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Contents

README

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GC3D10170A

SUPSiC · SiC Diodes · TO-220-2

GC3D10170A from SUPSiC, in a TO-220-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PIN 1 passive Diode terminal labeled PIN 1 on the TO-220-2 package drawing; the datasheet does not state whether this is the anode or the cathode.
2 PIN 2 passive Diode terminal labeled PIN 2 on the TO-220-2 package drawing; the datasheet does not state whether this is the anode or the cathode.

Key specifications

Parameter Value
Manufacturer SUPSiC
Package TO-220-2
Category Silicon Carbide (SiC) Devices
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage (TJ=25°C) VF 1.7 3 V IF = 10 A TJ=25°C 2
Forward Voltage (TJ=175°C) VF 2 3.5 V IF = 10 A TJ=175°C 2
Reverse Current (TJ=25°C) IR 20 100 μA VR = 1700 V TJ=25°C 2
Reverse Current (TJ=175°C) IR 60 300 μA VR = 1700 V TJ=175°C 2
Repetitive Peak Reverse Voltage VRRM 1700 V 1
Surge Peak Reverse Voltage VRSM 1700 V 1
DC Blocking Voltage VDC 1700 V 1
Continuous Forward Current IF 14.4 A TC<135˚C 1
Repetitive Peak Forward Surge Current (TC=25°C) IFRM 45 A TC=25˚C, tP=10 ms, Half Sine Wave, D=1 1
Repetitive Peak Forward Surge Current (TC=110°C) IFRM 26 A TC=110˚C, tP=10 ms, Half Sine Wave, D=1 1
Non-Repetitive Peak Forward Surge Current (TC=25°C) IFSM 55 A TC=25˚C, tP=10ms, Half Sine Wave, D=1 1
Non-Repetitive Peak Forward Surge Current (TC=110°C) IFSM 41 A TC=110˚C, tP=10 ms, Half Sine Wave, D=1 1
Power Dissipation (TC=25°C) Ptot 231 W TC=25˚C 1
Power Dissipation (TC=110°C) Ptot 100 W TC=110˚C 1
Maximum Case Temperature Tc 135 ˚C 1
Operating Junction Range TJ -55 175 ˚C 1
Storage Temperature Range Tstg -55 135 ˚C 1
Mounting Torque (TO-247 label, note 1) 8.8 Nm M3 Screw 1
Thermal Resistance from Junction to Case RJC 0.65 °C/W 2

CAD (KiCad official)

  • Symbol: GC3D10170A
  • Footprint: Package_TO_SOT_THT:TO-220-2_Vertical
  • 3D model: TO-220-2 (KiCad packages3D, STEP)
  • 3D model files: gc3d10170a-etched.step / gc3d10170a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gc3d10170a.step / gc3d10170a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SUPSiC datasheet (6 pp, sha256 56ad5055317bbf58, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF