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Ray Publish 0.1.0 21f7409 17d ago

GM12041ARDZ-3.3-R7

GONGMOSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOIC-8

GM12041ARDZ-3.3-R7 from GONGMOSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output; place a 10µF or larger ceramic capacitor between OUT and GND as close to the pin as possible, with ESR no more than 3Ω, to keep the regulator stable and prevent oscillation.
2 SENSE/ADJ input Feedback pin to the error amplifier; it is the SENSE pin on fixed-output versions, and on adjustable versions the ADJ pin sits at 1.21V relative to GND with an external output range of 1.21V to 20V.
3 GND power_in Ground reference pin.
4 NC unconnected Not connected.
5 SHDN input Shutdown pin; pull high to enable the device and pull low to disable it, and if the enable function is not needed it must be connected to IN.
6 GND power_in Ground reference pin.
7 GND power_in Ground reference pin.
8 IN power_in Input pin with an input supply range of 1.9V to 20V; a 10µF or larger ceramic capacitor (7µF or larger acceptable) from IN to GND is required to lower input impedance, placed as close to the pin as possible.

Key specifications

Parameter Value
Manufacturer GONGMOSEMI
Package SOIC-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Fixed output voltage accuracy (3.3 V SENSE variant) VSENSE -2 2 % max(VOUT + 0.5V, 1.9 V) < VIN < 20V, 1mA < ILOAD < 1.5A 9
Dropout voltage at 100 mA VDO 70 146 mV VIN = 3.3 V, IOUT = 100 mA, VFB = 0.5 V, 3% 9
Dropout voltage at 1.5 A VDO 160 270 mV VIN = 3.3 V, IOUT = 1.5 A, VFB = 0.5 V, 3% 9
Input voltage line regulation ΔVOUT_LINE 2 8 mV VIN = max(VOUT + 0.5V, 1.9 V) to 20 V, ILOAD = 10mA 9
Load regulation ΔVOUT_LOAD 3 15 mV 1 mA ≤ IOUT ≤ 1.5 A 9
GND pin current at no load IGND 0.9 1.7 mA ILOAD = 0mA 9
GND pin current at 100 mA load IGND 1.4 2.2 mA ILOAD = 100mA 9
GND pin current at 1.5 A load IGND 2.7 3.9 mA ILOAD = 1.5A 9
Shutdown current ISHUTDOWN 0.9 10 μA VIN = 6V, SHDN = 0V, TJ = 25°C 9
UVLO rising threshold VUVLO_RISING 1.75 1.89 V VIN 上升 9
UVLO falling threshold VUVLO_FALLING 1.55 1.68 V VIN 下降 9
SHDN pin low-level input voltage VSHDN_IL 0.49 0.75 V 9
SHDN pin high-level input voltage VSHDN_IH 0.79 1.1 V 9
SHDN pin current ISHDN 50 750 nA VIN = 20 V, TJ = 25°C 9
Output current limit ILIM 2.2 A VOUT 外加 0.9 × VOUT(nom), VIN = VOUT(nom) + 0.5 V 9
Power supply ripple rejection at 100 Hz PSRR 80 dB f = 100 Hz, VOUT - VOUT = 1 V, ILOAD = 1.5 A 9
Power supply ripple rejection at 10 kHz PSRR 75 dB f = 10 kHz, VOUT - VOUT = 1 V, ILOAD = 1.5 A 9
Output voltage noise VN 9.8 μVRMS 带宽 = 10 Hz to 100 kHz, IOUT = 1.5 A 9
Output voltage noise at 3.3 V output VN 27 μVRMS VOUT = 3.3 V, 10 Hz to 100 kHz (text) 13
Thermal shutdown threshold TSD 155 °C 关机阈值,温度上升 9
Thermal shutdown hysteresis TSD_HYS 15 °C 开机阈值,温度下降 9
IN, SHDN to GND voltage -0.3 22 V 8
OUT to GND voltage -0.3 22 V 8
SENSE/ADJ to GND voltage -0.3 6 V 8
Storage temperature range -65 150 °C 8
Operating temperature range -40 125 °C 8
Input voltage operating range VIN 1.9 20 V 14
Continuous operating junction temperature TJ 125 °C continuous operation 14
Minimum output capacitance COUT 10 μF ceramic, placed as close to OUT pin as possible 14
Output capacitor ESR ESR 3 Ω to prevent oscillation 14
Junction-to-ambient thermal resistance, 8-pin SOIC θJA 67 °C/W worst case, surface-mount package (Table 7) 8
Junction-to-ambient thermal resistance, SOP-8 on JEDEC 51-7 four-layer board θJA 46.4 °C/W JEDEC 51-7 high-K four-layer test board, TA = 25°C 14

CAD (KiCad official)

  • Symbol: GM12041ARDZ-3.3-R7
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: gm12041ardz-3-3-r7-etched.step / gm12041ardz-3-3-r7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gm12041ardz-3-3-r7.step / gm12041ardz-3-3-r7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GONGMOSEMI datasheet (20 pp, sha256 b0731d7ae1fd05a4, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF