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GD32F310K8T6

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GigaDevice Semicon Beijing Microcontroller Units (MCUs/MPUs/SOCs), LQFP-32(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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GD32F310K8T6

GigaDevice Semicon Beijing · Microcontroller Units (MCUs/MPUs/SOCs) · LQFP-32(7x7)

GD32F310K8T6 from GigaDevice Semicon Beijing, in a LQFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Default function VDD, the main supply pin of the device.
2 PF0-OSCIN bidirectional Default PF0, alternate CTC_SYNC, additional OSCIN; 5 V tolerant I/O.
3 PF1-OSCOUT bidirectional Default PF1, additional OSCOUT; 5 V tolerant I/O.
4 NRST bidirectional Reset pin, default function NRST.
5 VDDA power_in Default function VDDA, the analog supply pin.
6 PA0-WKUP bidirectional Default PA0; alternates USART1_CTS, I2C1_SCL; additional ADC_IN0, RTC_TAMP1, WKUP0.
7 PA1 bidirectional Default PA1; alternates USART1_RTS, I2C1_SDA, EVENTOUT; additional ADC_IN1.
8 PA2 bidirectional Default PA2; alternates USART1_TX, TIMER14_CH0; additional ADC_IN2.
9 PA3 bidirectional Default PA3; alternates USART1_RX, TIMER14_CH1; additional ADC_IN3.
10 PA4 bidirectional Default PA4; alternates SPI0_NSS, I2S0_WS, USART1_CK, TIMER13_CH0, SPI1_NSS; additional ADC_IN4.
11 PA5 bidirectional Default PA5; alternates SPI0_SCK, I2S0_CK; additional ADC_IN5.
12 PA6 bidirectional Default PA6; alternates SPI0_MISO, I2S0_MCK, TIMER2_CH0, TIMER0_BRKIN, TIMER15_CH0, EVENTOUT; additional ADC_IN6.
13 PA7 bidirectional Default PA7; alternates SPI0_MOSI, I2S0_SD, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0, EVENTOUT; additional ADC_IN7.
14 PB0 bidirectional Default PB0; alternates TIMER2_CH2, TIMER0_CH1_ON, USART1_RX, EVENTOUT; additional ADC_IN8.
15 PB1 bidirectional Default PB1; alternates TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON, SPI1_SCK; additional ADC_IN9.
16 VSS power_in Default function VSS, the ground pin.
17 VDD power_in Default function VDD, the main supply pin of the device.
18 PA8 bidirectional 5 V tolerant I/O; default PA8; alternates USART0_CK, TIMER0_CH0, CK_OUT, USART1_TX, EVENTOUT, CTC_SYNC.
19 PA9 bidirectional 5 V tolerant I/O; default PA9; alternates USART0_TX, TIMER0_CH1, TIMER14_BRKIN, I2C0_SCL.
20 PA10 bidirectional 5 V tolerant I/O; default PA10; alternates USART0_RX, TIMER0_CH2, TIMER16_BRKIN, I2C0_SDA.
21 PA11 bidirectional 5 V tolerant I/O; default PA11; alternates USART0_CTS, TIMER0_CH3, EVENTOUT, SPI1_IO2.
22 PA12 bidirectional 5 V tolerant I/O; default PA12; alternates USART0_RTS, TIMER0_ETI, EVENTOUT, SPI1_IO3.
23 PA13 bidirectional 5 V tolerant I/O; default PA13; alternates SWDIO, IFRP_OUT, SPI1_MISO.
24 PA14 bidirectional 5 V tolerant I/O; default PA14; alternates USART1_TX, SWCLK, SPI1_MOSI.
25 PA15 bidirectional 5 V tolerant I/O; default PA15; alternates SPI0_NSS, I2S0_WS, USART1_RX, SPI1_NSS, EVENTOUT.
26 PB3 bidirectional 5 V tolerant I/O; default PB3; alternates SPI0_SCK, I2S0_CK, EVENTOUT.
27 PB4 bidirectional 5 V tolerant I/O; default PB4; alternates SPI0_MISO, I2S0_MCK, TIMER2_CH0, EVENTOUT.
28 PB5 bidirectional 5 V tolerant I/O; default PB5; alternates SPI0_MOSI, I2S0_SD, I2C0_SMBA, TIMER15_BRKIN, TIMER2_CH1; additional WKUP5.
29 PB6 bidirectional 5 V tolerant I/O; default PB6; alternates I2C0_SCL, USART0_TX, TIMER15_CH0_ON.
30 PB7 bidirectional 5 V tolerant I/O; default PB7; alternates I2C0_SDA, USART0_RX, TIMER16_CH0_ON.
31 BOOT0 input Default function BOOT0, the boot mode select input.
32 VSS power_in Default function VSS, the ground pin.

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package LQFP-32(7x7)
Category Single Chip Microcomputer/Microcontroller
Pins 32

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating temperature range TA -40 85 °C 39
Storage temperature range TSTG -65 150 °C 39
Maximum junction temperature TJ 125 °C 39
Power dissipation of LQFP32 PD 724 mW TA = 85°C 39
Input voltage on other I/O VIN 3.6 V 39
Maximum current for GPIO pin IIO -25 25 mA 39
Variations between different VDD power pins /ΔVDDx/ 50 mV 39
Variations between different ground pins /VSSX−VSS/ 50 mV 39
AHB1 clock frequency fHCLK1 0 72 MHz 32
APB1 clock frequency fAPB1 0 36 MHz 32
Crystal or ceramic frequency fHXTAL 4 8 32 MHz 2.6 V ≤ VDD ≤ 3.6 V 40
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -2 2 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 42
IRC28M oscillator frequency accuracy, factory-trimmed ACCIRC28M -4 4 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 43
IRC48M oscillator frequency accuracy, factory-trimmed ACCIRC48M -4 4 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 43
PLL input clock frequency fPLLIN 1 25 MHz 44
Low level output voltage for 8 IO pins (each IIO = +8 mA) VOL 0.19 V VDD = 2.6 V, each IIO = +8 mA 45
Low level output voltage for 8 IO pins (each IIO = +8 mA) VOL 0.17 V VDD = 3.3 V, each IIO = +8 mA 45
Low level output voltage for 8 IO pins (each IIO = +20 mA) VOL 0.5 V VDD = 2.6 V, each IIO = +20 mA 45
High level output voltage for 8 IO pins (each IIO = +20 mA) VOH 2 V VDD = 2.6 V, each IIO = +20 mA 46
ADC operating voltage VDDA 2.6 3.3 3.6 V 47
SCK clock frequency fSCK 18 MHz 50
Data input setup time (SPI master mode) tSU(MI) 1 ns 50
Data input hold time (SPI master mode) tH(MI) 0 ns 50
SCK clock frequency (USART) fSCK 36 MHz fPCLKx = 72 MHz 54
Timer resolution time tres 1 tTIMERxCLK 54
Timer external clock frequency fEXT 0 36 MHz fTIMERxCLK = 72 MHz 54

CAD (KiCad official)

  • Symbol: GD32F310K8T6
  • Footprint: Package_QFP:LQFP-32_7x7mm_P0.8mm
  • 3D model: LQFP-32(7x7) (KiCad packages3D, STEP)
  • 3D model files: gd32f310k8t6-etched.step / gd32f310k8t6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd32f310k8t6.step / gd32f310k8t6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (78 pp, sha256 bd7f1b34d0ebdf35, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF