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GXTS04D-T&R
Public Made by Adomby adom
GXCAS Temperature Sensors, DFN-6-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownGXTS04D-T&R
GXCAS · Temperature Sensors · DFN-6-EP(2x2)
GXTS04D-T&R from GXCAS, in a DFN-6-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Supply pin for the sensor, with a supply voltage range of 1.6 V to 5.5 V and a maximum slew rate of 20 V/ms, decoupled with a 100 nF capacitor placed as close to the sensor as possible. |
| 2 | R | unconnected | Stated to have no electrical function; the datasheet recommends connecting this pin to VSS. |
| 3 | SCL | bidirectional | Serial clock for I2C communication, which the master must keep within 0 to 1 MHz; the sensor may pull this line low when clock stretching is enabled. |
| 4 | SDA | bidirectional | Serial data line for I2C transfers in and out of the sensor, requiring external pull-up resistors (e.g. 4.7 kΩ) and the microcontroller may only drive it low to avoid signal contention. |
| 5 | R | unconnected | Stated to have no electrical function; the datasheet recommends connecting this pin to VSS. |
| 6 | GND | power_in | Ground reference (VSS) for the sensor, to be decoupled together with VDD by a 100 nF capacitor placed as close to the sensor as possible. |
| 7 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GXCAS |
| Package | DFN-6-EP(2x2) |
| Category | Sensors |
| Pins | 7 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VDD | 1.6 | 3.3 | 5.5 | V | 3 | |
| Power-up/down level | VPOR | 1.6 | 2.3 | 5.5 | V | 3 | |
| Slew rate change of the supply voltage | VDD,slew | 20 | V/ms | 3 | |||
| Supply current, idle state (single shot mode) | IDD | 0.15 | 2 | µA | Idle state (single shot mode), not performing a measurement during single shot mode | 3 | |
| Supply current, idle state (periodic data acquisition mode) | IDD | 45 | 70 | µA | Idle state (periodic data acquisition mode), not performing a measurement during periodic data acquisition mode | 3 | |
| Current consumption while sensor is measuring | IDD | 600 | 1200 | µA | While sensor is measuring | 3 | |
| Current consumption, average (one measurement per second, lowest repeatability, single shot mode) | IDD | 2 | 5 | µA | Operation with one measurement per second at lowest repeatability, single shot mode | 3 | |
| Alert output driving strength | IOH | 0.8 | 1.5 | 2.1 | mA | See also section 3.5 | 3 |
| Power-up time | tPU | 180 | 240 | µs | After hard reset, VDD ≥ VPOR | 3 | |
| Soft reset time | tSR | 180 | 240 | µs | After soft reset | 3 | |
| Measurement duration, average, normal mode | tMEAS | 10.8 | 12.1 | ms | Average, normal mode | 3 | |
| Measurement duration, average, low power mode | tMEAS | 1 | 1.5 | ms | Average, low power mode | 3 | |
| Response time | 1 | s | 63% | 2 | |||
| Long term drift | 0.02 | ℃/y | 2 | ||||
| Specified range (temperature sensor) | -40 | 125 | °C | 2 | |||
| Supply voltage | VDD | -0.3 | 6 | V | 4 | ||
| Max voltage on pins | -0.3 | V | Upper limit printed as VDD+0.3 V | 4 | |||
| Input current on any pin | -100 | 100 | mA | 4 | |||
| Operating temperature range | -40 | 125 | °C | 4 | |||
| Storage temperature range | -40 | 150 | °C | 4 | |||
| ESD HBM (human body model) | 4 | kV | Sensor in application configuration | 4 | |||
| ESD CDM (charge device model) | 750 | V | According to JEDEC JS-002 | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | gold | The sensor chip is made of silicon and is mounted to a lead frame. The latter is made of Cu plated with Ni/Pd/Au. Chip | 7 |
CAD (KiCad official)
- Symbol:
GXTS04D-T&R - Footprint:
Package_DFN_QFN:DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm - 3D model: DFN-6-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
gxts04d-t-r-etched.step/gxts04d-t-r-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);gxts04d-t-r.step/gxts04d-t-r.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GXCAS datasheet (9 pp, sha256
fbf01ee22f35192b, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).