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GT74LVC2G08P8

GTIC · Gates · SOP-8

GT74LVC2G08P8 from GTIC, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1A input A input for gate 1; unused inputs must be held at VCC or GND and the input accepts voltages up to 5.5 V.
2 1B input B input for gate 1; unused inputs must be held at VCC or GND and the input accepts voltages up to 5.5 V.
3 2Y output Output for gate 2, with ±24 mA drive at 3.3 V.
4 GND power_in Ground pin.
5 2A input A input for gate 2; unused inputs must be held at VCC or GND and the input accepts voltages up to 5.5 V.
6 2B input B input for gate 2; unused inputs must be held at VCC or GND and the input accepts voltages up to 5.5 V.
7 1Y output Output for gate 1, with ±24 mA drive at 3.3 V.
8 VCC power_in Power input, operating from 1.65 V to 5.5 V (absolute maximum 6.5 V).

Key specifications

Parameter Value
Manufacturer GTIC
Package SOP-8
Category Logic ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage range VCC -0.5 6.5 V 5
Input voltage range VI -0.5 6.5 V 5
Output voltage, high-impedance or power-off state VO -0.5 6.5 V high-impedance or power-off state 5
Output voltage, high or low state VO -0.5 V high or low state; max printed as VCC+0.5 5
Input clamp current IIK -50 mA VI<0 5
Output clamp current IOK -50 mA VO<0 5
Continuous output current IO -50 50 mA 5
Junction temperature under bias TJ 150 °C 5
Storage temperature range Tstg -55 150 °C 5
ESD Human-Body Model V(ESD) 8 kV HBM 5
ESD Charged-Device Model V(ESD) 2 kV CDM 5
Supply Voltage VCC 1.65 5.5 V 6
High-Level Input Voltage VIH 1.7 V VCC=2.3V to 2.7V 6
High-Level Input Voltage VIH 2 V VCC=3V to 3.6V 6
Low-Level Input Voltage VIL 0.7 V VCC=2.3V to 2.7V 6
Low-Level Input Voltage VIL 0.8 V VCC=3V to 3.6V 6
Input Voltage VI 0 5.5 V 6
Output Voltage VO 0 V max printed as VCC 6
High-Level Output Current IOH -4 mA VCC=1.65V 6
High-Level Output Current IOH -8 mA VCC=2.3V 6
High-Level Output Current IOH -16 mA VCC=3V 6
High-Level Output Current IOH -24 mA VCC=3V 6
High-Level Output Current IOH -32 mA VCC=4.5V 6
Low-Level Output Current IOL 4 mA VCC=1.65V 6
Low-Level Output Current IOL 8 mA VCC=2.3V 6
Low-Level Output Current IOL 16 mA VCC=3V 6
Low-Level Output Current IOL 24 mA VCC=3V 6
Low-Level Output Current IOL 32 mA VCC=4.5V 6
Input Transition Rise or Fall Rate Δt/Δv 20 ns/V VCC=1.8V±0.15V,2.5V±0.2V 6
Input Transition Rise or Fall Rate Δt/Δv 10 ns/V VCC=3.3V±0.3V 6
Input Transition Rise or Fall Rate Δt/Δv 5 ns/V VCC=5V±0.5V 6
Operating Free-Air Temperature TA -40 125 °C 6
Thermal resistance junction-to-ambient, SOP-8 θJA 158 °C/W SOP-8(SOIC-8) 6
Thermal resistance junction-to-case, SOP-8 θJC 43 °C/W SOP-8(SOIC-8) 6
High-level output voltage VOH 1.2 V IOH = -4 mA, VCC = 1.65 V 7
High-level output voltage VOH 1.9 V IOH = -8 mA, VCC = 2.3 V 7
High-level output voltage VOH 2.4 V IOH = -16 mA, VCC = 3 V 7
High-level output voltage VOH 2.3 V IOH = -24 mA, VCC = 3 V 7
High-level output voltage VOH 3.8 V IOH = -32 mA, VCC = 4.5 V 7
Low-level output voltage VOL 0.1 V IOL = 100 μA, VCC = 1.65 V to 5.5 V 7
Low-level output voltage VOL 0.45 V IOL = 4 mA, VCC = 1.65 V 7
Low-level output voltage VOL 0.3 V IOL = 8 mA, VCC = 2.3 V 7
Low-level output voltage VOL 0.4 V IOL = 16 mA, VCC = 3 V 7
Low-level output voltage VOL 0.55 V IOL = 24 mA, VCC = 3 V 7
Input current, A or B inputs II -5 5 μA VI = 5.5 V or GND, VCC = 0 to 5.5 V 7
Power-off leakage current Ioff -10 10 μA VI or VO = 5.5 V, VCC = 0 7
Supply current ICC 10 μA VI = 5.5 V or GND, IO = 0, VCC = 1.65 V to 5.5 V 7
Additional supply current ΔICC 10 μA One Input at VCC, 0.6 V, Other Inputs at VCC or GND, VCC = 3 V to 5.5 V 7
Input capacitance Ci 5 pF VI = VCC or GND, VCC = 3.3 V 7
Propagation delay A or B to Y tpd 1.5 7.2 ns CL = 15 pF, VCC = 1.8 V ± 0.15 V, -40°C to 85°C 8
Propagation delay A or B to Y tpd 0.7 4.4 ns CL = 15 pF, VCC = 2.5 V ± 0.2 V, -40°C to 85°C 8
Propagation delay A or B to Y tpd 0.8 3.6 ns CL = 15 pF, VCC = 3.3 V ± 0.3 V, -40°C to 85°C 8
Propagation delay A or B to Y tpd 0.8 3.4 ns CL = 15 pF, VCC = 5 V ± 0.5 V, -40°C to 85°C 8
Power Dissipation Capacitance Cpd 18 pF f = 10 MHz, VCC = 1.8 V, TA=25°C 8
Power Dissipation Capacitance Cpd 21 pF f = 10 MHz, VCC = 2.5 V, TA=25°C 8
Power Dissipation Capacitance Cpd 22 pF f = 10 MHz, VCC = 3.3 V, TA=25°C 8
Power Dissipation Capacitance Cpd 25 pF f = 10 MHz, VCC = 5 V, TA=25°C 8

CAD (KiCad official)

  • Symbol: GT74LVC2G08P8
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: gt74lvc2g08p8-etched.step / gt74lvc2g08p8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gt74lvc2g08p8.step / gt74lvc2g08p8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GTIC datasheet (16 pp, sha256 c3752a13a552cdf3, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF