3.8 8 nV/√Hz f = 10Hz, 25°C 2
Input Noise Voltage Density 3.3 4.5 nV/√Hz f = 100Hz 2
Input Noise Voltage Density 3.2 3.8 nV/√Hz f = 1000Hz 2
Input Noise Current Density 0.4 0.6 pA/√Hz f = 1000Hz 2
Large Signal Voltage Gain (25°C) AVOL 700 1500 V/mV VOUT = ±10V, RL = 2kΩ, 25°C 2
Large Signal Voltage Gain (Full) AVOL 300 800 V/mV VOUT = ±10V, RL = 2kΩ, Full 2
Common Mode Rejection Ratio CMRR 100 120 dB VCM = ±10V, Full 2
Minimum Stable Gain 1 V/V 25°C 2
Unity-Gain-Bandwidth 5 8.5 MHz 25°C 2
Output Voltage Swing VOUT 10 11.5 V RL = 600Ω, 25°C (printed ±) 2
Output Voltage Swing VOUT 11.5 13.5 V RL = 2kΩ, Full (printed ±) 2
Full Power Bandwidth FPBW 111 160 kHz 25°C, Note 10 2
Output Current 16.5 25 mA 25°C 2
Rise Time 150 ns 25°C, Note 11 3
Slew Rate 7 10 V/μs VOUT = 10V, 25°C 3
Overshoot 20 40 % 25°C, Note 11 3
Supply Current (Full) 4 mA Full 3
Power Supply Rejection Ratio PSRR 16 51 μV/V VS = ±4.5V to ±18V, Full 3
Offset Voltage (25°C) VOS 30 μV 25°C 2
Input Noise Current Density 1.7 pA/√Hz f = 10Hz, 25°C 2
Input Noise Current Density 1 pA/√Hz f = 100Hz 2
Output Resistance 70 Ω Open Loop, 25°C 2
Settling Time 1.5 μs 25°C, Note 12 3
Supply Current (25°C) 3.5 mA 25°C 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension 12

CAD (KiCad official)

  • Symbol: HA9P5127-5Z
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ha9p5127-5z-etched.step / ha9p5127-5z-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ha9p5127-5z.step / ha9p5127-5z.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (12 pp, sha256 a071a72513c8f5e7, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF