← Commit history

add symbol pin "9" for the exposed thermal pad: the footprint carries the pad and the symbol had none, so it reached no net (vendor string 'MSOP-8-EP' denotes an exposed pad)

Ray ·7a23d175ac · ·parent 366c515
4 files changed +16−22
gm7a4001.kicad_sym+4
@@ -40,6 +40,10 @@       (name "EN" (effects (font (size 1.27 1.27))))       (number "5" (effects (font (size 1.27 1.27))))     )+			(pin power_in line (at -17.78 -7.62 0) (length 5.08)+				(name "GND" (effects (font (size 1.27 1.27))))+				(number "9" (effects (font (size 1.27 1.27))))+			)     )   ) )
gm7a4001.lbr+2
@@ -89,6 +89,7 @@   <pin name="NC@2" x="17.78" y="0" length="middle" direction="io" rot="R180"/>   <pin name="NC@3" x="17.78" y="-2.54" length="middle" direction="io" rot="R180"/>   <pin name="EN" x="17.78" y="-5.08" length="middle" direction="in" rot="R180"/>+  <pin name="GND@2" x="-17.78" y="-7.62" length="middle" direction="pwr"/> </symbol> </symbols> <devicesets>@@ -108,6 +109,7 @@         <connect gate="G$1" pin="NC@2" pad="7"/>         <connect gate="G$1" pin="NC@3" pad="6"/>         <connect gate="G$1" pin="EN" pad="5"/>+        <connect gate="G$1" pin="GND@2" pad="9"/>       </connects>       <technologies><technology name=""/></technologies>     </device>
pads.json+7−20
@@ -26,24 +26,11 @@   "5",   "6",   "7",-  "8"+  "8",+  "9"  ],  "paste_apertures": 4,- "issues": [-  {-   "kind": "pin-not-in-symbol",-   "pin": "EP",-   "name": "GND",-   "detail": "page.json describes pin \"EP\" (GND) from the datasheet, but the symbol has no such pin, so nothing can connect to it"-  },-  {-   "kind": "pad-has-no-pin",-   "pad": "9",-   "thermal": true,-   "described_in_page": false,-   "detail": "footprint pad \"9\" is in copper but the SYMBOL has no pin for it - a thermal pad with no net will float"-  }- ],+ "issues": [],  "pads": [   {    "pad": "1",@@ -301,13 +288,13 @@    "layers": [],    "thermal": true,    "pin": "9",-   "name": null,-   "type": null,-   "description": null,+   "name": "GND",+   "type": "power_in",+   "description": "Exposed thermal pad on the bottom of the package, electrically tied to GND. Solder to a copper ground pour on the PCB to conduct heat away from the die.",    "is_pin1": false,    "source": {     "geometry": "MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm.kicad_mod",-    "meaning": null,+    "meaning": "page.json:component.pins",     "correspondence": "kicad: symbol pin number == pad name"    }   }
page.json+3−2
@@ -77,10 +77,11 @@         "description": "Input supply pin, +7V to +100V operating (abs-max +110V). Requires an input capacitor greater than 0.47 μF (typ 1 μF) placed close to the pin. Dropout is 2.8V at IOUT = 50 mA."       },       {-        "number": "EP",+        "number": "9",         "name": "GND",         "type": "power_in",-        "description": "Exposed thermal pad on the bottom of the package, electrically tied to GND. Solder to a copper ground pour on the PCB to conduct heat away from the die."+        "description": "Exposed thermal pad on the bottom of the package, electrically tied to GND. Solder to a copper ground pour on the PCB to conduct heat away from the die.",+        "source": "renumbered-to-footprint-pad"       }     ],     "provenance": {