# GD25Q32EEIGR

**GigaDevice Semicon Beijing** · NOR FLASH · USON-8-EP(2x3)

GD25Q32EEIGR from GigaDevice Semicon Beijing, in a USON-8-EP(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS# | input | Chip Select Input; must be driven high when chip is not selected and must not be left floating. |
| 2 | SO (IO1) | bidirectional | Serial Data Output in standard SPI mode; becomes Data Input Output 1 in Dual and Quad SPI modes. |
| 3 | WP# (IO2) | bidirectional | Write Protect Input; must be driven high if unused or requires external pull-up resistor; acts as Data Input Output 2 in Quad SPI mode. |
| 4 | VSS | power_in | Ground. |
| 5 | SI (IO0) | bidirectional | Serial Data Input in standard SPI mode; becomes Data Input Output 0 in Dual and Quad SPI modes. |
| 6 | SCLK | input | Serial Clock Input. |
| 7 | HOLD# (IO3) | bidirectional | Hold Input; must be driven high if unused or requires external pull-up resistor; acts as Data Input Output 3 in Quad SPI mode. |
| 8 | VCC | power_in | Power Supply; 2.7-3.6V operating range. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | GigaDevice Semicon Beijing |
| Package | USON-8-EP(2x3) |
| Category | Memory |
| Pins | 9 |

## CAD (KiCad official)

- Symbol: `GD25Q32EEIGR`
- Footprint: `Package_SON:SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm`
- 3D model: USON-8-EP(2x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `gd25q32eeigr-etched.step` / `gd25q32eeigr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `gd25q32eeigr.step` / `gd25q32eeigr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [GigaDevice Semicon Beijing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590902915789758464) (60 pp, sha256 `4eda438f26bc9bdd`, retrieved 2026-10-01, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-4-6` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/gd25q32eeigr-datasheet.pdf)