# GS1K-LTP

**MCC(Micro Commercial Components)** · Diodes - General Purpose · DO-214AC(SMA)

GS1K-LTP from MCC(Micro Commercial Components), in a DO-214AC(SMA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | DO-214AC(SMA) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage (GS1K-L) |  |  |  | 800 | V |  | 1 |
| Maximum DC Blocking Voltage (GS1K-L) |  |  |  | 800 | V |  | 1 |
| Maximum RMS Voltage (GS1K-L) |  |  |  | 560 | V |  | 1 |
| Average Forward Current | IF(AV) |  |  | 1 | A | TL = 110°C | 1 |
| Peak Forward Surge Current | IFSM |  |  | 30 | A | 8.3ms, Half Sine | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 1 | V | IFM = 1.0A; TJ = 25°C; pulse test (300 µsec pulse width, 2% duty cycle) | 1 |
| Maximum DC Reverse Current | IR |  |  | 5 | μA | At rated DC blocking voltage; TJ = 25°C | 1 |
| Maximum DC Reverse Current | IR |  |  | 50 | μA | At rated DC blocking voltage; TJ = 125°C | 1 |
| Typical Junction Capacitance | CJ |  | 8 |  | pF | Measured at 1.0MHz, VR = 4.0V | 1 |
| Typical Reverse Recovery Time | trr |  | 2 |  | µs | IF = 0.5A, IR = 1.0A, Irr = 0.25A | 1 |
| Rating For Fusing | I2t |  |  | 3.735 | A2s |  | 1 |
| Avalanche Energy | EAS |  |  | 20 | mJ | LH = 40mH | 1 |
| Operating Junction Temperature Range |  | -55 |  | 150 | °C |  | 1 |
| Storage Temperature Range |  | -55 |  | 150 | °C |  | 1 |
| Maximum Thermal Resistance Junction to Lead |  |  |  | 15 | °C/W |  | 1 |
| Maximum Thermal Resistance Junction to Ambient |  |  |  | 85 | °C/W |  | 1 |

## CAD (KiCad official)

- Symbol: `GS1K-LTP`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: DO-214AC(SMA) (KiCad packages3D, STEP)
- 3D model files: `gs1k-ltp-etched.step` / `gs1k-ltp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `gs1k-ltp.step` / `gs1k-ltp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8600627077544349696) (3 pp, sha256 `7d5e5df59c2332bb`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/gs1k-ltp-datasheet.pdf)