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Contents

README

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GBU808_HF

Diodes Incorporated · Bridge Rectifiers · GBU

GBU808_HF from Diodes Incorporated, in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 - passive Negative DC output terminal of the bridge rectifier, marked '-' on the package drawing.
2 2 passive AC input terminal, marked '~' on the package drawing; the GBU808 is rated for 560 V RMS reverse voltage.
3 3 passive AC input terminal, marked '~' on the package drawing; the GBU808 is rated for 560 V RMS reverse voltage.
4 + passive Positive DC output terminal of the bridge rectifier, marked '+' on the package drawing; average forward rectified current is 8.0 A.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package GBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 800 V GBU808 column 1
Working Peak Reverse Voltage VRWM 800 V GBU808 column 1
DC Blocking Voltage VR 800 V GBU808 column 1
RMS Reverse Voltage VR(RMS) 560 V GBU808 column 1
Average Forward Rectified Current I(AV) 8 A @ TC = 100C; unit mounted on 50 x 50 x 1.6mm copper plate heatsink (Note 1) 1
Non-Repetitive Peak Forward Surge Current IFSM 200 A 8.3ms single half sine-wave superimposed on rated load 1
Forward Voltage (per element) VFM 1 V @ IF = 4.0A 1
Peak Reverse Current at rated DC blocking voltage IR 5 A @ TC = 25C, at rated DC blocking voltage 1
Peak Reverse Current at rated DC blocking voltage IR 500 A @ TC = 125C, at rated DC blocking voltage 1
I2t Rating for Fusing I2t 166 A2s t < 8.3ms (Note 2) 1
Operating and Storage Temperature Range Tj, TSTG -55 150 C 1
Typical Total Capacitance per Element CT 130 pF measured at 1.0MHz and applied reverse voltage of 4.0V DC (Note 3) 1
Typical Thermal Resistance Junction to Case RJC 2.2 C/W Note 1: unit mounted on 50 x 50 x 1.6mm copper plate heatsink 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Terminals: Finish Tin. Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: GBU808_HF
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu808-hf-etched.step / gbu808-hf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu808-hf.step / gbu808-hf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (3 pp, sha256 62e15e5fa04e6515, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF