# GCM1885C2A821JA16D

**Murata Electronics** · New Arrivals · 0603

GCM1885C2A821JA16D from Murata Electronics, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised capacitor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised capacitor; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Murata Electronics |
| Package | 0603 |
| Category | Others |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Capacitance tolerance (code J) |  | -5 |  | 5 | % |  | 1 |
| Temperature coefficient (C0G, EIA) | TC | -30 | 0 | 30 | ppm/℃ | 25 to 125℃, reference temp 25℃ | 1 |
| Rated voltage | VR |  |  | 100 | V | DC rated voltage; applied voltage must not exceed rated voltage | 1 |
| Operating temperature range | TA | -55 |  | 125 | ℃ | Operating Temp. Range | 1 |
| Capacitance drift (temperature step test) |  | -0.2 |  | 0.2 | % | Steps 1,3,5 vs step 3; or ±0.05pF, whichever is larger; measurement voltage <1.0Vrms | 5 |
| Q (quality factor) | Q | 1000 |  |  |  | 25℃, 1.0±0.1MHz, 0.5 to 5.0Vrms | 4 |
| Insulation resistance (room temperature) | IR | 100000 |  |  | MΩ | 25℃, rated voltage, charging time 2min, charge/discharge current 50mA max. | 4 |
| Insulation resistance (high temperature) | IR | 10000 |  |  | MΩ | 125℃, rated voltage, charging time 2min, charge/discharge current 50mA max. | 4 |
| Charge/discharge current during IR and voltage tests |  |  |  | 50 | mA | Insulation resistance and voltage proof tests | 4 |
| Moisture resistance capacitance change | ΔC/C | -3 |  | 3 | % | 25 to 65℃, 80 to 98%RH, 24h cycles x10, post-treatment 24±2h at room temp | 2 |
| Moisture resistance Q | Q | 350 |  |  |  | Moisture resistance test, 25 to 65℃, 80 to 98%RH | 2 |
| Moisture resistance insulation resistance (room temp) | IR | 10000 |  |  | MΩ | After moisture resistance test, room temperature | 2 |
| Temperature cycling capacitance change | ΔC/C | -2.5 |  | 2.5 | % | 1000 cycles, temperature cycling per EIA-469 | 2 |
| Temperature cycling Q | Q | 1000 |  |  |  | 1000 cycles, temperature cycling | 2 |
| Temperature cycling insulation resistance (room temp) | IR | 10000 |  |  | MΩ | After 1000 cycles, room temperature | 2 |
| High temperature exposure capacitance change | ΔC/C | -2.5 |  | 2.5 | % | 150±3℃, 1000±12h | 2 |
| High temperature exposure Q | Q | 1000 |  |  |  | 150±3℃, 1000±12h | 2 |
| High temperature exposure insulation resistance (room temp) | IR | 10000 |  |  | MΩ | 150±3℃, 1000±12h, then room temperature | 2 |
| Operational life capacitance change | ΔC/C | -3 |  | 3 | % | Max operating temp ±3℃, 1000±12h, rated voltage and 1.3+0.2/-0 Vdc (6.8kΩ series) | 3 |
| Operational life Q | Q | 350 |  |  |  | Max operating temp, 1000±12h, rated voltage and 1.3+0.2/-0 Vdc | 3 |
| Operational life insulation resistance (room temp) | IR | 1000 |  |  | MΩ | After operational life test, room temperature | 3 |
| Biased humidity capacitance change | ΔC/C | -3 |  | 3 | % | 85±3℃, 80 to 85%RH | 3 |
| Biased humidity Q | Q | 200 |  |  |  | 85±3℃, 80 to 85%RH | 3 |
| Biased humidity insulation resistance (room temp) | IR | 1000 |  |  | MΩ | 85±3℃, 80 to 85%RH, then room temperature | 3 |
| Board flex capacitance change | ΔC/C | -5 |  | 5 | % | Flexure 3mm, holding 60s, reflow-mounted on test substrate | 4 |
| Beam load destruction value |  | 20 |  |  | N | Stress load speed 0.5mm/s | 4 |
| Solderability (terminations soldered) |  | 95 |  |  | % | Sn-3.0Ag-0.5Cu at 245±5℃, immersion 5+0/-0.5s, after 155℃ 4h pre-treatment | 4 |
| Reflow peak temperature (lead-free) |  | 240 |  | 260 | ℃ | Lead-free solder Sn-3.0Ag-0.5Cu, air or N2 atmosphere | 16 |
| Reflow temperature differential (ΔT, GC□18 series) | ΔT |  |  | 190 | ℃ | Standard reflow conditions, GC□03/15/18/21/31 series | 16 |
| Soldering iron tip temperature (rework) |  |  |  | 350 | ℃ | Correction with soldering iron, GC□03/15/18/21/31 series, ΔT≦190℃ | 18 |
| Preheating temperature (rework) |  | 150 |  |  | ℃ | Correction with soldering iron, GC□03/15/18/21/31 series | 18 |
| Nominal capacitance | C |  | 820 |  | pF | Rated value; 25℃, 1.0±0.1MHz, 0.5 to 5.0Vrms | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | Capacitance or Capacitance Change Capacitance:Within the specified initial value. Kind of Solder Sn-3.0Ag-0.5Cu(Lead Free Solder) Q or D.F. Within the specified initial value. Test Temperature 260+/-5 | 3 |

## CAD (KiCad official)

- Symbol: `GCM1885C2A821JA16D`
- Footprint: `Capacitor_SMD:C_0603_1608Metric`
- 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files: `gcm1885c2a821ja16d-etched.step` / `gcm1885c2a821ja16d-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `gcm1885c2a821ja16d.step` / `gcm1885c2a821ja16d.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Murata Electronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589785036271882240) (31 pp, sha256 `45d1bc0e2bbe1121`, retrieved 2026-11-04, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/gcm1885c2a821ja16d-datasheet.pdf)