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GD32L233CBT6
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GigaDevice Semicon Beijing Microcontroller Units (MCUs/MPUs/SOCs), LQFP-48(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownGD32L233CBT6
GigaDevice Semicon Beijing · Microcontroller Units (MCUs/MPUs/SOCs) · LQFP-48(7x7)
GD32L233CBT6 from GigaDevice Semicon Beijing, in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VBAT | power_in | Backup power supply pin for the VBAT domain (default function VBAT). |
| 2 | PC13 | bidirectional | General-purpose I/O PC13 with alternate EVENTOUT and additional RTC_TAMP0, RTC_OUT, RTC_TS and WKUP1 functions. |
| 3 | PC14-OSC32IN | bidirectional | General-purpose I/O PC14 that is also the OSC32IN low-speed oscillator input. |
| 4 | PC15-OSC32OUT | bidirectional | General-purpose I/O PC15 that is also the OSC32OUT low-speed oscillator output. |
| 5 | PF0-OSCIN | bidirectional | General-purpose I/O PF0 whose default function is the OSCIN high-speed oscillator input. |
| 6 | PF1-OSCOUT | bidirectional | General-purpose I/O PF1 whose default function is the OSCOUT high-speed oscillator output. |
| 7 | NRST | bidirectional | Active-low reset pin (default function NRST). |
| 8 | VSS | power_in | Ground supply pin (default function VSS). |
| 9 | VREF | power_in | Voltage reference pin (default function VREF). |
| 10 | VDD | power_in | Main power supply pin (default function VDD). |
| 11 | PA0 | bidirectional | General-purpose I/O PA0 with additional WKUP0, ADC_IN0, RTC_TAMP1 and CMP0_IM4 functions. |
| 12 | PA1 | bidirectional | General-purpose I/O PA1 with additional ADC_IN1 and CMP0_IP functions. |
| 13 | PA2 | bidirectional | General-purpose I/O PA2 with additional ADC_IN2, CMP1_IM4, RTC_TAMP2 and WKUP2 functions. |
| 14 | PA3 | bidirectional | General-purpose I/O PA3 with additional ADC_IN3 and CMP1_IP0 functions. |
| 15 | PA4 | bidirectional | General-purpose I/O PA4 with additional ADC_IN4 and DAC_OUT functions. |
| 16 | PA5 | bidirectional | General-purpose I/O PA5 with additional ADC_IN5 function. |
| 17 | PA6 | bidirectional | General-purpose I/O PA6 with additional ADC_IN6 function. |
| 18 | PA7 | bidirectional | General-purpose I/O PA7 with additional ADC_IN7 function. |
| 19 | PB0 | bidirectional | General-purpose I/O PB0 with additional ADC_IN8 and VREF_OUT functions. |
| 20 | PB1 | bidirectional | General-purpose I/O PB1 with additional ADC_IN9 and VREF_OUT functions. |
| 21 | BOOT1-PB2 | bidirectional | 5 V tolerant I/O with default function BOOT1, additional PB2 and WKUP3 functions. |
| 22 | PB10 | bidirectional | 5 V tolerant general-purpose I/O PB10 with alternate functions including SPI1_SCK, I2S1_CK, I2C1_SCL and LPUART_TX. |
| 23 | PB11 | bidirectional | 5 V tolerant general-purpose I/O PB11 with alternate functions including I2C1_SDA, LPUART_RX and TIMER1_CH3. |
| 24 | PB12 | bidirectional | 5 V tolerant general-purpose I/O PB12 with alternate functions including SPI1_NSS, I2S1_WS and LPUART_RTS. |
| 25 | PB13 | bidirectional | 5 V tolerant general-purpose I/O PB13 with alternate functions including CK_OUT, SPI1_SCK and LPUART_CTS. |
| 26 | PB14 | bidirectional | 5 V tolerant general-purpose I/O PB14 with alternate functions including SPI1_MISO, I2C1_SDA, RTC_OUT and TIMER11_CH0. |
| 27 | PB15 | bidirectional | 5 V tolerant general-purpose I/O PB15 with alternate functions including SPI1_MOSI, I2S1_SD and TIMER11_CH1, and additional RTC_REFIN. |
| 28 | PC6 | bidirectional | 5 V tolerant general-purpose I/O PC6 with alternate functions including I2S1_MCK and TIMER2_CH0, and additional WKUP4. |
| 29 | PC7 | bidirectional | 5 V tolerant general-purpose I/O PC7 with alternate functions including TIMER2_CH1 and EVENTOUT. |
| 30 | PA8 | bidirectional | 5 V tolerant general-purpose I/O PA8 with alternate functions including USART0_CK, CK_OUT and CTC_SYNC, and additional VCORE. |
| 31 | PA9 | bidirectional | 5 V tolerant general-purpose I/O PA9 with alternate functions including CK_OUT, USART0_TX, I2C0_SCL and LPTIMER_IN1. |
| 32 | PA10 | bidirectional | 5 V tolerant general-purpose I/O PA10 with alternate functions including USART0_RX and I2C0_SDA. |
| 33 | PA11 | bidirectional | 5 V tolerant general-purpose I/O PA11 with alternate functions including CMP0_OUT, USART0_CTS and SPI0_MISO, and additional USBDM. |
| 34 | PA12 | bidirectional | 5 V tolerant general-purpose I/O PA12 with alternate functions including CMP1_OUT, USART0_RTS and SPI0_MOSI, and additional USBDP. |
| 35 | PA13 | bidirectional | 5 V tolerant I/O with default function SWDIO and alternates including LPUART_RX, I2C0_SCL and USART0_TX. |
| 36 | PA14 | bidirectional | 5 V tolerant I/O with default function SWCLK and alternates including LPUART_TX, USART1_TX and I2C0_SDA. |
| 37 | PA15 | bidirectional | 5 V tolerant general-purpose I/O PA15 with alternate functions including SPI1_NSS, I2S1_WS, TIMER1_CH0_ETI and USART1_RX. |
| 38 | PC10 | bidirectional | 5 V tolerant general-purpose I/O PC10 with alternate functions including UART3_TX, LPUART_TX and SPI1_SCK. |
| 39 | PC11 | bidirectional | 5 V tolerant general-purpose I/O PC11 with alternate functions including UART3_RX, LPUART_RX and SPI1_MISO. |
| 40 | PC12 | bidirectional | 5 V tolerant general-purpose I/O PC12 with alternate functions including UART4_TX (CB/C devices only), SPI1_MOSI and I2S1_SD. |
| 41 | PB3 | bidirectional | 5 V tolerant general-purpose I/O PB3 with alternate functions including SPI1_SCK, I2S1_CK, TIMER1_CH1 and LPTIMER_IN1, and additional CMP1_IM6. |
| 42 | PB4 | bidirectional | 5 V tolerant general-purpose I/O PB4 with alternate functions including SPI1_MISO, TIMER2_CH0 and USART0_CTS, and additional CMP1_IP1. |
| 43 | PB5 | bidirectional | General-purpose I/O PB5 with alternate functions including LPTIMER_IN0, I2C0_SMBA, SPI1_MOSI and I2S1_SD, and additional CMP1_IP2. |
| 44 | PB6 | bidirectional | 5 V tolerant general-purpose I/O PB6 with alternate functions including LPTIMER_ETI0, I2C1_SCL, I2C0_SCL and USART0_TX, and additional CMP1_IP3. |
| 45 | PB7 | bidirectional | 5 V tolerant general-purpose I/O PB7 with alternate functions including I2C1_SDA, I2C0_SDA and USART0_RX, and additional CMP1_IP4. |
| 46 | BOOT0-PD3 | bidirectional | I/O with default function BOOT0 and alternates including USART1_CTS, SPI1_MISO and I2S1_MCK, and additional PD3 function. |
| 47 | PB8 | bidirectional | 5 V tolerant general-purpose I/O PB8 with alternate functions including I2C1_SCL, I2C0_SCL and CMP0_OUT. |
| 48 | PB9 | bidirectional | 5 V tolerant general-purpose I/O PB9 with alternate functions including I2C1_SDA, SPI1_NSS, I2S1_WS and CMP1_OUT. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GigaDevice Semicon Beijing |
| Package | LQFP-48(7x7) |
| Category | Single Chip Microcomputer/Microcontroller |
| Pins | 48 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage VDD (absolute maximum) | VDD | 3.63 | V | External voltage range; min printed as VSS - 0.3 | 49 | ||
| Analog supply voltage VDDA (absolute maximum) | VDDA | 3.63 | V | External analog supply voltage; min printed as VSSA - 0.3 | 49 | ||
| Input voltage on other I/O (absolute maximum) | VIN | 3.63 | V | Input voltage on other I/O; min printed as VSS - 0.3 | 49 | ||
| Variations between different VDD power pins | /ΔVDDx/ | 50 | mV | 49 | |||
| Variations between different ground pins | /VSSX-VSS/ | 50 | mV | 49 | |||
| Maximum current for GPIO pins | IIO | -25 | 25 | mA | 49 | ||
| Operating temperature range | TA | -40 | 85 | °C | 49 | ||
| Power dissipation of LQFP48 | PD | 574 | mW | Power dissipation at TA = 85°C of LQFP48 | 49 | ||
| Storage temperature range | TSTG | -65 | 150 | °C | 49 | ||
| Maximum junction temperature | TJ | 125 | °C | 49 | |||
| Supply voltage | VDD | 1.71 | 3.3 | 3.63 | V | 49 | |
| Analog supply voltage | VDDA | 1.71 | 3.3 | 3.63 | V | 49 | |
| Battery supply voltage | VBAT | 1.71 | 3.3 | 3.63 | V | 49 | |
| AHB1 clock frequency | fHCLK1 | 0 | 64 | MHz | 50 | ||
| APB1 clock frequency | fAPB1 | 0 | 32 | MHz | 50 | ||
| APB2 clock frequency | fAPB2 | 0 | 64 | MHz | 50 | ||
| Power on reset threshold | VPOR | 1.56 | 1.6 | 1.63 | V | 59 | |
| Power down reset threshold | VPDR | 1.52 | 1.56 | 1.59 | V | 59 | |
| ESD voltage human body model | VESD(HBM) | 2000 | V | JS-001-2017 | 60 | ||
| ESD voltage charge device model | VESD(CDM) | 500 | V | JS-002-2018 | 60 | ||
| Static latch-up I-test | LU | -200 | 200 | mA | JESD78 | 60 | |
| Static latch-up Vsupply over voltage | Vsupply | 5.4 | V | 60 | |||
| Crystal or ceramic frequency (HXTAL) | fHXTAL | 4 | 8 | 48 | MHz | VDD = 3.3 V | 60 |
| External clock source or oscillator frequency (LXTAL bypass) | fLXTAL_ext | 32.768 | 1000 | kHz | VDD = 3.3 V | 62 | |
| IRC16M frequency accuracy, factory-trimmed | ACCIRC16M | -1.5 | 1.5 | % | VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C | 62 | |
| IRC16M frequency accuracy, factory-trimmed | ACCIRC16M | -1 | 1 | % | VDD = VDDA = 3.3 V | 62 | |
| Low speed internal oscillator (IRC32K) frequency | fIRC32K | 31.7 | 32.3 | kHz | VDD = VDDA = 3.3 V, TA = -40~85 °C | 63 | |
| IRC48M frequency accuracy, factory-trimmed | ACCIRC48M | -3.3 | -0.25 | % | VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C | 63 | |
| IRC48M frequency accuracy | ACCIRC48M | -2 | 2 | % | VDD = VDDA = 3.3 V | 63 | |
| PLL input clock frequency | fPLLIN | 2 | 16 | MHz | 64 | ||
| PLL output clock frequency | fPLLOUT | 16 | 64 | MHz | 64 | ||
| PLL lock time | tLOCK | 200 | μs | 64 | |||
| Number of guaranteed program/erase cycles (Endurance) | PECYC | 10 | kcycles | TA = -40 °C ~ +85 °C | 64 | ||
| Data retention time | tRET | 10 | years | 10k cycles at TA = 85 °C | 64 | ||
| Analog supply voltage (VREF buffer) | VDDA | 2.7 | 3.3 | 3.63 | V | 65 | |
| Output reference voltage | VREF | 2.49 | 2.5 | 2.51 | V | VDDA = 3.3 V | 65 |
| Output reference voltage | VREF | 2.47 | 2.5 | 2.53 | V | All VDDA, All Temp | 65 |
| VREF buffer setup time | TSU | 200 | μs | CL = 1 μF + 10 nF | 65 | ||
| ADC operating voltage | VDDA | 1.8 | 3.3 | 3.6 | V | 68 | |
| ADC clock | fADC | 0.125 | 16 | MHz | 68 | ||
| Sampling time | ts | 0.156 | 14.97 | μs | fADC = 16 MHz | 68 | |
| External input impedance | RAIN | 513.6 | kΩ | See Equation 1 | 68 | ||
| Input sampling switch resistance | RADC | 0.5 | kΩ | 68 | |||
| Input sampling capacitance | CADC | 3 | pF | No pin/pad capacitance included | 68 | ||
| DAC operating voltage | VDDA | 1.71 | 3.3 | 3.63 | V | 70 | |
| Resistive load | RLOAD | 5 | kΩ | Resistive load with buffer ON | 70 | ||
| Impedance output | Ro | 15 | kΩ | Impedance output with buffer OFF | 70 | ||
| Capacitive load | CLOAD | 50 | pF | Capacitive load with buffer ON | 70 | ||
| Lower DAC_OUT voltage | DAC_OUT min | 0.2 | V | Lower DAC_OUT voltage with buffer ON | 70 | ||
| SCK clock frequency (SPI) | fSCK | 16 | MHz | 76 | |||
| Data output access time (SPI slave) | tA(SO) | 8 | ns | 76 | |||
| Data output valid time (SPI slave) | tV(SO) | 9 | ns | 76 | |||
| Data input hold time (SPI slave) | tH(SI) | 1 | ns | 76 | |||
| Data input setup time (SPI slave) | tSU(SI) | 0 | ns | 76 | |||
| Data output valid time (SPI master) | tV(MO) | 10 | ns | 76 | |||
| USBD operating voltage | VDD | 3 | 3.63 | V | 80 | ||
| Static output level low | VOL | 0.3 | V | RL of 1.0 kΩ to 3.63 V | 80 | ||
| Thermal resistance junction-to-ambient | θJA | 69.64 | °C/W | Natural convection, 2S2P PCB | 92 | ||
| Thermal resistance junction-to-board | θJB | 43.16 | °C/W | Cold plate, 2S2P PCB | 92 | ||
| Thermal resistance junction-to-case | θJC | 25.36 | °C/W | Cold plate, 2S2P PCB | 93 |
CAD (KiCad official)
- Symbol:
GD32L233CBT6 - Footprint:
Package_QFP:LQFP-48_7x7mm_P0.5mm - 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
- 3D model files:
gd32l233cbt6-etched.step/gd32l233cbt6-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);gd32l233cbt6.step/gd32l233cbt6.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GigaDevice Semicon Beijing datasheet (96 pp, sha256
106f71e7e95b90de, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusoff(skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).