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GBU608A

Yangzhou Yangjie Elec Tech · Bridge Rectifiers · GBU

GBU608A from Yangzhou Yangjie Elec Tech, in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 - passive Negative DC output terminal of the bridge, marked "-" on the body; the datasheet's 1000 V-class family rates GBU608A at VRRM 800 V and IO 6.0 A with heatsink (Tc=110 °C).
2 AC1 passive AC input terminal marked "~"/AC on the body; GBU608A is rated VRRM 800 V with IFSM 175 A surge.
3 AC2 passive Second AC input terminal marked "~"/AC on the body; GBU608A is rated VRRM 800 V with IFSM 175 A surge.
4 + passive Positive DC output terminal of the bridge, marked "+" on the body; average rectified current is 6.0 A with heatsink (Tc=110 °C) or 2.8 A without heatsink (Ta=25 °C).

Key specifications

Parameter Value
Manufacturer Yangzhou Yangjie Elec Tech
Package GBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum instantaneous forward voltage drop per diode VF 1 V IFM=3.0A 1
Maximum DC reverse current at rated DC blocking voltage per diode IRRM 5 μA VRM=VRRM 1
Repetitive peak reverse voltage VRRM 800 V 1
Average rectified output current, with heatsink IO 6 A @60Hz sine wave, R-load, Tc=110℃, with heatsink 1
Average rectified output current, without heatsink IO 2.8 A @60Hz sine wave, R-load, Ta=25℃, without heatsink 1
Surge (non-repetitive) forward current IFSM 175 A @60Hz half sine wave, 1 cycle, Tj=25℃ 1
Current squared time I²t 127 A²S @1ms≤t≤8.3ms, Tj=25℃, rating per diode 1
Storage temperature Tstg -55 150 ℃ 1
Junction temperature Tj -55 150 ℃ 1
Dielectric strength Vdis 2.5 KV @ terminals to case, AC 1 minute 1
Mounting torque Tor 8 kg·cm Recommended torque: 5 kg·cm 1
Thermal resistance, junction to ambient RθJ-A 26 ℃/W Between junction and ambient, without heatsink 2
Thermal resistance, junction to case RθJ-C 3.4 ℃/W Between junction and case, with heatsink 2

CAD (KiCad official)

  • Symbol: GBU608A
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu608a-etched.step / gbu608a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu608a.step / gbu608a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Yangzhou Yangjie Elec Tech datasheet (4 pp, sha256 d3b8f9fab2ddd312, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF