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Contents

README

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H7651-30PR

Shanghai Siproin Microelectronics · Linear Voltage Regulators (LDO) · SOT-89

H7651-30PR from Shanghai Siproin Microelectronics, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VSS power_in Ground pin of the regulator; connect to system ground.
2 VIN power_in Supply input, rated -0.3V to 8.5V absolute maximum, with a 1uF input capacitor recommended.
3 VOUT power_out Regulated output (±2% accuracy, up to 1A with 1uF tantalum or 6.8uF ceramic output capacitor recommended).

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-89
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage accuracy Vout -2 2 % Vin=Vout+1V, 1.0mA≤Iout≤30mA, Ta=25℃ (Vout×0.98 to Vout×1.02) 4
Output Current Iout 1000 mA Vin-Vout=1V 4
Dropout Voltage Vdif 0.05 0.08 V 2.0 < Vout ≤ 3.0, Iout=80 mA 4
Line Regulation △Vout1/(Vin·Vout) 0.05 0.2 %/V 1.6V≤Vin≤8V, Iout=100mA 4
Load Regulation △Vout 12 30 mV Vin= Vout+1V, 1.0mA≤Iout≤100mA 4
Output voltage temperature coefficient △Vout/(Ta·Vout) -100 100 ppm/℃ Iout=30mA, 0℃≤Ta≤70℃ 4
Supply Current Iss1 2 5 uA 4
Input Voltage Vin 8.5 V 4
Thermal shutdown detection temperature TSD 160 ℃ Junction temperature 4
Thermal shutdown release temperature TSR 140 ℃ Junction temperature 4
Supply Voltage -0.3 8.5 V 3
Operating Temperature -40 85 ℃ 3
Storage Temperature -40 125 ℃ 3

CAD (KiCad official)

  • Symbol: H7651-30PR
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: h7651-30pr-etched.step / h7651-30pr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); h7651-30pr.step / h7651-30pr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (6 pp, sha256 0a8ae5124048726e, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF