component
GD32E230F6P6TR
Public Made by Adomby adom
GigaDevice Semicon Beijing Microcontrollers (MCU/MPU/SOC), TSSOP-20. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
← Commit history
gd32e230f6p6tr: backfill missing artifacts (variants)
2 files changed
+97−1
README.md+2@@ -40,6 +40,8 @@ GD32E230F6P6TR from GigaDevice Semicon Beijing, in a TSSOP-20. Pinout and pin de ## Ordering variants +Same part, different packaging or reel option.+ - `GD32E230F6P6TR` - `GD32E230F6P6TRF8P6` - `GD32E230F6P6TRF8P6TR`
page.json+95−1@@ -227,5 +227,99 @@ ], "visibility": { "public": true- }+ },+ "variants": [+ {+ "mpn": "GD32E230F6P6TR",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRF8P6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRF8P6TR",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRF4P6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRF4P6TR",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRF6V6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRF6V6TR",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRF8V6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRF8V6TR",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRF4V6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRF4V6TR",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRG6U6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRG8U6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRG4U6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRK6U6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRK8U6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRK4U6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRK6T6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRK8T6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRK4T6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRC6T6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRC8T6",+ "kind": "packaging"+ },+ {+ "mpn": "GD32E230F6P6TRC4T6",+ "kind": "packaging"+ }+ ] }