component

GF1M

Public Made by Adom

by adom

onsemi Diodes - General Purpose, SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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GF1M

onsemi · Diodes - General Purpose · SMA(DO-214AC)

GF1M from onsemi, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, marked by the color band on the SMA/DO-214AC package; the GF1M is rated for VRRM of 1000 V.
2 A passive Anode of the glass passivated rectifier; average rectified forward current is 1.0 A at TL = 125°C and forward voltage is 1.2 V at 1.0 A.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage VF 1.2 V @ 1.0 A 2
Reverse Recovery Time trr 2 µs IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A 2
Reverse Current IR 5 µA @ rated VR, TA = 25°C 2
Reverse Current IR 50 µA @ rated VR, TA = 125°C 2
Total Capacitance CT 15 pF VR = 4.0 V, f = 1.0 MHz 2
Maximum Repetitive Reverse Voltage VRRM 1000 V TA = 25°C 2
Average Rectified Forward Current IF(AV) 1 A @ TL = 125°C 2
Non-repetitive Peak Forward Surge Current IFSM 30 A 8.3 ms Single Half-Sine-Wave 2
Storage Temperature Range Tstg -65 175 °C 2
Operating Junction Temperature TJ -65 175 °C 2
Power Dissipation PD 1.8 W 2
Thermal Resistance, Junction to Ambient RθJA 80 °C/W Device mounted on PCB with 0.2 x 0.2" (5.0 x 5.0 mm) copper pad areas 2
Thermal Resistance, Junction to Lead RθJL 26 °C/W Device mounted on PCB with 0.2 x 0.2" (5.0 x 5.0 mm) copper pad areas 2

CAD (KiCad official)

  • Symbol: GF1M
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: gf1m-etched.step / gf1m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gf1m.step / gf1m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 3daa5a2609801b7c, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF