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H7527-H#

Shanghai Siproin Microelectronics · Linear Voltage Regulators (LDO) · SOT-89-3

H7527-H# from Shanghai Siproin Microelectronics, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground connection.
2 VIN power_in Supply voltage input; the datasheet gives an input range of 4.75 V to 40 V at IOUT=10mA and an absolute maximum rating of -0.3 V to 45 V.
3 VOUT power_out Regulated output; the output voltage is specified as VOUT×0.98 to VOUT×1.02 at IOUT=10mA, with maximum output current of 100mA (Typ.).

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-89-3
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Range VIN 4.75 40 V IOUT=10mA 5
Quiescent Current IQ 4 6 µA VIN=7V, IOUT=0 5
Quiescent Current IQ 4.6 6.7 µA VIN=24V, IOUT=0 5
Quiescent Current IQ 5.4 8.2 µA VIN=40V, IOUT=0 5
Dropout Voltage VDROP 60 90 mV IOUT=10mA 5
Dropout Voltage VDROP 600 900 mV IOUT=100mA 5
Line Regulation △VLINE 0.02 0.03 %/V VIN=7~24V, VOUT=5V, IOUT=1mA 5
Line Regulation △VLINE 0.08 0.1 %/V VIN=7~45V, VOUT=5V, IOUT=1mA 5
Load Regulation △VLOAD 19 37 mV VIN=7V, IOUT=1~100mA 5
Temperature Coefficient ∆VO/∆T -0.5 0.5 mV/℃ 5
Output Noise Voltage eNO -100 100 µVRMS 10Hz to 100kHz, COUT=10 μF, IOUT=10mA 5
Supply Voltage Input VIN -0.3 45 V 4
Operating Temperature Tamb -40 85 ℃ 4
Storage Temperature Tstg -50 125 ℃ 4
Thermal Resistance (Junction to Ambient), SOT89 θJA 200 ℃/W Assume no ambient airflow, no heat sink 4
Power Dissipation, SOT89 PD 0.5 W Ta=25℃ 4

CAD (KiCad official)

  • Symbol: H7527-H#
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: h7527-h-etched.step / h7527-h-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); h7527-h.step / h7527-h.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (14 pp, sha256 28a6085ea69cb660, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF