# GP8616E

**HaloChip** · AC-DC Controllers And Regulators · SOP-8

GP8616E from HaloChip, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | FB | input | Feedback voltage input, with an absolute maximum range of -0.3 V to 6 V and a 2 V reference (VFB) used for constant-voltage regulation. |
| 2 | GND | power_in | Chip ground, which is the reference for the CS sense resistor, the VCC decoupling capacitor and the FB divider. |
| 3 | VCC | power_in | Chip supply pin with an absolute maximum of -0.3 V to 25 V, to be bypassed by a capacitor placed close to the VCC and GND pins; it operates between about 4.6 V (UVLO) and 24 V (OVP) typical. |
| 4 | CS | input | Current sense input with an absolute maximum of -0.3 V to 6 V, where the sense resistor is connected between CS and GND and the peak-current threshold is 500 mV typical in constant-current mode. |
| 5 | C | passive | Collector of the internal power transistor, which should be connected to a copper area enlarged for heat dissipation; C-E breakdown is 400 V min for GP8616E. |
| 6 | C | passive | Collector of the internal power transistor, which should be connected to a copper area enlarged for heat dissipation; C-E breakdown is 400 V min for GP8616E. |
| 7 | C | passive | Collector of the internal power transistor, which should be connected to a copper area enlarged for heat dissipation; C-E breakdown is 400 V min for GP8616E. |
| 8 | C | passive | Collector of the internal power transistor, which should be connected to a copper area enlarged for heat dissipation; C-E breakdown is 400 V min for GP8616E. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HaloChip |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC supply voltage | VCC | -0.3 |  | 25 | V |  | 3 |
| CS current sense pin voltage | CS | -0.3 |  | 6 | V |  | 3 |
| FB feedback pin voltage | FB | -0.3 |  | 6 | V |  | 3 |
| Operating junction temperature range | TJ | -40 |  | 150 | ℃ |  | 3 |
| Storage temperature range | TSZG | -55 |  | 150 | ℃ |  | 3 |
| Maximum soldering temperature | Tlead |  |  | 260 | ℃ | soldering 10s | 3 |
| ESD rating (human body model) | ESD |  |  | 3 | kV | 人体模型，100pF 电容通过 1.5KΩ电阻放电 | 3 |
| Chip surface temperature limit |  |  |  | 135 | ℃ |  | 3 |
| Input voltage (recommended application range) | Vin | 85 |  | 265 | VAC | 50/60Hz | 3 |
| VCC start-up voltage | VCC_SZ | 13.5 | 14.5 | 15.5 | V | VCC上升 | 4 |
| VCC under-voltage lockout threshold | VCC_UVLO | 4.1 | 4.6 | 5.1 | V | VCC下降 | 4 |
| VCC over-voltage protection threshold | VCC_OVP | 22 | 24 | 26 | V | VCC上升 | 4 |
| VCC start-up current | ISZ | 0 | 1 | 3 | uA | VCC= VCC-SZ- 1V | 4 |
| VCC operating current | Icc |  |  | 800 | uA |  | 4 |
| Current detection threshold at constant current | VCS1 | 490 | 500 | 510 | mV | 恒流时 | 4 |
| Current detection threshold at light load | VCS2 |  | 240 |  | mV | 轻载时 | 4 |
| Leading-edge blanking time | TLEB |  | 500 |  | ns |  | 4 |
| FB feedback reference voltage | VFB | 1.975 | 2 | 2.025 | V |  | 4 |
| Minimum off time | Tmin_off | 2 |  |  | us |  | 4 |
| Maximum off time | Tmax_off |  |  | 3 | ms |  | 4 |
| Maximum output line compensation current | VCOMP_LINE | 55 | 60 | 65 | uA |  | 4 |
| FB over-voltage protection voltage | VFB_OVP |  | 2.6 |  | V |  | 4 |
| FB under-voltage protection voltage | VFB_UVP |  | 1.2 |  | V |  | 4 |
| Maximum on time | TON_MAX |  |  | 25 | us |  | 4 |
| Over-temperature protection threshold |  |  | 138 |  | ℃ |  | 4 |
| Over-temperature recovery threshold |  |  | 123 |  | ℃ |  | 4 |
| C-B breakdown voltage (VCBO) | VCBO | 700 |  |  | V | IC=0.1mA | 5 |
| C-E breakdown voltage (VCEO) | Vceo | 400 |  |  | V | IC=0.1mA | 5 |
| Maximum operating frequency | Fmax |  |  | 70 | Khz |  | 5 |
| Thermal resistance, junction to ambient | θJA |  | 120 |  | ℃/W |  | 3 |
| Thermal resistance, junction to case | θJC |  | 60 |  | ℃/W |  | 3 |

## CAD (KiCad official)

- Symbol: `GP8616E`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `gp8616e-etched.step` / `gp8616e-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `gp8616e.step` / `gp8616e.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HaloChip datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8600520047618514944) (8 pp, sha256 `068619995a6039cd`, retrieved 2026-10-19, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/gp8616e-datasheet.pdf)