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GBU806-G

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Shandong Jingdao Microelectronics Bridge Rectifiers, GBU. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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GBU806-G

Shandong Jingdao Microelectronics · Bridge Rectifiers · GBU

GBU806-G from Shandong Jingdao Microelectronics, in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 - passive Negative DC output of the bridge, the left-most lead in the package drawing; the datasheet gives a DC blocking voltage of 600 V for the GBU806G.
2 2 passive AC input lead, second from the left in the package drawing; the datasheet gives a maximum RMS voltage of 420 V for the GBU806G.
3 3 passive AC input lead, third from the left in the package drawing; the datasheet gives a maximum RMS voltage of 420 V for the GBU806G.
4 + passive Positive DC output of the bridge, the right-most lead in the package drawing; the datasheet gives an average rectified current of 8.0 A with a heatsink.

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package GBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Recurrent Peak Reverse Voltage VRRM 600 V 1
Maximum DC Blocking Voltage VDC 600 V 1
Maximum RMS Voltage VRMS 420 V 1
Maximum Average Forward Rectified Current I(AV) 8 A with heatsink (Note 2), TC=100°C 1
Maximum Average Forward Rectified Current I(AV) 3.2 A without heatsink 1
Peak Forward Surge Current IFSM 220 A 8.3ms single half sine-wave, superimposed on rated load (JEDEC method) 1
Operating Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1

CAD (KiCad official)

  • Symbol: GBU806-G
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu806-g-etched.step / gbu806-g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu806-g.step / gbu806-g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (3 pp, sha256 67f7882adf6c9894, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF