# GD32F307RGT6

**GigaDevice Semicon Beijing** · Microcontrollers (MCU/MPU/SOC) · LQFP-64(10x10)

GD32F307RGT6 from GigaDevice Semicon Beijing, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VBAT | power_in | Backup-domain supply pin (default function VBAT) for the RTC and backup registers. |
| 2 | PC13-TAMPER-RTC | bidirectional | General-purpose I/O PC13 (default) with alternate function TAMPER-RTC. |
| 3 | PC14-OSC32IN | bidirectional | General-purpose I/O PC14 (default) with alternate function OSC32IN, the low-speed crystal input. |
| 4 | PC15-OSC32OUT | bidirectional | General-purpose I/O PC15 (default) with alternate function OSC32OUT, the low-speed crystal output. |
| 5 | OSCIN | input | High-speed crystal oscillator input (default OSCIN), remappable to PD0; PD0/PD1 cannot be used for EXTI in this package. |
| 6 | OSCOUT | output | High-speed crystal oscillator output (default OSCOUT), remappable to PD1; PD0/PD1 cannot be used for EXTI in this package. |
| 7 | NRST | bidirectional | Active-low reset pin (default NRST) for the device. |
| 8 | PC0 | bidirectional | General-purpose I/O PC0 with alternate function ADC01_IN10. |
| 9 | PC1 | bidirectional | General-purpose I/O PC1 with alternate functions ADC01_IN11 and ENET_MDC. |
| 10 | PC2 | bidirectional | General-purpose I/O PC2 with alternate functions ADC01_IN12 and ENET_MII_TXD2. |
| 11 | PC3 | bidirectional | General-purpose I/O PC3 with alternate functions ADC01_IN13 and ENET_MII_TX_CLK. |
| 12 | VSSA | power_in | Analog ground pin (default VSSA). |
| 13 | VDDA | power_in | Analog supply pin (default VDDA) for the ADC, DAC and LVD. |
| 14 | PA0-WKUP | bidirectional | General-purpose I/O PA0 (default) with alternate functions WKUP, USART1_CTS, ADC01_IN0, TIMER1_CH0, TIMER1_ETI, TIMER4_CH0, TIMER7_ETI (GD32F307RG note 4: available in RE/G only), and ENET_MII_CRS. |
| 15 | PA1 | bidirectional | General-purpose I/O PA1 with alternate functions USART1_RTS, ADC01_IN1, TIMER1_CH1, TIMER4_CH1, ENET_MII_RX_CLK and ENET_RMII_REF_CLK. |
| 16 | PA2 | bidirectional | General-purpose I/O PA2 with alternate functions USART1_TX, ADC01_IN2, TIMER1_CH2, TIMER4_CH2, TIMER8_CH0, ENET_MDIO and SPI0_IO2. |
| 17 | PA3 | bidirectional | General-purpose I/O PA3 with alternate functions USART1_RX, ADC01_IN3, TIMER1_CH3, TIMER4_CH3, TIMER8_CH1, ENET_MII_COL and SPI0_IO3. |
| 18 | VSS_4 | power_in | Digital ground pin (default VSS_4). |
| 19 | VDD_4 | power_in | Digital supply pin (default VDD_4). |
| 20 | PA4 | bidirectional | General-purpose I/O PA4 with alternate functions SPI0_NSS, USART1_CK, ADC01_IN4 and DAC_OUT0; remap to SPI2_NSS and I2S2_WS. |
| 21 | PA5 | bidirectional | General-purpose I/O PA5 with alternate functions SPI0_SCK, ADC01_IN5 and DAC_OUT1. |
| 22 | PA6 | bidirectional | General-purpose I/O PA6 with alternate functions SPI0_MISO, ADC01_IN6, TIMER2_CH0, TIMER7_BRKIN, TIMER12_CH0; remap to TIMER0_BRKIN. |
| 23 | PA7 | bidirectional | General-purpose I/O PA7 with alternate functions SPI0_MOSI, ADC01_IN7, TIMER2_CH1, TIMER7_CH0_ON, TIMER13_CH0, ENET_MII_RX_DV and ENET_RMII_CRS_DV; remap to TIMER0_CH0_ON. |
| 24 | PC4 | bidirectional | General-purpose I/O PC4 with alternate functions ADC01_IN14, ENET_MII_RXD0 and ENET_RMII_RXD0. |
| 25 | PC5 | bidirectional | General-purpose I/O PC5 with alternate functions ADC01_IN15, ENET_MII_RXD1 and ENET_RMII_RXD1. |
| 26 | PB0 | bidirectional | General-purpose I/O PB0 with alternate functions ADC01_IN8, TIMER2_CH2, TIMER7_CH1_ON and ENET_MII_RXD2; remap to TIMER0_CH1_ON. |
| 27 | PB1 | bidirectional | General-purpose I/O PB1 with alternate functions ADC01_IN9, TIMER2_CH3, TIMER7_CH2_ON and ENET_MII_RXD3; remap to TIMER0_CH2_ON. |
| 28 | PB2 | bidirectional | 5 V tolerant general-purpose I/O PB2 (default), which also serves as BOOT1. |
| 29 | PB10 | bidirectional | 5 V tolerant general-purpose I/O PB10 with alternate functions I2C1_SCL, USART2_TX and ENET_MII_RX_ER; remap to TIMER1_CH2. |
| 30 | PB11 | bidirectional | 5 V tolerant general-purpose I/O PB11 with alternate functions I2C1_SDA, USART2_RX, ENET_MII_TX_EN and ENET_RMII_TX_EN; remap to TIMER1_CH3. |
| 31 | VSS_1 | power_in | Digital ground pin (default VSS_1). |
| 32 | VDD_1 | power_in | Digital supply pin (default VDD_1). |
| 33 | PB12 | bidirectional | 5 V tolerant general-purpose I/O PB12 with alternate functions SPI1_NSS, I2C1_SMBA, USART2_CK, TIMER0_BRKIN, I2S1_WS, CAN1_RX, ENET_MII_TXD0 and ENET_RMII_TXD0. |
| 34 | PB13 | bidirectional | 5 V tolerant general-purpose I/O PB13 with alternate functions SPI1_SCK, USART2_CTS, TIMER0_CH0_ON, I2S1_CK, CAN1_TX, ENET_MII_TXD1 and ENET_RMII_TXD1. |
| 35 | PB14 | bidirectional | 5 V tolerant general-purpose I/O PB14 with alternate functions SPI1_MISO, USART2_RTS, TIMER0_CH1_ON and TIMER11_CH0 (available in GD32F307RG devices). |
| 36 | PB15 | bidirectional | 5 V tolerant general-purpose I/O PB15 with alternate functions SPI1_MOSI, TIMER0_CH2_ON, I2S1_SD and TIMER11_CH1 (available in GD32F307RG devices). |
| 37 | PC6 | bidirectional | 5 V tolerant general-purpose I/O PC6 with alternate functions I2S1_MCK and TIMER7_CH0 (note 4); remap to TIMER2_CH0. |
| 38 | PC7 | bidirectional | 5 V tolerant general-purpose I/O PC7 with alternate functions I2S2_MCK and TIMER7_CH1 (note 4); remap to TIMER2_CH1. |
| 39 | PC8 | bidirectional | 5 V tolerant general-purpose I/O PC8 with alternate function TIMER7_CH2 (note 4); remap to TIMER2_CH2. |
| 40 | PC9 | bidirectional | 5 V tolerant general-purpose I/O PC9 with alternate function TIMER7_CH3 (note 4); remap to TIMER2_CH3. |
| 41 | PA8 | bidirectional | 5 V tolerant general-purpose I/O PA8 with alternate functions USART0_CK, TIMER0_CH0, CK_OUT0, USBFS_SOF and CTC_SYNC. |
| 42 | PA9 | bidirectional | 5 V tolerant general-purpose I/O PA9 with alternate functions USART0_TX, TIMER0_CH1 and USBFS_VBUS. |
| 43 | PA10 | bidirectional | 5 V tolerant general-purpose I/O PA10 with alternate functions USART0_RX, TIMER0_CH2 and USBFS_ID. |
| 44 | PA11 | bidirectional | 5 V tolerant general-purpose I/O PA11 with alternate functions USART0_CTS, CAN0_RX, USBFS_DM and TIMER0_CH3. |
| 45 | PA12 | bidirectional | 5 V tolerant general-purpose I/O PA12 with alternate functions USART0_RTS, USBFS_DP, CAN0_TX and TIMER0_ETI. |
| 46 | PA13 | bidirectional | 5 V tolerant pin with default function JTMS/SWDIO, remappable to general-purpose I/O PA13. |
| 47 | VSS_2 | power_in | Digital ground pin (default VSS_2). |
| 48 | VDD_2 | power_in | Digital supply pin (default VDD_2). |
| 49 | PA14 | bidirectional | 5 V tolerant pin with default function JTCK/SWCLK, remappable to general-purpose I/O PA14. |
| 50 | PA15 | bidirectional | 5 V tolerant pin with default function JTDI and alternate functions SPI2_NSS and I2S2_WS; remaps include TIMER1_CH0, TIMER1_ETI, PA15 and SPI0_NSS. |
| 51 | PC10 | bidirectional | 5 V tolerant general-purpose I/O PC10 with alternate function UART3_TX; remaps include USART2_TX, SPI2_SCK and I2S2_CK. |
| 52 | PC11 | bidirectional | 5 V tolerant general-purpose I/O PC11 with alternate function UART3_RX; remaps include USART2_RX and SPI2_MISO. |
| 53 | PC12 | bidirectional | 5 V tolerant general-purpose I/O PC12 with alternate function UART4_TX; remaps include USART2_CK, SPI2_MOSI and I2S2_SD. |
| 54 | PD2 | bidirectional | 5 V tolerant general-purpose I/O PD2 with alternate functions TIMER2_ETI and UART4_RX. |
| 55 | PB3 | bidirectional | 5 V tolerant pin with default function JTDO, alternate functions SPI2_SCK and I2S2_CK; remaps include PB3, TRACESWO, TIMER1_CH1 and SPI0_SCK. |
| 56 | PB4 | bidirectional | 5 V tolerant pin with default function NJTRST, alternate function SPI2_MISO; remaps include TIMER2_CH0, PB4 and SPI0_MISO. |
| 57 | PB5 | bidirectional | General-purpose I/O PB5 with alternate functions I2C0_SMBA, SPI2_MOSI, I2S2_SD, ENET_MII_PPS_OUT and ENET_RMII_PPS_OUT; remaps include TIMER2_CH1, SPI0_MOSI and CAN1_RX. |
| 58 | PB6 | bidirectional | 5 V tolerant general-purpose I/O PB6 with alternate functions I2C0_SCL and TIMER3_CH0; remaps include USART0_TX, CAN1_TX and SPI0_IO2. |
| 59 | PB7 | bidirectional | 5 V tolerant general-purpose I/O PB7 with alternate functions I2C0_SDA and TIMER3_CH1; remaps include USART0_RX and SPI0_IO3. |
| 60 | BOOT0 | input | Boot mode selection input (default BOOT0). |
| 61 | PB8 | bidirectional | 5 V tolerant general-purpose I/O PB8 with alternate functions TIMER3_CH2, TIMER9_CH0 (available in GD32F307RG devices) and ENET_MII_TXD3; remaps include I2C0_SCL and CAN0_RX. |
| 62 | PB9 | bidirectional | 5 V tolerant general-purpose I/O PB9 with alternate functions TIMER3_CH3 and TIMER10_CH0 (available in GD32F307RG devices); remaps include I2C0_SDA and CAN0_TX. |
| 63 | VSS_3 | power_in | Digital ground pin (default VSS_3). |
| 64 | VDD_3 | power_in | Digital supply pin (default VDD_3). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | GigaDevice Semicon Beijing |
| Package | LQFP-64(10x10) |
| Category | Embedded Processors & Controllers |
| Pins | 64 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VDD | 2.6 | 3.3 | 3.6 | V |  | 49 |
| Analog supply voltage | VDDA | 2.6 | 3.3 | 3.6 | V | Same as VDD | 49 |
| Battery supply voltage | VBAT | 1.8 |  | 3.6 | V |  | 49 |
| AHB clock frequency | fHCLK |  |  | 120 | MHz |  | 50 |
| APB1 clock frequency | fAPB1 |  |  | 60 | MHz |  | 50 |
| APB2 clock frequency | fAPB2 |  |  | 120 | MHz |  | 50 |
| VDD rise time rate (max printed as ∞) | tVDD | 0 |  |  | μs/V |  | 50 |
| VDD fall time rate (max printed as ∞) | tVDD | 20 |  |  | μs/V |  | 50 |
| Maximum current for GPIO pins | IIO | -25 |  | 25 | mA |  | 49 |
| Operating temperature range | TA | -40 |  | 85 | °C |  | 49 |
| Storage temperature range | TSTG | -55 |  | 150 | °C |  | 49 |
| Maximum junction temperature | TJ |  |  | 125 | °C |  | 49 |
| Variations between different VDD power pins | /ΔVDDx/ |  |  | 50 | mV |  | 49 |
| Variations between different ground pins | /VSSX −VSS/ |  |  | 50 | mV |  | 49 |
| Input voltage on other I/O | VIN |  |  | 3.6 | V |  | 49 |
| ESD voltage (human body model) | VESD(HBM) |  |  | 4000 | V | TA=25 °C; JESD22-A114 | 60 |
| ESD voltage (charge device model) | VESD(CDM) |  |  | 800 | V | TA=25 °C; JESD22-C101 | 60 |
| Static latch-up I-test | LU | -200 |  | 200 | mA | TA=25 °C; JESD78 | 60 |
| Vsupply over voltage (latch-up) |  |  |  | 5.4 | V |  | 60 |
| Crystal or ceramic frequency (HXTAL) | fHXTAL | 4 | 8 | 32 | MHz | 2.6 V ≤ VDD ≤ 3.6 V | 61 |
| Crystal or ceramic duty cycle (HXTAL) | Ducy(HXTAL) | 30 | 50 | 70 | % |  | 61 |
| External clock source or oscillator frequency (HXTAL bypass) | fHXTAL_ext | 1 |  | 50 | MHz | 2.6 V ≤ VDD ≤ 3.6 V | 61 |
| OSCIN high or low time (HXTAL bypass) | tH/L(HXTAL) | 5 |  |  | ns |  | 61 |
| OSCIN rise or fall time (HXTAL bypass) | tR/F(HXTAL) |  |  | 10 | ns |  | 61 |
| Duty cycle (HXTAL in bypass mode) | Ducy(HXTAL) | 40 |  | 60 | % |  | 61 |
| High speed internal oscillator (IRC8M) frequency accuracy, factory-trimmed | ACCIRC8M | -2.5 |  | 2.5 | % | VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C | 63 |
| High speed internal oscillator (IRC8M) frequency accuracy, factory-trimmed | ACCIRC8M | -1.8 |  | 1.8 | % | VDD = VDDA = 3.3 V, TA = 0 °C ~ +85 °C | 63 |
| High speed internal oscillator (IRC8M) frequency accuracy, factory-trimmed | ACCIRC8M | -1 |  | 1 | % | VDD = VDDA = 3.3 V, TA = 25 °C | 63 |
| IRC8M oscillator duty cycle | DucyIRC8M | 45 | 50 | 55 | % | VDD = VDDA = 3.3 V | 63 |
| Low speed internal oscillator (IRC40K) frequency | fIRC40K | 20 | 40 | 45 | kHz | VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C | 63 |
| High speed internal oscillator (IRC48M) frequency accuracy, factory-trimmed | ACCIRC48M | -4 |  | 5 | % | VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C | 64 |
| High speed internal oscillator (IRC48M) frequency accuracy, factory-trimmed | ACCIRC48M | -3 |  | 3 | % | VDD = VDDA = 3.3 V, TA = 0 °C ~ +85 °C | 64 |
| High speed internal oscillator (IRC48M) frequency accuracy, factory-trimmed | ACCIRC48M | -2 |  | 2 | % | VDD = VDDA = 3.3 V, TA = 25 °C | 64 |
| IRC48M oscillator duty cycle | DIRC48M | 45 | 50 | 55 | % | VDD = VDDA = 3.3 V | 64 |
| PLL input clock frequency | fPLLIN | 1 |  | 25 | MHz |  | 64 |
| PLL output clock frequency | fPLLOUT | 16 |  | 120 | MHz |  | 64 |
| PLL VCO output clock frequency | fVCO | 32 |  | 240 | MHz |  | 64 |
| PLL lock time | tLOCK |  |  | 300 | μs |  | 64 |
| Number of guaranteed program/erase cycles before failure (Endurance) | PECYC | 100 |  |  | kcycles | TA = -40 °C ~ +85 °C | 65 |
| Word programming time | tPROG |  | 37.5 | 86 | μs | TA = -40 °C ~ +85 °C | 65 |
| Low level output voltage for an IO pin | VOL |  |  | 0.17 | V | IIO = +8 mA; VDD = 2.6 V | 67 |
| Low level output voltage for an IO pin | VOL |  |  | 0.16 | V | IIO = +8 mA; VDD = 3.3 V | 67 |
| Low level output voltage for an IO pin | VOL |  |  | 0.15 | V | IIO = +8 mA; VDD = 3.6 V | 67 |
| Low level output voltage for an IO pin | VOL |  |  | 0.49 | V | IIO = +20 mA; VDD = 2.6 V | 67 |
| Low level output voltage for an IO pin | VOL |  |  | 0.4 | V | IIO = +20 mA; VDD = 3.3 V | 67 |
| Low level output voltage for an IO pin | VOL |  |  | 0.34 | V | IIO = +20 mA; VDD = 3.6 V | 67 |
| High level output voltage for an IO pin | VOH | 2.4 |  |  | V | IIO = +8 mA; VDD = 2.6 V | 67 |
| High level output voltage for an IO pin | VOH | 3.15 |  |  | V | IIO = +8 mA; VDD = 3.3 V | 67 |
| High level output voltage for an IO pin | VOH | 3.44 |  |  | V | IIO = +8 mA; VDD = 3.6 V | 67 |
| High level output voltage for an IO pin | VOH | 2.02 |  |  | V | IIO = +20 mA; VDD = 2.6 V | 67 |
| High level output voltage for an IO pin | VOH | 2.8 |  |  | V | IIO = +20 mA; VDD = 3.3 V | 67 |
| Internal pull-up resistor (all pins except PA10) | RPU | 30 | 40 | 50 | kΩ | VIN = VSS | 67 |
| Internal pull-down resistor (all pins except PA10) | RPD | 30 | 40 | 50 | kΩ | VIN = VDD | 67 |
| ADC clock | fADC | 0.1 |  | 40 | MHz |  | 69 |
| ADC sampling time | ts | 0.0375 |  | 5.99 | μs | fADC = 40 MHz | 69 |
| External input impedance | RAIN |  |  | 32.9 | kΩ | See Equation 1 | 69 |
| Resistive load with buffer ON (DAC) | RLOAD | 5 |  |  | kΩ | Resistive load with buffer ON | 70 |
| Load capacitance (DAC) | CLOAD |  |  | 50 | pF | No pin/pad capacitance included | 70 |
| Update rate (DAC) |  |  |  | 4 | MS/s | CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ | 71 |

## CAD (KiCad official)

- Symbol: `GD32F307RGT6`
- Footprint: `Package_QFP:LQFP-64_10x10mm_P0.5mm`
- 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
- 3D model files: `gd32f307rgt6-etched.step` / `gd32f307rgt6-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `gd32f307rgt6.step` / `gd32f307rgt6.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [GigaDevice Semicon Beijing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588944327149674496) (86 pp, sha256 `937b09f27297d4dd`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/gd32f307rgt6-datasheet.pdf)