component
GX817B-S
Public Made by Adomby adom
GUOXIN JIAPIN SEMICONDUCTOR Transistor, Photovoltaic Output Optoisolators, SOP-4-2.54mm. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownGX817B-S
GUOXIN JIAPIN SEMICONDUCTOR · Transistor, Photovoltaic Output Optoisolators · SOP-4-2.54mm
GX817B-S from GUOXIN JIAPIN SEMICONDUCTOR, in a SOP-4-2.54mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode | passive | Anode of the infrared emitting diode; forward current max 60 mA, reverse voltage max 6 V. |
| 2 | Cathode | passive | Cathode of the infrared emitting diode; input side, shorted with pin 1 for the 5000 Vrms isolation test. |
| 3 | Emitter | passive | Emitter of the output phototransistor; emitter-collector voltage max 6 V. |
| 4 | Collector | passive | Collector of the output phototransistor; collector-emitter voltage max 35 V and collector current max 50 mA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GUOXIN JIAPIN SEMICONDUCTOR |
| Package | SOP-4-2.54mm |
| Category | Optoisolators |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward current | IF | 60 | mA | 2 | |||
| Peak forward current | IFP | 1 | A | 1us, pulse | 2 | ||
| Reverse voltage | VR | 6 | V | 2 | |||
| Power dissipation (input) | PD | 100 | mW | 2 | |||
| Power dissipation (output) | PC | 150 | mW | 2 | |||
| Collector current | IC | 50 | mA | 2 | |||
| Collector-Emitter voltage | VCEO | 35 | V | 2 | |||
| Emitter-Collector voltage | VECO | 6 | V | 2 | |||
| Total power dissipation | PTOT | 200 | mW | 2 | |||
| Isolation voltage | VISO | 5000 | V rms | AC for 1 minute, R.H.=40~60% R.H.; pins 1,2 shorted and pins 3,4 shorted | 2 | ||
| Operating temperature | TOPR | -55 | 110 | °C | 2 | ||
| Storage temperature | TSTG | -55 | 125 | °C | 2 | ||
| Soldering temperature | TSOL | 260 | °C | For 10 seconds | 2 | ||
| Forward voltage | VF | 1.2 | 1.4 | V | IF = 20mA | 3 | |
| Reverse current | IR | 10 | µA | VR = 4V | 3 | ||
| Input capacitance | Cin | 30 | 250 | pF | V = 0, f = 1kHz | 3 | |
| Collector-Emitter dark current | ICEO | 100 | nA | VCE = 20V, IF = 0mA | 3 | ||
| Collector-Emitter breakdown voltage | BVCEO | 35 | V | IC = 0.1mA | 3 | ||
| Emitter-Collector breakdown voltage | BVECO | 6 | V | IE = 0.1mA | 3 | ||
| Current transfer ratio (GX817B rank) | CTR | 130 | 260 | % | IF = 5mA, VCE = 5V | 3 | |
| Collector-Emitter saturation voltage | VCE(sat) | 0.1 | 0.2 | V | IF = 20mA, IC = 1mA | 3 | |
| Floating capacitance | CIO | 0.6 | 1 | pF | VIO = 0, f = 1MHz | 3 | |
| Rise time | tr | 18 | µs | VCE = 2V, IC = 2mA | 3 | ||
| Fall time | tf | 18 | µs | RL = 100, VCE = 2V, IC = 2mA | 3 |
CAD (KiCad official)
- Symbol:
GX817B-S - Footprint:
Package_SO:SOP-4_3.8x4.1mm_P2.54mm - 3D model: SOP-4-2.54mm (KiCad packages3D, STEP)
- 3D model files:
gx817b-s-etched.step/gx817b-s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);gx817b-s.step/gx817b-s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GUOXIN JIAPIN SEMICONDUCTOR datasheet (13 pp, sha256
46c214d879f1abb3, retrieved 2026-10-14, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).