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GD32E230F4P6TR

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GigaDevice Semicon Beijing Microcontrollers (MCU/MPU/SOC), TSSOP-20. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

Schematic Symbol

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Datasheet

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Contents

README

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GD32E230F4P6TR

GigaDevice Semicon Beijing · Microcontrollers (MCU/MPU/SOC) · TSSOP-20

GD32E230F4P6TR from GigaDevice Semicon Beijing, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT0 input Boot-mode select input, sampled after reset to choose main flash or system memory boot.
2 PF0/OSCIN bidirectional General-purpose I/O port F bit 0 (5 V tolerant). Alternate: I2C0_SDA. Additional: HXTAL oscillator input (OSCIN).
3 PF1/OSCOUT bidirectional General-purpose I/O port F bit 1 (5 V tolerant). Alternate: I2C0_SCL. Additional: HXTAL oscillator output (OSCOUT).
4 NRST bidirectional Bidirectional active-low device reset. Internally pulled up; can be driven low externally to reset the MCU.
5 VDDA power_in Analog supply rail for ADC, comparators and reset block. 2.6 V-3.6 V; must be tied to VDD when analog blocks are used.
6 PA0-WKUP bidirectional GPIO PA0 with wake-up capability. Alternate: USART0_CTS, USART1_CTS, CMP_OUT, I2C1_SCL. Additional: ADC_IN0, CMP_IM6, RTC_TAMP1, WKUP0.
7 PA1 bidirectional GPIO PA1. Alternate: USART0_RTS/DE, USART1_RTS/DE, I2C1_SDA, EVENTOUT. Additional: ADC_IN1, CMP_IP.
8 PA2 bidirectional GPIO PA2. Alternate: USART0_TX, USART1_TX. Additional: ADC_IN2, CMP_IM7.
9 PA3 bidirectional GPIO PA3. Alternate: USART0_RX, USART1_RX. Additional: ADC_IN3.
10 PA4 bidirectional GPIO PA4. Alternate: SPI0_NSS, I2S0_WS, USART0_CK, USART1_CK, TIMER13_CH0, SPI1_NSS. Additional: ADC_IN4, CMP_IM4.
11 PA5 bidirectional GPIO PA5. Alternate: SPI0_SCK, I2S0_CK. Additional: ADC_IN5, CMP_IM5.
12 PA6 bidirectional GPIO PA6. Alternate: SPI0_MISO, I2S0_MCK, TIMER2_CH0, TIMER0_BRKIN, TIMER15_CH0, EVENTOUT, CMP_OUT. Additional: ADC_IN6.
13 PA7 bidirectional GPIO PA7. Alternate: SPI0_MOSI, I2S0_SD, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0, EVENTOUT. Additional: ADC_IN7.
14 PB1 bidirectional GPIO PB1. Alternate: TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON, SPI1_SCK. Additional: ADC_IN9.
15 VSS power_in Digital and analog ground reference (VSS/VSSA are internally shared on this package).
16 VDD power_in Main digital supply, 2.6 V-3.6 V. Requires a 100 nF decoupling capacitor to VSS.
17 PA9 bidirectional GPIO PA9 (5 V tolerant). Alternate: USART0_TX, TIMER0_CH1, I2C0_SCL, CK_OUT. Can be remapped to PA11 via SYSCFG_CFG0.
18 PA10 bidirectional GPIO PA10 (5 V tolerant). Alternate: USART0_RX, TIMER0_CH2, TIMER16_BRKIN, I2C0_SDA. Can be remapped to PA12 via SYSCFG_CFG0.
19 PA13/SWDIO bidirectional GPIO PA13 (5 V tolerant); after reset serves as Serial Wire Debug data (SWDIO). Alternate: SWDIO, IFRP_OUT, SPI1_MISO.
20 PA14/SWCLK bidirectional GPIO PA14 (5 V tolerant); after reset serves as Serial Wire Debug clock (SWCLK). Alternate: USART0_TX, USART1_TX, SWCLK, SPI1_MOSI.

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package TSSOP-20
Category MCU
Pins 20

Ordering variants

Same part, different packaging or reel option.

  • GD32E230F4P6TR
  • GD32E230F4P6TRF8P6
  • GD32E230F4P6TRF8P6TR
  • GD32E230F4P6TRF4U6
  • GD32E230F4P6TRF4U6TR
  • GD32E230F4P6TRF8U6
  • GD32E230F4P6TRF8U6TR
  • GD32E230F4P6TRG4U6
  • GD32E230F4P6TRG4U6TR
  • GD32E230F4P6TRG8U6
  • GD32E230F4P6TRG8U6TR
  • GD32E230F4P6TRK4U6
  • GD32E230F4P6TRK4U6TR
  • GD32E230F4P6TRK8U6
  • GD32E230F4P6TRK8U6TR
  • GD32E230F4P6TRK4T6
  • GD32E230F4P6TRK4T6TR
  • GD32E230F4P6TRK8T6
  • GD32E230F4P6TRK8T6TR
  • GD32E230F4P6TRC6T6
  • GD32E230F4P6TRC6T6TR
  • GD32E230F4P6TRC8T6
  • GD32E230F4P6TRC8T6TR

CAD (KiCad official)

  • Symbol: GD32E230F4P6TR
  • Footprint: Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm
  • 3D model: TSSOP-20 (KiCad packages3D, STEP)
  • 3D model files: gd32e230f4p6tr-etched.step / gd32e230f4p6tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd32e230f4p6tr.step / gd32e230f4p6tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (87 pp, sha256 8cbddebbf22a43b3, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF