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GD32E103C8T6

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GigaDevice Semicon Beijing Microcontrollers (MCU/MPU/SOC), LQFP-48(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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GD32E103C8T6

GigaDevice Semicon Beijing · Microcontrollers (MCU/MPU/SOC) · LQFP-48(7x7)

GD32E103C8T6 from GigaDevice Semicon Beijing, in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Power supply pin, default function VBAT.
2 PC13-TAMPER-RTC bidirectional GPIO PC13 by default, with alternate function RTC_TAMPER.
3 PC14-OSC32IN bidirectional GPIO PC14 by default, with alternate function OSC32IN.
4 PC15-OSC32OUT bidirectional GPIO PC15 by default, with alternate function OSC32OUT.
5 PD0-OSCIN input Default function OSCIN; can be remapped to GPIO PD0, and PD0 cannot be used for EXTI in this package.
6 PD1-OSCOUT output Default function OSCOUT; can be remapped to GPIO PD1, and PD1 cannot be used for EXTI in this package.
7 NRST bidirectional Reset pin, default function NRST.
8 VSSA power_in Analog ground, default function VSSA; VREF- is internally connected to VSSA in this package.
9 VDDA power_in Analog supply, default function VDDA; VREF+ is internally connected to VDDA in this package.
10 PA0-WKUP bidirectional GPIO PA0 by default; alternate functions WKUP, USART1_CTS, ADC01_IN0, TIMER1_CH0_ETI, TIMER4_CH0.
11 PA1 bidirectional GPIO PA1 by default; alternate functions USART1_RTS, ADC01_IN1, TIMER4_CH1, TIMER1_CH1.
12 PA2 bidirectional GPIO PA2 by default; alternate functions USART1_TX, TIMER4_CH2, ADC01_IN2, TIMER8_CH0, TIMER1_CH2, SPI0_IO2.
13 PA3 bidirectional GPIO PA3 by default; alternate functions USART1_RX, TIMER4_CH3, ADC01_IN3, TIMER1_CH3, TIMER8_CH1, SPI0_IO3.
14 PA4 bidirectional GPIO PA4 by default; alternate functions SPI0_NSS, USART1_CK, DAC_OUT0, ADC01_IN4; remap SPI2_NSS, I2S2_WS.
15 PA5 bidirectional GPIO PA5 by default; alternate functions SPI0_SCK, ADC01_IN5, DAC_OUT1.
16 PA6 bidirectional GPIO PA6 by default; alternate functions SPI0_MISO, ADC01_IN6, TIMER2_CH0, TIMER12_CH0; remap TIMER0_BKIN.
17 PA7 bidirectional GPIO PA7 by default; alternate functions SPI0_MOSI, ADC01_IN7, TIMER2_CH1, TIMER13_CH0; remap TIMER0_CH0_ON.
18 PB0 bidirectional GPIO PB0 by default; alternate functions ADC01_IN8, TIMER2_CH2; remap TIMER0_CH1_ON.
19 PB1 bidirectional GPIO PB1 by default; alternate functions ADC01_IN9, TIMER2_CH3; remap TIMER0_CH2_ON.
20 PB2 bidirectional 5V-tolerant GPIO PB2 by default, also used as BOOT1.
21 PB10 bidirectional 5V-tolerant GPIO PB10 by default; alternate functions I2C1_SCL, USART2_TX; remap TIMER1_CH2.
22 PB11 bidirectional 5V-tolerant GPIO PB11 by default; alternate functions I2C1_SDA, USART2_RX; remap TIMER1_CH3.
23 VSS_1 power_in Ground pin, default function VSS_1.
24 VDD_1 power_in Power supply pin, default function VDD_1.
25 PB12 bidirectional 5V-tolerant GPIO PB12 by default; alternate functions SPI1_NSS, I2S1_WS, I2C1_SMBA, USART2_CK, TIMER0_BKIN, CAN1_RX.
26 PB13 bidirectional 5V-tolerant GPIO PB13 by default; alternate functions SPI1_SCK, I2S1_CK, USART2_CTS, TIMER0_CH0_ON, CAN1_TX, I2C1_TXFRAME.
27 PB14 bidirectional 5V-tolerant GPIO PB14 by default; alternate functions SPI1_MISO, USART2_RTS, TIMER0_CH1_ON, TIMER11_CH0.
28 PB15 bidirectional 5V-tolerant GPIO PB15 by default; alternate functions SPI1_MOSI, I2S1_SD, TIMER0_CH2_ON, TIMER11_CH11 (as printed).
29 PA8 bidirectional 5V-tolerant GPIO PA8 by default; alternate functions USART0_CK, TIMER0_CH0, CK_OUT0, VCORE, USBFS_SOF, CTC_SYNC.
30 PA9 bidirectional 5V-tolerant GPIO PA9 by default; alternate functions USART0_TX, TIMER0_CH1, USBFS_VBUS.
31 PA10 bidirectional 5V-tolerant GPIO PA10 by default; alternate functions USART0_RX, TIMER0_CH2, USBFS_ID, V1REF.
32 PA11 bidirectional 5V-tolerant GPIO PA11 by default; alternate functions USART0_CTS, CAN0_RX, USBFS_DM, TIMER0_CH3.
33 PA12 bidirectional 5V-tolerant GPIO PA12 by default; alternate functions USART0_RTS, CAN0_TX, USBFS_DP, TIMER0_ETI.
34 PA13 bidirectional 5V-tolerant pin with default function JTMS/SWDIO; remap PA13.
35 VSS_2 power_in Ground pin, default function VSS_2.
36 VDD_2 power_in Power supply pin, default function VDD_2.
37 PA14 bidirectional 5V-tolerant pin with default function JTCK/SWCLK; remap PA14.
38 PA15 bidirectional 5V-tolerant pin with default function JTDI; alternate functions SPI2_NSS, I2S2_WS; remap TIMER1_CH0_ETI, TIMER1_ETI, PA15, SPI0_NSS.
39 PB3 bidirectional 5V-tolerant pin with default function JTDO; alternate functions SPI2_SCK, I2S2_CK; remap TIMER1_CH1, PB3, TRACESWO, SPI0_SCK.
40 PB4 bidirectional 5V-tolerant pin with default function NJTRST; alternate functions SPI2_MISO, I2C0_TXFRAME; remap TIMER2_CH0, PB4, SPI0_MISO.
41 PB5 bidirectional GPIO PB5 by default; alternate functions I2C0_SMBA, SPI2_MOSI, I2S2_SD; remap TIMER2_CH1, SPI0_MOSI, CAN1_RX.
42 PB6 bidirectional 5V-tolerant GPIO PB6 by default; alternate functions I2C0_SCL, TIMER3_CH0; remap USART0_TX, CAN1_TX, SPI0_IO2.
43 PB7 bidirectional 5V-tolerant GPIO PB7 by default; alternate functions I2C0_SDA, TIMER3_CH1; remap USART0_RX, SPI0_IO3.
44 BOOT0 input Boot mode pin, default function BOOT0.
45 PB8 bidirectional 5V-tolerant GPIO PB8 by default; alternate functions TIMER3_CH2, TIMER9_CH0; remap I2C0_SCL, CAN0_RX.
46 PB9 bidirectional 5V-tolerant GPIO PB9 by default; alternate functions TIMER3_CH3, TIMER10_CH0; remap I2C0_SDA, CAN0_TX.
47 VSS_3 power_in Ground pin, default function VSS_3.
48 VDD_3 power_in Power supply pin, default function VDD_3.

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package LQFP-48(7x7)
Category Embedded Processors & Controllers
Pins 48

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD (external, absolute maximum) VDD -0.3 3.6 V relative to VSS (VSS - 0.3 to VSS + 3.6) 42
Analog supply voltage VDDA (absolute maximum) VDDA -0.3 3.6 V relative to VSSA (VSSA - 0.3 to VSSA + 3.6) 42
Battery supply voltage VBAT (absolute maximum) VBAT -0.3 3.6 V relative to VSS (VSS - 0.3 to VSS + 3.6) 42
Input voltage on 5V tolerant pin (absolute maximum) VIN -0.3 6.5 V 5V tolerant pin; table gives VDD + 3.6 V, VIN maximum cannot exceed 6.5 V 42
Input voltage on other I/O (absolute maximum) VIN -0.3 3.6 V other I/O pins 42
Variation between different VDD power pins /ΔVDDX/ 50 mV 42
Variation between different ground pins /VSSX-VSS/ 50 mV 42
Maximum current for GPIO pins IIO -25 25 mA 42
Operating temperature range TA -40 85 °C 42
Power dissipation LQFP48 PD 574 mW TA = 85°C, LQFP48 42
Storage temperature range TSTG -55 150 °C 42
Maximum junction temperature TJ 125 °C 42
Supply voltage VDD VDD 1.71 3.3 3.6 V 42
Analog supply voltage VDDA (ADC not used) VDDA 1.71 3.3 3.6 V ADC not used 42
Analog supply voltage VDDA (ADC used) VDDA 2.4 3.3 3.6 V ADC used 42
Battery supply voltage VBAT VBAT 1.71 3.6 V 42
AHB clock frequency fHCLK 120 MHz 43
APB1 clock frequency fAPB1 60 MHz 43
APB2 clock frequency fAPB2 120 MHz 43
VDD rise time rate tVDD 0 μs/V max printed as ∞ 43
VDD fall time rate tVDD 20 μs/V max printed as ∞ 43
ESD voltage, human body model VESD(HBM) 5000 V TA = 25 °C; JESD22-A114 52
ESD voltage, charge device model VESD(CDM) 800 V TA = 25 °C; JESD22-C101 52
Static latch-up I-test LU -200 200 mA TA = 25 °C; JESD78 53
Vsupply over voltage (latch-up) 5.4 V 53
Crystal or ceramic frequency HXTAL fHXTAL 4 8 32 MHz 1.71 ≤ VDD ≤ 3.6 V 53
Recommended matching capacitance on OSCIN and OSCOUT CHXTAL 20 30 pF 53
Crystal or ceramic duty cycle HXTAL Ducy(HXTAL) 30 50 70 % 53
External clock source or oscillator frequency (HXTAL bypass) fHXTAL_ext 1 50 MHz VDD = 3.3 V 53
OSCIN high or low time (HXTAL bypass) tH/L(HXTAL) 5 ns 53
OSCIN rise or fall time (HXTAL bypass) tR/F(HXTAL) 10 ns 53
Duty cycle (HXTAL bypass) Ducy(HXTAL) 40 60 % 53
External clock source or oscillator frequency (LXTAL bypass) fLXTAL_ext 32.768 1000 kHz VDD = 3.3 V 54
OSC32IN high or low time (LXTAL bypass) tH/L(LXTAL) 450 ns 54
OSC32IN rise or fall time (LXTAL bypass) tR/F(LXTAL) 50 ns 54
Crystal or ceramic duty cycle LXTAL Ducy(LXTAL) 30 70 % 54
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -2.5 2.5 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 55
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -1.8 1.8 % VDD = VDDA = 3.3 V, TA = 0 °C ~ +85 °C 55
IRC8M oscillator frequency accuracy, factory-trimmed ACCIRC8M -1 1 % VDD = VDDA = 3.3 V, TA = 25 °C 55
IRC8M oscillator duty cycle DucyIRC8M 45 50 55 % VDD = VDDA = 3.3 V 55
Low speed internal oscillator (IRC40K) frequency fIRC40K 28 40 60 kHz VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 55
IRC48M oscillator frequency accuracy, factory-trimmed ACCIRC48M -4 5 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 56
IRC48M oscillator frequency accuracy, factory-trimmed ACCIRC48M -3 3 % VDD = VDDA = 3.3 V, TA = 0 °C ~ +85 °C 56
IRC48M oscillator frequency accuracy, factory-trimmed ACCIRC48M -2 2 % VDD = VDDA = 3.3 V, TA = 25 °C 56
PLL input clock frequency fPLLIN 1 8 25 MHz 56
PLL output clock frequency fPLLOUT 16 120 MHz 56
VCO output frequency fVCO 32 240 MHz 56
PLL lock time tLOCK 300 μs 56
Number of guaranteed program/erase cycles before failure (endurance) PECYC 100 kcycles TA = -40 °C ~ +85 °C 57
Data retention time tRET 10 years 10k cycles at TA = 85 °C 57
Word programming time tPROG 37 44 μs TA = -40 °C ~ +85 °C 57
Page erase time tERASE 3.2 4 ms TA = -40 °C ~ +85 °C 57
Mass erase time tMERASE 8 10 ms TA = -40 °C ~ +85 °C 57
Low level output voltage (8 mA) VOL 0.11 V IIO = +8 mA, VDD = 3.3 V 58
High level output voltage (8 mA) VOH 3.14 V IIO = +8 mA, VDD = 3.3 V 58
Thermal resistance junction-to-ambient ΘJA ΘJA 69.64 °C/W TA = 85°C, Natural convection, 2S2P PCB, LQFP48 76
Thermal resistance junction-to-board ΘJB ΘJB 43.16 °C/W TA = 25°C, Cold plate, 2S2P PCB, LQFP48 76
Thermal resistance junction-to-case ΘJC ΘJC 25.36 °C/W TA = 25°C, Cold plate, 2S2P PCB, LQFP48 76
Thermal characterization parameter junction-to-board ΨJB ΨJB 47.75 °C/W TA = 85°C, Natural convection, 2S2P PCB, LQFP48 76
Thermal characterization parameter junction-to-top center ΨJT ΨJT 2.45 °C/W TA = 85°C, Natural convection, 2S2P PCB, LQFP48 76

CAD (KiCad official)

  • Symbol: GD32E103C8T6
  • Footprint: Package_QFP:LQFP-48_7x7mm_P0.5mm
  • 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: gd32e103c8t6-etched.step / gd32e103c8t6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd32e103c8t6.step / gd32e103c8t6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (80 pp, sha256 b9866c3233b5ee3b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF