# H36VND3B

**hongjiacheng** · ESD And Surge Protection (TVS/ESD) · SOD-323

H36VND3B from hongjiacheng, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | hongjiacheng |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Reverse Working Voltage | VRWM |  |  | 36 | V | Ta=25℃ | 2 |
| Breakdown Voltage | VBR | 38.5 |  | 45 | V | IR=1.0mA,Ta=25℃ | 2 |
| Reverse Leakage Current | IR |  |  | 1 | μA | VR=36V,Ta=25℃ | 2 |
| Clamping Voltage | VC |  |  | 55 | V | IPP=1.0A, tp=8/20μs | 2 |
| Clamping Voltage | VC |  |  | 65 | V | IPP=5.0A,tp=8/20μs | 2 |
| Junction Capacitance | CJ |  |  | 20 | pF | VR=0V,f=1MHz | 2 |
| Electrostatic Discharge Voltage (Air) | VESD | -30 |  | 30 | KV | ESD per IEC 61000-4-2 (Air) | 1 |
| Electrostatic Discharge Voltage (Contact) | VESD | -30 |  | 30 | KV | ESD per IEC 61000-4-2 (Contact) | 1 |
| Peak Pulse Power | PPP |  |  | 325 | W | tp = 8/20 µs | 1 |
| Rated Peak Pulse Current | IPP |  |  | 5 | A | tp = 8/20 µs | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 125 | ℃ |  | 1 |
| Operating Junction Temperature Range (TSTG as printed) | TSTG | -55 |  | 150 | ℃ |  | 1 |

## CAD (KiCad official)

- Symbol: `H36VND3B`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `h36vnd3b-etched.step` / `h36vnd3b-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `h36vnd3b.step` / `h36vnd3b.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [hongjiacheng datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757895192995614720) (3 pp, sha256 `3be8b047a5f67c93`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/h36vnd3b-datasheet.pdf)