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GD32F130F8P6TR

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GigaDevice Semicon Beijing Microcontrollers (MCU/MPU/SOC), TSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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GD32F130F8P6TR

GigaDevice Semicon Beijing · Microcontrollers (MCU/MPU/SOC) · TSSOP-20

GD32F130F8P6TR from GigaDevice Semicon Beijing, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT0 input Boot mode selection input with default function BOOT0; no alternate functions are listed for this pin.
2 PF0-OSCIN bidirectional 5 V tolerant GPIO PF0 (default function) that doubles as the OSCIN external oscillator input.
3 PF1-OSCOUT bidirectional 5 V tolerant GPIO PF1 (default function) that doubles as the OSCOUT external oscillator output.
4 NRST bidirectional Reset pin with default function NRST; no alternate functions are listed for this pin.
5 VDDA power_in Analog power supply pin (default function VDDA).
6 PA0-WKUP bidirectional GPIO PA0 that also provides ADC_IN0, RTC_TAMP1 and WKUP0 functions; alternates include USART0_CTS, USART1_CTS, TIMER1_CH0, TIMER1_ETI and I2C1_SCL.
7 PA1 bidirectional GPIO PA1 that also provides ADC_IN1; alternates include USART0_RTS, USART1_RTS, TIMER1_CH1, I2C1_SDA and EVENTOUT.
8 PA2 bidirectional GPIO PA2 that also provides ADC_IN2; alternates include USART0_TX, USART1_TX, TIMER1_CH2 and TIMER14_CH0.
9 PA3 bidirectional GPIO PA3 that also provides ADC_IN3; alternates include USART0_RX, USART1_RX, TIMER1_CH3 and TIMER14_CH1.
10 PA4 bidirectional GPIO PA4 that also provides ADC_IN4; alternates include SPI0_NSS, USART0_CK, USART1_CK, TIMER13_CH0 and SPI1_NSS.
11 PA5 bidirectional GPIO PA5 that also provides ADC_IN5; alternates include SPI0_SCK, TIMER1_CH0 and TIMER1_ETI.
12 PA6 bidirectional GPIO PA6 that also provides ADC_IN6; alternates include SPI0_MISO, TIMER2_CH0, TIMER0_BRKIN, TIMER15_CH0 and EVENTOUT.
13 PA7 bidirectional GPIO PA7 that also provides ADC_IN7; alternates include SPI0_MOSI, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0 and EVENTOUT.
14 PB1 bidirectional GPIO PB1 that also provides ADC_IN9; alternates include TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON and SPI1_SCK.
15 VSS power_in Ground pin (default function VSS).
16 VDD power_in Digital power supply pin (default function VDD).
17 PA9 bidirectional 5 V tolerant GPIO PA9; alternates include USART0_TX, TIMER0_CH1, TIMER14_BRKIN and I2C0_SCL.
18 PA10 bidirectional 5 V tolerant GPIO PA10; alternates include USART0_RX, TIMER0_CH2, TIMER16_BRKIN and I2C0_SDA.
19 PA13 bidirectional 5 V tolerant GPIO PA13; alternates include IFRP_OUT, SWDIO and SPI1_MISO.
20 PA14 bidirectional 5 V tolerant GPIO PA14; alternates include USART0_TX, USART1_TX, SWCLK and SPI1_MOSI.

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package TSSOP-20
Category Embedded Processors & Controllers
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
External voltage range (VDD) VDD -0.3 3.6 V 39
External analog supply voltage (VDDA) VDDA -0.3 3.6 V 39
External battery supply voltage (VBAT) VBAT -0.3 3.6 V 39
Input voltage on 5V tolerant pin VIN -0.3 V 39
Input voltage on other I/O VIN -0.3 4 V 39
Maximum current for GPIO pins IIO 25 mA 39
Operating temperature range TA -40 85 °C 39
Storage temperature range TSTG -55 150 °C 39
Maximum junction temperature TJ 125 °C 39
Supply voltage VDD 2.6 3.3 3.6 V 39
Analog supply voltage VDDA 2.6 3.3 3.6 V Same as VDD 39
Battery supply voltage VBAT 1.8 3.6 V 39
Power on reset threshold VPOR 2.32 2.4 2.48 V PDR_S=0 41
Power down reset threshold VPDR 2.27 2.35 2.43 V PDR_S=0 41
Power down reset threshold VPDR 1.72 1.8 1.88 V PDR_S=1 41
High speed crystal oscillator (HXTAL) frequency fHXTAL 4 8 32 MHz VDD=3.3V 42
Recommended load capacitance on OSCIN and OSCOUT CHXTAL 20 30 pF 42
Low speed crystal oscillator (LXTAL) frequency fLXTAL 32.768 1000 KHz VDD=VBAT=3.3V 43
Recommended load capacitance on OSC32IN and OSC32OUT CLXTAL 15 pF 43
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -2.5 1.5 % VDD=3.3V, TA=-40°C ~+105°C 43
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -1.2 1.2 % VDD=3.3V, TA=0°C ~ +85°C 43
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -1 1 % VDD=3.3V, TA=25°C 43
IRC8M oscillator operating current IDDIRC8M 80 100 μA VDD=3.3V, fIRC8M=8MHz 43
Internal 40KHz RC oscillator (IRC40K) frequency fIRC40K 30 40 60 KHz VDD=VBAT=3.3V, TA=-40°C ~ +85°C 43
IRC40K oscillator operating current IDDIRC40K 1 2 μA VDD=VBAT=3.3V, TA=25°C 43
PLL input clock frequency fPLLIN 1 8 25 MHz 44
PLL output clock frequency fPLL 16 72 MHz 44
Number of guaranteed program/erase cycles before failure (Endurance) PECYC 100 kcycles TA=-40°C ~ +85°C 44
Data retention time tRET 20 years TA=125°C 44
Word programming time tPROG 200 400 us TA=-40°C ~ +85°C 44
Page erase time tERASE 60 100 450 ms TA=-40°C ~ +85°C 44
Mass erase time tMERASE 3.2 9.6 s TA=-40°C ~ +85°C 44
Standard IO low level input voltage VIL -0.3 0.95 V VDD=2.6V 44
5V-tolerant IO low level input voltage VIL -0.3 0.9 V VDD=2.6V 44
Standard IO high level input voltage VIH 1.2 4 V VDD=2.6V 44
5V-tolerant IO high level input voltage VIH 1.5 5.5 V VDD=2.6V 44
Low level output voltage VOL 0.2 V VDD=2.6V 44
High level output voltage VOH 2.3 V VDD=2.6V 44
Internal pull-up resistor RPU 30 40 50 kΩ VIN=VSS 44
Internal pull-down resistor RPD 30 40 50 kΩ VIN=VDD 44
Operating voltage (ADC) VDDA 2.6 3.3 3.6 V 45
ADC input voltage range VIN 0 V 45
ADC clock fADC 0.6 14 MHz 45
Sampling rate fS 1 MHz 45
ADC conversion time fADCCONV 1 18 μs fADC =14MHz 45
Input sampling switch resistance RADC 0.2 kΩ 45
Electrostatic discharge voltage (human body model) VESD(HBM) 5000 V TA=25 °C; JESD22-A114 42
Electrostatic discharge voltage (charge device model) VESD(CDM) 500 V TA=25 °C; JESD22-C101 42
Static latch-up I-test LU -100 100 mA TA=25 °C; JESD78 42
Vsupply over voltage 5.4 V 42
SCK clock frequency (SPI) fSCK 18 MHz 45
SCK clock high time (SPI) tSCK(H) 19 ns 45
SCK clock low time (SPI) tSCK(L) 19 ns 45
Data output valid time (SPI master mode) tV(MO) 25 ns 45
Data output hold time (SPI master mode) tH(MO) 2 ns 45
Data input setup time (SPI master mode) tSU(MI) 5 ns 45
Data input hold time (SPI master mode) tH(MI) 5 ns 45
SCL clock frequency, standard mode fSCL 0 100 KHz Standard mode 46
SCL clock frequency, fast mode fSCL 0 400 KHz Fast mode 46

CAD (KiCad official)

  • Symbol: GD32F130F8P6TR
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: gd32f130f8p6tr-etched.step / gd32f130f8p6tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd32f130f8p6tr.step / gd32f130f8p6tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (53 pp, sha256 340185fd2f1ee604, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF