# GX2512-2W-100mR-1%

**Milliohm** · Current Sense Resistors / Shunt Resistors · 2512

GX2512-2W-100mR-1% from Milliohm, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Milliohm |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance tolerance (F, ±1%) |  | -1 |  | 1 | % |  | 3 |
| Temperature coefficient of resistance (Standard alloy ±50) | TCR | -50 |  | 50 | ppm/℃ | Standard alloy; TCR hot +25~+155℃ | 3 |
| Rated power | P |  | 2 |  | W | Rating at 70℃ | 3 |
| Resistance (nominal) | R |  | 100 |  | mΩ | Standard alloy row (±50 ppm/℃) | 3 |
| Operating temperature range |  | -55 |  | 170 | ℃ |  | 2 |
| Insulation resistance |  | 1000 |  |  | MΩ | Between termination and coating; test voltage 100±15V | 7 |
| High temperature exposure ΔR (F), percentage part | ΔR | -1 |  | 1 | % | 1000 h @ 125℃, unpowered | 5 |
| High temperature exposure ΔR (F), absolute part | ΔR | -0.5 |  | 0.5 | mΩ | 1000 h @ 125℃, unpowered | 5 |
| Temperature cycling ΔR (F), percentage part | ΔR | -0.5 |  | 0.5 | % | 1000 cycles (-55℃ to +125℃) | 5 |
| Temperature cycling ΔR (F), absolute part | ΔR | -1 |  | 1 | mΩ | 1000 cycles (-55℃ to +125℃) | 5 |
| Moisture resistance ΔR (F), percentage part | ΔR | -0.5 |  | 0.5 | % | 65℃/80~100%RH, 10 cycles | 5 |
| Moisture resistance ΔR (F), absolute part | ΔR | -0.5 |  | 0.5 | mΩ | 65℃/80~100%RH, 10 cycles | 5 |
| Biased humidity ΔR (F), percentage part | ΔR | -1 |  | 1 | % | 1000 h 85℃/85%RH, 10% of operating power | 5 |
| Biased humidity ΔR (F), absolute part | ΔR | -0.5 |  | 0.5 | mΩ | 1000 h 85℃/85%RH, 10% of operating power | 5 |
| Operational life ΔR (F), percentage part | ΔR | -1 |  | 1 | % | 1000 h @ 125℃, specified rated power | 5 |
| Operational life ΔR (F), absolute part | ΔR | -0.5 |  | 0.5 | mΩ | 1000 h @ 125℃, specified rated power | 5 |
| ESD ΔR, percentage part | ΔR | -1 |  | 1 | % | AEC-Q200-002, contact min. 1KV | 6 |
| ESD ΔR, absolute part | ΔR | -0.5 |  | 0.5 | mΩ | AEC-Q200-002, contact min. 1KV | 6 |
| Resistance to solder heat ΔR (F), percentage part | ΔR | -0.5 |  | 0.5 | % | Solder dipping 270℃±5℃ for 10±1 s | 6 |
| Resistance to solder heat ΔR (F), absolute part | ΔR | -0.5 |  | 0.5 | mΩ | Solder dipping 270℃±5℃ for 10±1 s | 6 |
| Thermal shock ΔR (F), percentage part | ΔR | -0.5 |  | 0.5 | % | -55 to 155℃, dwell 15 min, 300 cycles | 6 |
| Thermal shock ΔR (F), absolute part | ΔR | -0.5 |  | 0.5 | mΩ | -55 to 155℃, dwell 15 min, 300 cycles | 6 |
| Board flex ΔR (F), percentage part | ΔR | -0.5 |  | 0.5 | % | Bending 2 mm | 6 |
| Board flex ΔR (F), absolute part | ΔR | -1 |  | 1 | mΩ | Bending 2 mm | 6 |
| Short time overload ΔR (F), percentage part | ΔR | -1 |  | 1 | % | 5 × rated power for 5 s | 6 |
| Short time overload ΔR (F), absolute part | ΔR | -0.5 |  | 0.5 | mΩ | 5 × rated power for 5 s | 6 |
| Load life humidity ΔR (F), percentage part | ΔR | -1 |  | 1 | % | 40±2℃, RH 90~95%, D.C. rated voltage, 1.5 h on / 0.5 h off, 1000 h | 7 |
| Load life humidity ΔR (F), absolute part | ΔR | -0.5 |  | 0.5 | mΩ | 40±2℃, RH 90~95%, D.C. rated voltage, 1.5 h on / 0.5 h off, 1000 h | 7 |
| Load life ΔR (F), percentage part | ΔR | -1 |  | 1 | % | Rated voltage 1.5 h, 0.5 h pause at 70±2℃, 1000 h | 7 |
| Load life ΔR (F), absolute part | ΔR | -0.5 |  | 0.5 | mΩ | Rated voltage 1.5 h, 0.5 h pause at 70±2℃, 1000 h | 7 |

## CAD (KiCad official)

- Symbol: `GX2512-2W-100mR-1%`
- Footprint: `Resistor_SMD:R_2512_6332Metric`
- 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files: `gx2512-2w-100mr-1-etched.step` / `gx2512-2w-100mr-1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `gx2512-2w-100mr-1.step` / `gx2512-2w-100mr-1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Milliohm datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588918777597054976) (8 pp, sha256 `0229e4c3e7fb1469`, retrieved 2026-10-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/gx2512-2w-100mr-1-datasheet.pdf)