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Contents

README

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GD25Q128EWIGR

GigaDevice Semicon Beijing · NOR FLASH · WSON-8-EP(5x6)

GD25Q128EWIGR from GigaDevice Semicon Beijing, in a WSON-8-EP(5x6). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS# input Chip Select input, active low. Must be driven high when the chip is not selected; do not leave floating after power-on.
2 SO/IO1 bidirectional Serial Data Output in Standard SPI mode; becomes bidirectional Data I/O 1 in Dual/Quad SPI modes.
3 WP#/IO2 bidirectional Write Protect input (active low) in Standard/Dual SPI modes; becomes bidirectional Data I/O 2 in Quad SPI mode when Status Register QE bit = 1.
4 VSS power_in Ground reference for all signals and supply return.
5 SI/IO0 bidirectional Serial Data Input in Standard SPI mode; becomes bidirectional Data I/O 0 in Dual/Quad SPI modes.
6 SCLK input Serial Clock input. Data on SI/IOx is latched on rising edge; SO/IOx shifts on falling edge. SPI modes 0 and 3 supported, up to 133MHz.
7 HOLD#/RESET#/IO3 bidirectional Multifunction pin: HOLD# (pauses serial communication) or RESET# input in Standard/Dual SPI modes; becomes bidirectional Data I/O 3 in Quad SPI mode. HOLD vs RESET behavior selected by non-volatile HOLD/RST status bit; IO3 role selected when QE=1.
8 VCC power_in Power supply input, 2.7V to 3.6V single supply.

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package WSON-8-EP(5x6)
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • GD25Q128EWIGR
  • GD25Q128EWIGRWHIG
  • GD25Q128EWIGRUFIG
  • GD25Q128EWIGRSIG
  • GD25Q128EWIGRIR
  • GD25Q128EWIGRPIG

CAD (KiCad official)

  • Symbol: GD25Q128EWIGR
  • Footprint: Package_SON:WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm
  • 3D model: WSON-8-EP(5x6) (KiCad packages3D, STEP)
  • 3D model files: gd25q128ewigr-etched.step / gd25q128ewigr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd25q128ewigr.step / gd25q128ewigr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (63 pp, sha256 54cb85133a09da0c, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF