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GD32E230F6P6TR

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GigaDevice Semicon Beijing Microcontrollers (MCU/MPU/SOC), TSSOP-20. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs gd32e230f6p6tr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
gd32e230f6p6tr-etched.fit.json gd32e230f6p6tr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
gd32e230f6p6tr-etched.glb gd32e230f6p6tr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
gd32e230f6p6tr-etched.step gd32e230f6p6tr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
gd32e230f6p6tr.glb Publish 0.1.0 · Ray
gd32e230f6p6tr.kicad_mod Publish 0.1.0 · Ray
gd32e230f6p6tr.kicad_sym Publish 0.1.0 · Ray
gd32e230f6p6tr.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
gd32e230f6p6tr.step Publish 0.1.0 · Ray
package.json Publish 0.2.0 · Ray
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
page.json gd32e230f6p6tr: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray
README.md gd32e230f6p6tr: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray

GD32E230F6P6TR

GigaDevice Semicon Beijing · Microcontrollers (MCU/MPU/SOC) · TSSOP-20

GD32E230F6P6TR from GigaDevice Semicon Beijing, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT0 input Boot mode select input sampled at reset. Selects boot-from-main-flash, system-memory (bootloader), or SRAM together with the nBOOT1 option bit.
2 PF0-OSCIN bidirectional General-purpose I/O PF0 (5 V tolerant). Alternate: I2C0_SDA. Additional: OSCIN (HXTAL crystal input).
3 PF1-OSCOUT bidirectional General-purpose I/O PF1 (5 V tolerant). Alternate: I2C0_SCL. Additional: OSCOUT (HXTAL crystal output).
4 NRST bidirectional Active-low device reset. Bidirectional pin driven low internally on any reset source and can be driven low externally to reset the MCU.
5 VDDA power_in Analog supply for the ADC, comparators, reset block, and PLL. Operating range 2.6 V to 3.6 V; must be tied to VDD when analog blocks are used.
6 PA0-WKUP bidirectional General-purpose I/O PA0. Alternates: USART0_CTS/USART1_CTS, CMP_OUT, I2C1_SCL. Additional: ADC_IN0, CMP_IM6, RTC_TAMP1, WKUP0 (wake-up from Standby).
7 PA1 bidirectional General-purpose I/O PA1. Alternates: USART0_RTS/USART1_RTS, I2C1_SDA, EVENTOUT. Additional: ADC_IN1, CMP_IP.
8 PA2 bidirectional General-purpose I/O PA2. Alternates: USART0_TX/USART1_TX. Additional: ADC_IN2, CMP_IM7.
9 PA3 bidirectional General-purpose I/O PA3. Alternates: USART0_RX/USART1_RX. Additional: ADC_IN3.
10 PA4 bidirectional General-purpose I/O PA4. Alternates: SPI0_NSS, I2S0_WS, USART0_CK, USART1_CK, TIMER13_CH0, SPI1_NSS. Additional: ADC_IN4, CMP_IM4.
11 PA5 bidirectional General-purpose I/O PA5. Alternates: SPI0_SCK, I2S0_CK. Additional: ADC_IN5, CMP_IM5.
12 PA6 bidirectional General-purpose I/O PA6. Alternates: SPI0_MISO, I2S0_MCK, TIMER2_CH0, TIMER0_BRKIN, TIMER15_CH0, EVENTOUT, CMP_OUT. Additional: ADC_IN6.
13 PA7 bidirectional General-purpose I/O PA7. Alternates: SPI0_MOSI, I2S0_SD, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0, EVENTOUT. Additional: ADC_IN7.
14 PB1 bidirectional General-purpose I/O PB1. Alternates: TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON, SPI1_SCK. Additional: ADC_IN9.
15 VSS power_in Device ground / digital return (0 V).
16 VDD power_in Main digital supply, 2.6 V to 3.6 V. Powers the digital core, I/O ring, and embedded voltage regulator; decouple locally.
17 PA9 bidirectional General-purpose I/O PA9 (5 V tolerant). Alternates: USART0_TX, TIMER0_CH1, I2C0_SCL, CK_OUT.
18 PA10 bidirectional General-purpose I/O PA10 (5 V tolerant). Alternates: USART0_RX, TIMER0_CH2, TIMER16_BRKIN, I2C0_SDA.
19 PA13/SWDIO bidirectional PA13, default function SWDIO (Serial Wire Debug data). Alternates: IFRP_OUT, SPI1_MISO. 5 V tolerant.
20 PA14/SWCLK bidirectional PA14, default function SWCLK (Serial Wire Debug clock). Alternates: USART0_TX, USART1_TX, SPI1_MOSI. 5 V tolerant.

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package TSSOP-20
Category MCU
Pins 20

Ordering variants

Same part, different packaging or reel option.

  • GD32E230F6P6TR
  • GD32E230F6P6TRF8P6
  • GD32E230F6P6TRF8P6TR
  • GD32E230F6P6TRF4P6
  • GD32E230F6P6TRF4P6TR
  • GD32E230F6P6TRF6V6
  • GD32E230F6P6TRF6V6TR
  • GD32E230F6P6TRF8V6
  • GD32E230F6P6TRF8V6TR
  • GD32E230F6P6TRF4V6
  • GD32E230F6P6TRF4V6TR
  • GD32E230F6P6TRG6U6
  • GD32E230F6P6TRG8U6
  • GD32E230F6P6TRG4U6
  • GD32E230F6P6TRK6U6
  • GD32E230F6P6TRK8U6
  • GD32E230F6P6TRK4U6
  • GD32E230F6P6TRK6T6
  • GD32E230F6P6TRK8T6
  • GD32E230F6P6TRK4T6
  • GD32E230F6P6TRC6T6
  • GD32E230F6P6TRC8T6
  • GD32E230F6P6TRC4T6

CAD (KiCad official)

  • Symbol: GD32E230F6P6TR
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: gd32e230f6p6tr-etched.step / gd32e230f6p6tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd32e230f6p6tr.step / gd32e230f6p6tr.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
gd32e230f6p6tr.step 267 KB You want the bare part, or you mark your own boards.
gd32e230f6p6tr-etched.step 3.7 MB You want the part with GD32E230F6P6TR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 896 faces against 327 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (78 pp, sha256 61f9b2a8e15460f6, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF