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H7540-1

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Shanghai Siproin Microelectronics Linear Voltage Regulators (LDO), SOT-89-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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H7540-1

Shanghai Siproin Microelectronics · Linear Voltage Regulators (LDO) · SOT-89-3

H7540-1 from Shanghai Siproin Microelectronics, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin, leftmost lead in the SOT89 top view and the return for the 4.0V output regulator.
2 VIN power_in Input supply pin, middle lead in the SOT89 top view; absolute maximum supply voltage is -0.3V to 18V and recommended input voltage is up to 15V.
3 VOUT power_out Regulated 4.0V output pin (±2%, 3.920V to 4.080V), rated for 150mA output current.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-89-3
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage VOUT 3.92 4 4.08 V VIN=6.0V, IOUT=10mA 6
Output Current IOUT 120 150 mA VIN=6.0V 6
Load Regulation ΔVOUT 60 150 mV VIN=6.0V, 1mA≤IOUT≤50mA 6
Current Consumption ISS 1.5 2 μA VIN=6.0V, No load 6
Input Voltage VIN 15 V 6
Voltage Drop VDIF 50 mV IOUT=1mA, ΔVOUT=2% 6
Line Regulation ΔVOUT/(ΔVIN×VOUT) 0.2 %/V 5V≤VIN≤16V, IOUT=1mA 6
Temperature Coefficient ΔVOUT/ΔTa 0.6 mV/℃ VIN=6.0V, IOUT=10mA, 0℃<Ta<70℃ (printed ±0.6) 6
Supply Voltage -0.3 18 V 2
Operating Temperature -40 85 ℃ 2
Storage Temperature -50 125 ℃ 2
Thermal Resistance Junction to Ambient θJA 200 ℃/W SOT89, no airflow, no heat sink 2
Power Dissipation PD 0.5 W SOT89, Ta=25℃ 2

CAD (KiCad official)

  • Symbol: H7540-1
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: h7540-1-etched.step / h7540-1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); h7540-1.step / h7540-1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (12 pp, sha256 68d89a2084487dc3, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF