# GS2MN

**DIYI Elec Tech** · Diodes - General Purpose · SMA(DO-214AC)

GS2MN from DIYI Elec Tech, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | DIYI Elec Tech |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 1000 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 1000 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 700 | V |  | 1 |
| Peak Forward Surge Current | IFSM |  |  | 50 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC method) | 1 |
| Rating for fusing | I²t |  |  | 10.38 | A²s | t<8.3ms | 1 |
| Forward Voltage | VFM |  |  | 1.1 | V | @IF=2.0A | 1 |
| Peak Reverse Current | IR |  |  | 5 | uA | At rated DC blocking voltage, 25℃ | 1 |
| Peak Reverse Current | IR |  |  | 200 | uA | At rated DC blocking voltage (elevated temperature row; temperature not legible in text) | 1 |
| Typical Thermal Resistance Junction to Ambient | RθJA |  | 50 |  | ℃/W | Note 2: device on FR-4 substrate, 1"*1", 2oz, single-sided PCB with 0.1"*0.15" copper pad | 1 |
| Operating Temperature Range |  | -55 |  | 150 | ℃ |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | ℃ |  | 1 |

## CAD (KiCad official)

- Symbol: `GS2MN`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files: `gs2mn-etched.step` / `gs2mn-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `gs2mn.step` / `gs2mn.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [DIYI Elec Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590228605390118912) (3 pp, sha256 `a345493f0f82485d`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/gs2mn-datasheet.pdf)