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GBU606

MDD(Microdiode Electronics) · Bridge Rectifiers · GBU

GBU606 from MDD(Microdiode Electronics), in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 + passive Positive DC output of the bridge rectifier; the package is rated 6.0 A average forward current and 600 V VRRM for GBU606.
2 2 passive AC input terminal of the bridge; the GBU606 is rated 420 V RMS maximum.
3 3 passive AC input terminal of the bridge; the GBU606 is rated 420 V RMS maximum.
4 - passive Negative DC output of the bridge rectifier; the GBU606 is rated 600 V maximum DC blocking voltage.

Key specifications

Parameter Value
Manufacturer MDD(Microdiode Electronics)
Package GBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 600 V 1
Maximum RMS voltage VRMS 420 V 1
Maximum DC blocking voltage VDC 600 V 1
Maximum average forward rectified current I(AV) 6 A @Tc=100°C (without heatsink) 1
Peak forward surge current IFSM 150 A 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) 1
Maximum forward voltage VF 1.1 V at 3.0A DC 1
Maximum DC reverse current IR 10 μA TA=25°C at rated DC blocking voltage 1
Maximum DC reverse current IR 0.5 mA TA=125°C at rated DC blocking voltage 1
Typical Junction Capacitance CJ 50 pF Measured at 1.0MHz and applied reverse voltage of 4.0V DC (Note 1) 1
Typical Thermal Resistance RθJA 2.2 °C/W Device mounted on 75mm75mm1.6mm cu plate heatsink (Note 2) 1
Operating junction temperature range TJ -55 150 °C 1
Storage temperature range TSTG -55 150 °C 1

CAD (KiCad official)

  • Symbol: GBU606
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu606-etched.step / gbu606-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu606.step / gbu606.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MDD(Microdiode Electronics) datasheet (2 pp, sha256 2752fc02329347e7, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF