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GD32F330RBT6

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GigaDevice Semicon Beijing Microcontrollers (MCU/MPU/SOC), LQFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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GD32F330RBT6

GigaDevice Semicon Beijing · Microcontrollers (MCU/MPU/SOC) · LQFP-64(10x10)

GD32F330RBT6 from GigaDevice Semicon Beijing, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Backup power supply input for the RTC and backup domain (default function VBAT).
2 PC13-TAMPER-RTC bidirectional General-purpose I/O PC13 with additional functions RTC_TAMP0, RTC_TS, RTC_OUT and WKUP1.
3 PC14-OSC32IN bidirectional General-purpose I/O PC14 that also serves as the low-speed crystal (LXTAL) input OSC32IN.
4 PC15-OSC32OUT bidirectional General-purpose I/O PC15 that also serves as the low-speed crystal (LXTAL) output OSC32OUT.
5 PF0-OSCIN bidirectional 5 V tolerant I/O PF0 that also serves as high-speed crystal input OSCIN; alternate function CTC_SYNC.
6 PF1-OSCOUT bidirectional 5 V tolerant I/O PF1 that also serves as high-speed crystal output OSCOUT.
7 NRST bidirectional Active-low reset pin of the MCU (I/O per datasheet table; the reset circuit is described in section 4.11).
8 PC0 bidirectional General-purpose I/O PC0 with alternate function EVENTOUT and analog input ADC_IN10.
9 PC1 bidirectional General-purpose I/O PC1 with alternate function EVENTOUT and analog input ADC_IN11.
10 PC2 bidirectional General-purpose I/O PC2 with alternate function EVENTOUT and analog input ADC_IN12.
11 PC3 bidirectional General-purpose I/O PC3 with alternate function EVENTOUT and analog input ADC_IN13.
12 VSSA power_in Analog ground for the ADC and analog circuitry (default function VSSA).
13 VDDA power_in Analog supply for the ADC and analog circuitry (default function VDDA).
14 PA0-WKUP bidirectional General-purpose I/O PA0 with alternates USART1_CTS, TIMER1_CH0, TIMER1_ETI, I2C1_SCL, analog input ADC_IN0 and wakeup WKUP0.
15 PA1 bidirectional General-purpose I/O PA1 with alternates USART1_RTS, TIMER1_CH1, I2C1_SDA, EVENTOUT and analog input ADC_IN1.
16 PA2 bidirectional General-purpose I/O PA2 with alternates USART1_TX, TIMER1_CH2, TIMER14_CH0 and analog input ADC_IN2.
17 PA3 bidirectional General-purpose I/O PA3 with alternates USART1_RX, TIMER1_CH3, TIMER14_CH1 and analog input ADC_IN3.
18 PF4 bidirectional 5 V tolerant general-purpose I/O PF4 with alternate function EVENTOUT.
19 PF5 bidirectional 5 V tolerant general-purpose I/O PF5 with alternate function EVENTOUT.
20 PA4 bidirectional General-purpose I/O PA4 with alternates SPI0_NSS, USART1_CK, TIMER13_CH0, SPI1_NSS and analog input ADC_IN4.
21 PA5 bidirectional General-purpose I/O PA5 with alternates SPI0_SCK, TIMER1_CH0, TIMER1_ETI and analog input ADC_IN5.
22 PA6 bidirectional General-purpose I/O PA6 with alternates SPI0_MISO, TIMER2_CH0, TIMER0_BKIN, TIMER15_CH0, EVENTOUT and analog input ADC_IN6.
23 PA7 bidirectional General-purpose I/O PA7 with alternates SPI0_MOSI, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0, EVENTOUT and analog input ADC_IN7.
24 PC4 bidirectional General-purpose I/O PC4 with alternate function EVENTOUT and analog input ADC_IN14.
25 PC5 bidirectional General-purpose I/O PC5 with analog input ADC_IN15 and wakeup WKUP4.
26 PB0 bidirectional General-purpose I/O PB0 with alternates TIMER2_CH2, TIMER0_CH1_ON, USART1_RX, EVENTOUT and analog input ADC_IN8 (USART1_RX alternate applies to RB/8/6 devices per footnote 4).
27 PB1 bidirectional General-purpose I/O PB1 with alternates TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON, SPI1_SCK and analog input ADC_IN9.
28 PB2 bidirectional 5 V tolerant general-purpose I/O PB2 with no alternate function listed in the datasheet.
29 PB10 bidirectional 5 V tolerant general-purpose I/O PB10 with alternates I2C1_SCL, TIMER1_CH2 and SPI1_IO2.
30 PB11 bidirectional 5 V tolerant general-purpose I/O PB11 with alternates I2C1_SDA, TIMER1_CH3, EVENTOUT and SPI1_IO3.
31 VSS power_in Digital ground (default function VSS).
32 VDD power_in Digital supply (default function VDD).
33 PB12 bidirectional 5 V tolerant general-purpose I/O PB12 with alternates SPI1_NSS, TIMER0_BKIN, I2C1_SMBA and EVENTOUT.
34 PB13 bidirectional 5 V tolerant general-purpose I/O PB13 with alternates SPI1_SCK and TIMER0_CH0_ON.
35 PB14 bidirectional 5 V tolerant general-purpose I/O PB14 with alternates SPI1_MISO, TIMER0_CH1_ON and TIMER14_CH0.
36 PB15 bidirectional 5 V tolerant general-purpose I/O PB15 with alternates SPI1_MOSI, TIMER0_CH2_ON, TIMER14_CH0_ON, TIMER14_CH1, RTC_REFIN and wakeup WKUP6.
37 PC6 bidirectional 5 V tolerant general-purpose I/O PC6 with alternate function TIMER2_CH0.
38 PC7 bidirectional 5 V tolerant general-purpose I/O PC7 with alternate function TIMER2_CH1.
39 PC8 bidirectional 5 V tolerant general-purpose I/O PC8 with alternate function TIMER2_CH2.
40 PC9 bidirectional 5 V tolerant general-purpose I/O PC9 with alternate function TIMER2_CH3.
41 PA8 bidirectional 5 V tolerant general-purpose I/O PA8 with alternates USART0_CK, TIMER0_CH0, CK_OUT, USART1_TX, EVENTOUT and CTC_SYNC.
42 PA9 bidirectional 5 V tolerant general-purpose I/O PA9 with alternates USART0_TX, TIMER0_CH1, TIMER14_BKIN and I2C0_SCL.
43 PA10 bidirectional 5 V tolerant general-purpose I/O PA10 with alternates USART0_RX, TIMER0_CH2, TIMER16_BKIN and I2C0_SDA.
44 PA11 bidirectional 5 V tolerant general-purpose I/O PA11 with alternates USART0_CTS, TIMER0_CH3, EVENTOUT and SPI1_IO2.
45 PA12 bidirectional 5 V tolerant general-purpose I/O PA12 with alternates USART0_RTS, TIMER0_ETI, EVENTOUT and SPI1_IO3.
46 PA13 bidirectional 5 V tolerant general-purpose I/O PA13 with alternates IFRP_OUT, SWDIO and SPI1_MISO.
47 PF6 bidirectional 5 V tolerant general-purpose I/O PF6 with alternate function I2C1_SCL.
48 PF7 bidirectional 5 V tolerant general-purpose I/O PF7 with alternate function I2C1_SDA.
49 PA14 bidirectional 5 V tolerant general-purpose I/O PA14 with alternates USART1_TX, SWCLK and SPI1_MOSI.
50 PA15 bidirectional 5 V tolerant general-purpose I/O PA15 with alternates SPI0_NSS, USART1_RX, TIMER1_CH0, TIMER1_ETI, SPI1_NSS and EVENTOUT.
51 PC10 bidirectional 5 V tolerant general-purpose I/O PC10 with no alternate function listed in the datasheet.
52 PC11 bidirectional 5 V tolerant general-purpose I/O PC11 with no alternate function listed in the datasheet.
53 PC12 bidirectional 5 V tolerant general-purpose I/O PC12 with no alternate function listed in the datasheet.
54 PD2 bidirectional 5 V tolerant general-purpose I/O PD2 with alternate function TIMER2_ETI.
55 PB3 bidirectional 5 V tolerant general-purpose I/O PB3 with alternates SPI0_SCK, TIMER1_CH1 and EVENTOUT.
56 PB4 bidirectional 5 V tolerant general-purpose I/O PB4 with alternates SPI0_MISO, TIMER2_CH0 and EVENTOUT.
57 PB5 bidirectional 5 V tolerant general-purpose I/O PB5 with alternates SPI0_MOSI, I2C0_SMBA, TIMER15_BKIN, TIMER2_CH1 and wakeup WKUP5.
58 PB6 bidirectional 5 V tolerant general-purpose I/O PB6 with alternates I2C0_SCL, USART0_TX and TIMER15_CH0_ON.
59 PB7 bidirectional 5 V tolerant general-purpose I/O PB7 with alternates I2C0_SDA, USART0_RX and TIMER16_CH0_ON.
60 BOOT0 input Boot mode selection input (default function BOOT0).
61 PB8 bidirectional 5 V tolerant general-purpose I/O PB8 with alternates I2C0_SCL and TIMER15_CH0.
62 PB9 bidirectional 5 V tolerant general-purpose I/O PB9 with alternates I2C0_SDA, IFRP_OUT, TIMER16_CH0 and EVENTOUT.
63 VSS power_in Digital ground (default function VSS).
64 VDD power_in Digital supply (default function VDD).

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package LQFP-64(10x10)
Category Embedded Processors & Controllers
Pins 64

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
External voltage range (relative to VSS) VDD -0.3 3.6 V Printed as VSS - 0.3 to VSS + 3.6 45
External analog supply voltage (relative to VSSA) VDDA -0.3 3.6 V Printed as VSSA - 0.3 to VSSA + 3.6 45
External battery supply voltage (relative to VSS) VBAT -0.3 3.6 V Printed as VSS - 0.3 to VSS + 3.6 45
Input voltage on 5V tolerant pin VIN -0.3 V Printed max is VDD + 3.6; VIN maximum value cannot exceed 5.5 V 45
Input voltage on other I/O VIN -0.3 3.6 V 45
Variations between different VDD power pins /ΔVDDx/ 50 mV 45
Variations between different ground pins /VSSX −VSS/ 50 mV 45
Maximum current for GPIO pin IIO -25 25 mA 45
Operating temperature range for grade 6 device TA -40 85 °C Grade 6 device (T6 suffix) 45
Power dissipation of LQFP64 PD 647 mW TA = 85°C, grade 6 devices 45
Storage temperature range TSTG -65 150 °C 45
Maximum junction temperature TJ 125 °C 45
Supply voltage VDD 2.6 3.3 3.6 V 46
Analog supply voltage VDDA 2.6 3.3 3.6 V Same as VDD 46
Battery supply voltage VBAT 1.8 3.6 V 46
AHB1 clock frequency fHCLK1 0 84 MHz 46
AHB2 clock frequency fHCLK2 0 84 MHz 46
APB1 clock frequency fAPB1 0 42 MHz 46
APB2 clock frequency fAPB2 0 42 MHz 46
VDD rise time rate tVDD 0 μs /V Printed max is ∞ 46
VDD fall time rate tVDD 20 μs /V Printed max is ∞ 46
Electrostatic discharge voltage (human body model) VESD(HBM) 6000 V TA = 25 °C; JS-001-2017 55
Electrostatic discharge voltage (charge device model) VESD(CDM) 2000 V TA = 25 °C; JS-002-2018 55
Static latch-up I-test LU -200 200 mA TA = 25 °C; JESD78D 55
Vsupply over voltage 5.4 V 55
Crystal or ceramic frequency (HXTAL) fHXTAL 4 8 32 MHz 2.6 V ≤ VDD ≤ 3.6 V 55
Recommended matching capacitance on OSCIN and OSCOUT CHXTAL 20 30 pF 55
Crystal or ceramic duty cycle (HXTAL) Ducy(HXTAL) 30 50 70 % 55
External clock source or oscillator frequency (HXTAL bypass) fHXTAL_ext 1 8 50 MHz VDD = 3.3 V 55
OSCIN high or low time (HXTAL bypass) tH/L(HXTAL) 5 ns 56
OSCIN rise or fall time (HXTAL bypass) tR/F(HXTAL) 10 ns 56
External clock source or oscillator frequency (LXTAL bypass) fLXTAL_ext 32.768 1000 kHz VDD = 3.3 V 55
OSC32IN high or low time (LXTAL bypass) tH/L(LXTAL) 450 ns 56
OSC32IN rise or fall time (LXTAL bypass) tR/F(LXTAL) 50 ns 56
Crystal or ceramic duty cycle (LXTAL) Ducy(LXTAL) 30 70 % 55
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -0.62 0.46 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C for grade 6 devices 57
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -1 1 % VDD = VDDA = 3.3 V, TA = 25 °C 57
IRC28M oscillator frequency accuracy, factory-trimmed ACCIRC28M -0.86 0.9 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C for grade 6 devices 58
IRC28M oscillator frequency accuracy, factory-trimmed ACCIRC28M -1 1 % VDD = VDDA = 3.3 V, TA = 25 °C 58
IRC48M oscillator frequency accuracy, factory-trimmed ACCIRC48M -0.81 0.35 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C for grade 6 devices 58
IRC48M oscillator frequency accuracy, factory-trimmed ACCIRC48M -2 2 % VDD = VDDA = 3.3 V, TA = 25 °C 58
PLL input clock frequency fPLLIN 1 25 MHz 59
PLL output clock frequency fPLLOUT 16 84 MHz 59
PLL VCO output clock frequency fVCO 84 MHz 59
PLL lock time tLOCK 300 μs 59
Number of guaranteed program/erase cycles before failure (Endurance) PECYC 100 kcycles 59
Word programming time tPROG 37.5 86 μs TA range 59
Page erase time tERASE 45 300 ms 59
Mass erase time tMERASE(64KB) 0.5 1.6 s 59
Read time at data flash area tREAD 56 3536 hclks 59
Internal pull-up resistor (all pins) RPU 30 40 50 kΩ All pins VIN = VSS 61
Internal pull-down resistor (all pins) RPD 30 40 50 kΩ All pins VIN = VDD 61
ADC clock fADC 0.1 36 MHz 62
Sampling rate, 12-bit fS 0.007 2.57 MSPS 12-bit 62
Sampling time ts 0.04 6.65 μs fADC = 36 MHz 62
External input impedance RAIN 171 kΩ See Equation 1 62
Startup time tSU 1 μs 62
Thermal resistance, junction-to-ambient, LQFP64 θJA 61.8 °C/W Natural convection, 2S2P PCB 81
Thermal resistance, junction-to-board, LQFP64 θJB 42.83 °C/W Cold plate, 2S2P PCB 81
Thermal resistance, junction-to-case, LQFP64 θJC 21.98 °C/W Cold plate, 2S2P PCB 82

CAD (KiCad official)

  • Symbol: GD32F330RBT6
  • Footprint: Package_QFP:LQFP-64_10x10mm_P0.5mm
  • 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
  • 3D model files: gd32f330rbt6-etched.step / gd32f330rbt6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd32f330rbt6.step / gd32f330rbt6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (86 pp, sha256 c53f1682d7f2fa42, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF