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H7022A-1

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Shanghai Siproin Microelectronics Monitors & Reset Circuits, SOT-89-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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H7022A-1

Shanghai Siproin Microelectronics · Monitors & Reset Circuits · SOT-89-3

H7022A-1 from Shanghai Siproin Microelectronics, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT output Detector output that is Hi-Z when VDD is above VDET(+) and pulled to VSS when VDD is at or below VDET(-) (2.2V typical detection voltage, 2.156V to 2.244V); IOL min 0.5mA at VOUT=0.2V, VDD=2V.
2 VIN power_in Supply and voltage sense input, operating range 1.5V to 16V, absolute maximum -0.3V to 16V.
3 GND power_in Ground (VSS) reference pin for the voltage detector.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-89-3
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage accuracy (detection voltage tolerance) -2 2 % 1
Detection Voltage VDET 2.156 2.2 2.244 V Ta=25℃ 4
Hysteresis Width VHYS 0.02 0.05 0.1 VDET Ta=25℃ 4
Operating Voltage VDD 1.5 16 V Ta=25℃ 4
Output Sink Current IOL 0.5 1 mA 2V VOUT=0.2V, Ta=25℃ 4
Operating Current IDD 2 3 μA 8V No Load, Ta=25℃ 4
Detection Voltage Temperature Coefficient ΔVDET/ΔT -0.9 0.9 mV/℃ 0℃<Ta<70℃ 4
Supply Voltage -0.3 16 V 3
Operating Temperature -40 85 ℃ 3
Storage Temperature -50 125 ℃ 3
Thermal Resistance, Junction to Ambient (SOT89) θJA 200 ℃/W No ambient airflow, no heat sink 3
Power Dissipation (SOT89) PD 0.5 W Ta=25℃ 3

CAD (KiCad official)

  • Symbol: H7022A-1
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: h7022a-1-etched.step / h7022a-1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); h7022a-1.step / h7022a-1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (15 pp, sha256 47bd1a3a2d1e7049, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF