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GSS4501-VB

VBsemi Elec · MOSFETs · SO-8

GSS4501-VB from VBsemi Elec, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of the N-channel MOSFET (30 V VDS, ±20 V VGS, 8 A package-limited ID).
2 G1 input Gate of the N-channel MOSFET (±20 V max VGS, VGS(th) 1.0 to 2.0 V).
3 S2 passive Source of the P-channel MOSFET (-30 V VDS, ±20 V VGS, -8 A package-limited ID).
4 G2 input Gate of the P-channel MOSFET (±20 V max VGS, VGS(th) -2.0 V typ.).
5 D2 passive Drain of the P-channel MOSFET, tied internally with pin 6 (-30 V VDS, pulsed IDM -40 A).
6 D2 passive Drain of the P-channel MOSFET, tied internally with pin 5 (-30 V VDS, pulsed IDM -40 A).
7 D1 passive Drain of the N-channel MOSFET, tied internally with pin 8 (30 V VDS, pulsed IDM 40 A).
8 D1 passive Drain of the N-channel MOSFET, tied internally with pin 7 (30 V VDS, pulsed IDM 40 A).

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SO-8
Category Triode/MOS Tube/Transistor
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage (N-Ch) VDS 30 V TA = 25 °C, N-Channel 1
Drain-Source Voltage (P-Ch) VDS -30 V TA = 25 °C, P-Channel 1
Gate-Source Voltage VGS -20 20 V N- and P-Channel, ± 20 1
Continuous Drain Current (N-Ch) ID 8 A TJ = 150 °C, TC = 25 °C, N-Channel 1
Continuous Drain Current (P-Ch) ID -8 A TJ = 150 °C, TC = 25 °C, P-Channel 1
Continuous Drain Current (N-Ch) ID 6.8 A TC = 70 °C, N-Channel 1
Continuous Drain Current (P-Ch) ID -6.6 A TA = 25 °C, P-Channel, b, c 1
Pulsed Drain Current (N-Ch) IDM 40 A 10 µs pulse width, N-Channel 1
Pulsed Drain Current (P-Ch) IDM -40 A 10 µs pulse width, P-Channel 1
Source-Drain Diode Current IS 2.6 A TC = 25 °C, N-Channel (P-Channel -2.6) 1
Single Pulse Avalanche Current (N-Ch) IAS 10 A L = 0.1 mH, N-Channel 1
Single Pulse Avalanche Current (P-Ch) IAS 20 A L = 0.1 mH, P-Channel 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Junction-to-Ambient Thermal Resistance (N-Ch) RthJA 50 62.5 °C/W t ≤ 10 s, N-Channel 1
Junction-to-Ambient Thermal Resistance (P-Ch) RthJA 47 62.5 °C/W t ≤ 10 s, P-Channel 1
Junction-to-Foot Thermal Resistance (N-Ch) RthJF 30 40 °C/W Steady State, N-Channel 1
Junction-to-Foot Thermal Resistance (P-Ch) RthJF 29 38 °C/W Steady State, P-Channel 1
Drain-Source Breakdown Voltage (P-Ch) VDS -30 V VGS = 0 V, ID = - 250 µA, P-Ch 2
Gate Threshold Voltage (N-Ch) VGS(th) 1 2 V VDS = VGS, ID = 250 µA, N-Ch 2
Gate Threshold Voltage (P-Ch) VGS(th) -1 -2 V VDS = VGS, ID = - 250 µA, P-Ch 2
Gate-Body Leakage (N-Ch) IGSS -100 100 nA VDS = 0 V, VGS = ± 12 V, N-Ch 2
Gate-Body Leakage (P-Ch) IGSS -100 100 nA VDS = 0 V, VGS = ± 12 V, P-Ch 2
Zero Gate Voltage Drain Current (N-Ch) IDSS 1 µA VDS = 30 V, VGS = 0 V, N-Ch 2
Zero Gate Voltage Drain Current (P-Ch) IDSS -1 µA VDS = - 30 V, VGS = 0 V, P-Ch 2
Zero Gate Voltage Drain Current (N-Ch) IDSS 10 µA VDS = 30 V, VGS = 0 V, TJ = 55 °C, N-Ch 2
Zero Gate Voltage Drain Current (P-Ch) IDSS -10 µA VDS = - 30 V, VGS = 0 V, TJ = 55 °C, P-Ch 2
On-State Drain Current (N-Ch) ID(on) 20 A VDS = 5 V, VGS = 10 V, N-Ch 2
On-State Drain Current (P-Ch) ID(on) -20 A VDS = - 5 V, VGS = - 10 V, P-Ch 2
Gate Resistance (N-Ch) Rg 0.3 1 2.3 Ω f = 1 MHz, N-Ch 2
Gate Resistance (P-Ch) Rg 1.2 5.7 9.6 Ω f = 1 MHz, P-Ch 2
Body Diode Voltage (N-Ch) VSD 0.81 1.2 V IS = 5.4 A, N-Ch 3
Body Diode Voltage (P-Ch) VSD -0.77 -1.2 V IS = - 2 A, P-Ch 3
Drain-Source On-State Resistance (N-Ch) RDS(on) 0.024 Ω VGS = 4.5 V, ID = 6.6 A, N-Ch 2
Drain-Source On-State Resistance (P-Ch) RDS(on) 0.04 Ω VGS = - 10 V, ID = - 8 A, P-Ch 2
Forward Transconductance (N-Ch) gfs 27 S VDS = 15 V, ID = 6.8 A, N-Ch 2
Forward Transconductance (P-Ch) gfs 25 S VDS = - 15 V, ID = - 6.7 A, P-Ch 2
Total Gate Charge (P-Ch) Qg 41.5 63 nC VDS = - 20 V, VGS = - 10 V, ID = - 10 A, P-Ch 2
Fall Time (N-Ch) tf 5 9 ns VDD = 20 V, RL = 3.7 Ω, VGEN = 10 V, Rg = 1 Ω, N-Ch 3
Body Diode Reverse Recovery Time (P-Ch) trr 31 57 ns IF = - 5 A, dI/dt = - 100 A/µs, TJ = 25 °C, P-Ch 3
Body Diode Reverse Recovery Charge (P-Ch) Qrr 29 47 nC IF = - 5 A, dI/dt = - 100 A/µs, TJ = 25 °C, P-Ch 3

CAD (KiCad official)

  • Symbol: GSS4501-VB
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: gss4501-vb-etched.step / gss4501-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gss4501-vb.step / gss4501-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (14 pp, sha256 90d9eaa7629af50b, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF