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H7605-30MR

Shanghai Siproin Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23

H7605-30MR from Shanghai Siproin Microelectronics, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin, at the bottom-left of the SOT23-3 top view; connects to the VSS reference of the regulator.
2 VOUT power_out Regulated output voltage pin (1.2V to 5.0V in 0.1V steps, ±2% accuracy) delivering up to 300mA with fold-back current limiting.
3 VIN power_in Input supply pin at the top of the SOT23-3 top view; absolute maximum 10V, operating input up to 6V typical rating.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage accuracy (tolerance) Vout -2 2 % Vin=Vout+1V; 1.0mA≤Iout≤30mA 1
Load Regulation ΔVout/ΔIout 12 30 mV Vin= Vout+1V; 1.0mA≤Iout≤80mA 3
Line Regulation △Vout1/(Vin·Vout) 0.05 0.2 %/V 1.6V≤Vin≤6.5V; Iout=40mA 3
Supply Current Iss 1.5 2 uA 3
Input Voltage Vin 6 8 V 3
Low dropout Vdif 0.19 0.35 V Iout=100 mA; 2.8 ≤ Vout ≤ 5.0 V 3
Output voltage temperature coefficient △Vout/(Ta·Vout) -75 75 Ppm/℃ Iout=30mA; 0℃≤Ta≤70℃ 3
Output Current Iout 300 mA Vin-Vout=1V 3
Input Voltage (absolute maximum) VIN 10 V 2
Output Current (absolute maximum) IOUT 300 mA Footnote *: IOUT=Pd/(VIN-VOUT) 2
Power Dissipation SOT23-3 Pd 0.2 W SOT23-3 package 2
Operating Temperature Range Topr -40 85 ℃ 2
Storage Temperature Range Tstg -55 125 ℃ 2

CAD (KiCad official)

  • Symbol: H7605-30MR
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: h7605-30mr-etched.step / h7605-30mr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); h7605-30mr.step / h7605-30mr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (6 pp, sha256 363a66b804bb6b8a, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF