# H8VHD3B

**hongjiacheng** · ESD And Surge Protection (TVS/ESD) · SOD-323

H8VHD3B from hongjiacheng, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Terminal K of the bi-directional ESD diode, clamping to 13V max at 1A and 25V max at 20A (8/20µs) with 8V max reverse working voltage. |
| 2 | A | passive | Terminal A of the bi-directional ESD diode, interchangeable with K, rated for ±30kV IEC 61000-4-2 air and contact discharge and 20A 8/20µs peak pulse current. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | hongjiacheng |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| ESD per IEC 61000-4-2 (Air) | VESD | -30 |  | 30 | kV | ESD per IEC 61000-4-2 (Air) | 1 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 |  | 30 | kV | ESD per IEC 61000-4-2 (Contact) | 1 |
| Peak Pulse Power | PPP |  |  | 500 | W | tp = 8/20 µs | 1 |
| Rated Peak Pulse Current | IPP |  |  | 20 | A | tp = 8/20 µs | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 125 | ℃ |  | 1 |
| Storage Temperature Range (printed as Operating Junction Temperature Range) | TSTG | -55 |  | 150 | ℃ |  | 1 |
| Peak Reverse Working Voltage | VRWM |  |  | 8 | V | Ta=25℃ | 2 |
| Breakdown Voltage | VBR | 8.5 |  | 11.5 | V | IR=1mA,Ta=25℃ | 2 |
| Reverse Leakage Current | IR |  |  | 0.1 | μA | VR=8V,Ta=25℃ | 2 |
| Clamping Voltage | VC |  |  | 13 | V | IPP=1A, tp=8/20μs | 2 |
| Clamping Voltage | VC |  |  | 25 | V | IPP=20A,tp=8/20μs | 2 |
| Junction Capacitance | CJ |  |  | 120 | pF | VR=0V,f=1MHz | 2 |

## CAD (KiCad official)

- Symbol: `H8VHD3B`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `h8vhd3b-etched.step` / `h8vhd3b-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `h8vhd3b.step` / `h8vhd3b.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [hongjiacheng datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8756315119817375744) (3 pp, sha256 `8fca424a330a8482`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/h8vhd3b-datasheet.pdf)