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GD25LQ16EEIGR

Public Made by Adom

by adom

GigaDevice(兆易创新) NOR FLASH, USON-8(2x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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GD25LQ16EEIGR

GigaDevice(兆易创新) · NOR FLASH · USON-8(2x3)

GD25LQ16EEIGR from GigaDevice(兆易创新), in a USON-8(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS# input Chip Select Input; it must be driven high when the chip is not selected and must not be left floating at any time after power is on.
2 SO (IO1) bidirectional Data Output (Data Input Output 1), used as the serial data output in standard SPI and as IO1 in Dual/Quad SPI.
3 WP# (IO2) bidirectional Write Protect Input (Data Input Output 2), serving as IO2 in Quad SPI mode.
4 VSS power_in Ground.
5 SI (IO0) bidirectional Data Input (Data Input Output 0), used as the serial data input in standard SPI and as IO0 in Dual/Quad SPI.
6 SCLK input Serial Clock Input.
7 HOLD# (IO3) bidirectional Hold Input (Data Input Output 3), serving as IO3 in Quad SPI mode.
8 VCC power_in Power Supply pin; the part is specified for a single supply with full voltage range 1.65-2.1V (stated in the Features section, page 4).
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer GigaDevice(兆易创新)
Package USON-8(2x3)
Category Memory
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Leakage Current ILI -2 2 μA 48
Output Leakage Current ILO -2 2 μA 48
Standby Current ICC1 10 25 μA CS#=VCC, VIN=VCC or VSS 48
Deep Power-Down Current ICC2 1 8 μA CS#=VCC, VIN=VCC or VSS 48
Operating Current (Read) ICC3 10 15 mA CLK=0.1VCC / 0.9VCC at 133MHz, Q=Open(x4 I/O) 48
Operating Current (Read) ICC3 8 12 mA CLK=0.1VCC / 0.9VCC at 80MHz, Q=Open(x4 I/O) 48
Operating Current (Read) ICC3 3 5 mA CLK=0.1VCC / 0.9VCC at 80MHz, Q=Open(x1 I/O) 48
Operating Current (PP) ICC4 8 15 mA CS#=VCC 48
Operating Current (WRSR) ICC5 8 15 mA CS#=VCC 48
Operating Current (SE) ICC6 8 15 mA CS#=VCC 48
Operating Current (BE) ICC7 8 15 mA CS#=VCC 48
Operating Current (CE) ICC8 8 15 mA CS#=VCC 48
Output Low Voltage VOL 0.2 V IOL = 100μA 48
Ambient Operating Temperature (I grade) TA -40 85 ℃ Value for I grade (-40℃ to +85℃) only 46
Storage Temperature -65 150 ℃ 46
Transient Input/Output Voltage (note: overshoot) -2 V Printed upper limit is VCC+2.0 V, not a number 46
Applied Input/Output Voltage -0.6 V Printed upper limit is VCC+0.4 V, not a number 46
Supply Voltage VCC -0.6 2.5 V 46
Supply Voltage (operating range) VCC 1.65 2.1 V TA = -40℃~85℃ (table header) 48
Clock Low To Output Valid (CL = 30pF) tCLQV 7 ns CL = 30pF 51
Write Inhibit Voltage VWI 1.4 V 46
VCC (min.) to device operation tVSL 700 μs 46
Input Capacitance CIN 6 pF VIN=0V 47
Output Capacitance COUT 8 pF VOUT=0V 47
Serial Clock Frequency fC 133 MHz all commands except 03H 51
Serial Clock Frequency (Read) fR 80 MHz Read (03H) 51
Serial Clock Rise Time (Slew Rate) tCLCH 0.2 V/ns 51
Serial Clock Fall Time (Slew Rate) tCHCL 0.2 V/ns 51
CS# Active Setup Time tSLCH 5 ns 51
CS# Active Hold Time tCHSH 5 ns 51
CS# Not Active Setup Time tSHCH 5 ns 51
CS# Not Active Hold Time tCHSL 5 ns 51
CS# High Time (Read/Write) tSHSL 20 ns Read/Write 51
Output Disable Time tSHQZ 6 ns 51
Output Hold Time tCLQX 1.2 ns 51
Data In Setup Time tDVCH 2 ns 51
Data In Hold Time tCHDX 2 ns 51
HOLD# Low Setup Time (Relative To Clock) tHLCH 5 ns 51
HOLD# High Setup Time (Relative To Clock) tHHCH 5 ns 51
HOLD# Low Hold Time (Relative To Clock) tCHHH 5 ns 51
HOLD# High Hold Time (Relative To Clock) tCHHL 5 ns 51
HOLD# Low To High-Z Output tHLQZ 6 ns 51
HOLD# High To Low-Z Output tHHQX 6 ns 51
Write Protect Setup Time Before CS# Low tWHSL 20 ns 51
Write Protect Hold Time After CS# High tSHWL 100 ns 51
CS# High To Deep Power-Down Mode tDP 3 μs 51
CS# High To Standby Mode Without Electronic Signature Read tRES1 20 μs 51
CS# High To Standby Mode With Electronic Signature Read tRES2 20 μs 51
CS# High To Next Command After Suspend tSUS 20 μs 51
Latency Between Resume And Next Suspend tRS 100 μs 51
CS# High To Next Command After Reset (Except From Erase) tRST 30 μs Except From Erase 51
CS# High To Next Command After Reset (From Erase) tRST_E 12 ms From Erase 51
Write Status Register Cycle Time tW 2 25 ms 52
Byte Program Time (First Byte) tBP1 30 60 μs 52
Additional Byte Program Time (After First Byte) tBP2 2.5 5 μs 52
Page Programming Time tPP 0.4 2.4 ms 52
Sector Erase Time tSE 40 300 ms 52
Block Erase Time (32K Bytes) tBE1 0.15 0.8 s 52
Block Erase Time (64K Bytes) tBE2 0.2 1.2 s 52
Chip Erase Time (GD25LQ16E) tCE 4.5 10 s 52

CAD (KiCad official)

  • Symbol: GD25LQ16EEIGR
  • Footprint: Package_SON:SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm
  • 3D model: USON-8(2x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: gd25lq16eeigr-etched.step / gd25lq16eeigr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd25lq16eeigr.step / gd25lq16eeigr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice(兆易创新) datasheet (68 pp, sha256 b1378f6aac83c294, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF