component
GD5F2GQ5UEYIGR
Public Made by Adomby adom
GigaDevice Semicon Beijing NAND FLASH, WSON-8-EP(6x8). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownGD5F2GQ5UEYIGR
GigaDevice Semicon Beijing · NAND FLASH · WSON-8-EP(6x8)
GD5F2GQ5UEYIGR from GigaDevice Semicon Beijing, in a WSON-8-EP(6x8). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS# | input | Chip Select input, active low. |
| 2 | SO/SIO1 | bidirectional | Serial Data Output in standard SPI, or Serial Data Input/Output 1 in dual and quad SPI. |
| 3 | WP#/SIO2 | bidirectional | Write Protect, active low, or Serial Data Input/Output 2 in quad SPI; WP# only takes effect when the Quad Enable bit (QE) is 0. |
| 4 | VSS | power_in | Ground. |
| 5 | SI/SIO0 | bidirectional | Serial Data Input in standard SPI, or Serial Data Input/Output 0 in dual and quad SPI. |
| 6 | SCLK | input | Serial Clock input, up to 104MHz at 3.3V for fast read with 30pF load. |
| 7 | HOLD#/SIO3 | bidirectional | Hold input or Serial Data Input/Output 3 in quad SPI. |
| 8 | VCC | power_in | Power supply, 2.7V to 3.6V for the GD5F2GQ5UE variant. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GigaDevice Semicon Beijing |
| Package | WSON-8-EP(6x8) |
| Category | Memory |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature (I grade) | -40 | 85 | °C | Temperature Range I: Industrial | 64 | ||
| Supply voltage 3.3V | VCC | 2.7 | 3.6 | V | U: 3.3V (2.7~3.6V) | 64 | |
| Ambient Operating Temperature | -40 | 105 | ℃ | 58 | |||
| Storage Temperature | -65 | 150 | ℃ | 58 | |||
| VCC(3.3V) supply voltage | VCC | -0.6 | 4 | V | VCC(3.3V) | 58 | |
| Input Leakage Current | ILI | -2 | 2 | μA | 60 | ||
| Output Leakage Current | ILO | -2 | 2 | μA | 60 | ||
| Standby Current | ICC1 | 50 | μA | CS#=VCC, VIN=VCC or VSS | 60 | ||
| Operating Current (Read) 104MHz | ICC2 | 30 | mA | CLK=0.1VCC / 0.9VCC at 104MHz, Q=Open(*1,*2,*4 I/O) | 60 | ||
| Operating Current (Read) 80MHz | ICC2 | 30 | mA | CLK=0.1VCC / 0.9VCC at 80MHz, Q=Open(*1,*2,*4 I/O) | 60 | ||
| Operating Current (Program) | ICC3 | 30 | mA | 60 | |||
| Operating Current (Erase) | ICC4 | 30 | mA | 60 | |||
| Input Low Voltage (min; max is 0.2VCC) | VIL | -0.5 | V | 60 | |||
| Input High Voltage (min is 0.8VCC) | VIH | 0.8 | VCC | 60 | |||
| Output Low Voltage | VOL | 0.4 | V | IOL =1.6mA | 60 | ||
| Input Capacitance | CIN | 6 | pF | VIN=0V | 59 | ||
| Output Capacitance | COUT | 8 | pF | VOUT=0V | 59 | ||
| Serial Clock Frequency | FC1 | 104 | MHz | 3.3V, CL=30pF | 61 | ||
| Serial Clock Frequency for DTR | FC2 | 45 | MHZ | 3.3V, CL=30pF | 61 | ||
| Serial Clock High Time | tCH | 4 | ns | 3.3V, CL=30pF | 61 | ||
| Serial Clock Low Time | tCL | 4 | ns | 3.3V, CL=30pF | 61 | ||
| CS# Active Setup Time | tSLCH | 5 | ns | 3.3V, CL=30pF | 61 | ||
| CS# High Time | tSHSL/tCS | 20 | ns | 3.3V, CL=30pF | 61 | ||
| Output Disable Time | tSHQZ | 20 | ns | 3.3V, CL=30pF | 61 | ||
| Data In Setup Time | tDVCH | 2 | ns | 3.3V, CL=30pF | 61 | ||
| Clock Low To Output Valid | tCLQV | 9 | ns | 3.3V, CL=30pF | 61 | ||
| Read From Array | tRD | 25 | us | 62 | |||
| Read From Array with ECC | tRD_ECC | 45 | 60 | us | 62 | ||
| Page Programming Time | tPROG | 300 | 600 | us | 62 | ||
| Page Programming Time with ECC | tPROG_ECC | 400 | 600 | us | 62 | ||
| Block Erase Time | tBERS | 3 | 5 | ms | 62 |
CAD (KiCad official)
- Symbol:
GD5F2GQ5UEYIGR - Footprint:
Package_SON:WSON-8-1EP_8x6mm_P1.27mm_EP3.4x4.3mm - 3D model: WSON-8-EP(6x8), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
gd5f2gq5ueyigr-etched.step/gd5f2gq5ueyigr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);gd5f2gq5ueyigr.step/gd5f2gq5ueyigr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GigaDevice Semicon Beijing datasheet (69 pp, sha256
f7c629545d4c0810, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).