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GCM1555C1H471FA16D

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MURATA ELECTRONICS Global Sourcing Parts, 0402. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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GCM1555C1H471FA16D

MURATA ELECTRONICS · Global Sourcing Parts · 0402

GCM1555C1H471FA16D from MURATA ELECTRONICS, in a 0402. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised capacitor; either orientation.
2 2 passive Terminal 2 of an unpolarised capacitor; either orientation.

Key specifications

Parameter Value
Manufacturer MURATA ELECTRONICS
Package 0402
Category Global Sourcing Parts
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Capacitance tolerance (code F) -1 1 % Part-number tolerance code F 1
Temperature coefficient TC -30 0 30 ppm/°C 25 to 125 °C (ref. 25 °C) 1
Capacitance change from 25 °C at -55 °C (5C/5G) -0.24 0.58 % Table A, 5C/5G, Max./Min. from 25 °C 6
Capacitance change from 25 °C at -30 °C (5C/5G) -0.17 0.4 % Table A, 5C/5G, Max./Min. from 25 °C 6
Capacitance change from 25 °C at -10 °C (5C/5G) -0.11 0.25 % Table A, 5C/5G, Max./Min. from 25 °C 6
Capacitance drift -0.2 0.2 % -55 °C to +150 °C; ±0.2% or ±0.05 pF, whichever is larger 6
Q (30 pF min.) Q 1000 30 pF min., 25 °C, freq/voltage per Electrical Characteristics table 4
Insulation resistance at 25 °C IR 100000 MΩ 25 °C, DC ≤ rated voltage, 2 min charge; or 1000 Ω·F, whichever is smaller 4
Insulation resistance at 125 °C IR 10000 MΩ 125 °C (5C); or 100 Ω·F, whichever is smaller 4
Rated voltage VR 50 V DC; applied voltage must not exceed rated voltage 1
Operating temperature range TOP -55 125 °C Operating temp. range 1
Storage temperature 5 40 °C Room temperature storage, per Caution 1-1 11
Storage relative humidity 20 70 %RH Storage, per Caution 1-1 11
Reflow peak temperature (lead-free) 240 260 °C Sn-3.0Ag-0.5Cu, air or N2; Table 1 16
Reflow temperature differential ΔT ΔT 190 °C Reflow, chip 03/15/18/21/31 16
Soldering iron tip temperature 350 °C Rework, GC□03/15/18/21/31, air 18
Preheating temperature (rework) 150 °C Rework, GC□03/15/18/21/31, air 18
High temp. exposure capacitance change ΔC -2.5 2.5 % 150 °C 1000 h; ±2.5% or ±0.25 pF, whichever is larger 2
High temp. exposure insulation resistance IR 10000 MΩ 25 °C; or 500 Ω·F, whichever is smaller 2
Temperature cycling capacitance change ΔC -2.5 2.5 % ±2.5% or ±0.25 pF, whichever is larger 2
Temperature cycling insulation resistance IR 10000 MΩ 25 °C; or 500 Ω·F, whichever is smaller 3
Moisture resistance capacitance change ΔC -3 3 % ±3.0% or ±0.30 pF, whichever is larger 2
Moisture resistance Q (30 pF min.) Q 350 30 pF min. 2
Moisture resistance insulation resistance IR 10000 MΩ 25 °C; or 500 Ω·F, whichever is smaller 2
Biased humidity capacitance change ΔC -3 3 % ±3.0% or ±0.30 pF, whichever is larger 2
Biased humidity Q (30 pF and over) Q 200 30 pF and over 2
Biased humidity insulation resistance IR 1000 MΩ 25 °C; or 50 Ω·F, whichever is smaller 2
Operational life capacitance change ΔC -3 3 % 125 °C, 200% rated voltage, 1000 h; ±3.0% or ±0.30 pF, whichever is larger 3
Operational life Q (30 pF min.) Q 350 30 pF min. 3
Operational life insulation resistance IR 1000 MΩ 25 °C; or 50 Ω·F, whichever is smaller 3
Resistance to solvents insulation resistance IR 10000 MΩ 25 °C; or 500 Ω·F, whichever is smaller 3
Mechanical shock insulation resistance IR 10000 MΩ 25 °C; or 500 Ω·F, whichever is smaller 3
Resistance to soldering heat insulation resistance IR 10000 MΩ 25 °C; or 500 Ω·F, whichever is smaller 3
Thermal shock capacitance change ΔC -2.5 2.5 % ±2.5% or ±0.25 pF, whichever is larger 4
Thermal shock insulation resistance IR 10000 MΩ 25 °C; or 500 Ω·F, whichever is smaller 4
ESD insulation resistance IR 10000 MΩ 25 °C; or 500 Ω·F, whichever is smaller 4
Board flex capacitance change ΔC -5 5 % ±5.0% or ±0.5 pF, whichever is larger 5
Board flex insulation resistance IR 10000 MΩ 25 °C; or 500 Ω·F, whichever is smaller 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance. Caution 14

CAD (KiCad official)

  • Symbol: GCM1555C1H471FA16D
  • Footprint: Capacitor_SMD:C_0402_1005Metric
  • 3D model: 0402 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MURATA ELECTRONICS datasheet (29 pp, sha256 df21d96d3852dc0f, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF