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GBU602

Changjing · Bridge Rectifiers · GBU

GBU602 from Changjing, in a GBU. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 + passive Positive DC output terminal, marked '+' on the package outline above the leftmost lead.
2 AC1 passive AC input terminal, an unmarked inner lead of the bridge.
3 AC2 passive AC input terminal, an unmarked inner lead of the bridge.
4 - passive Negative DC output terminal, marked '-' on the package outline above the rightmost lead.

Key specifications

Parameter Value
Manufacturer Changjing
Package GBU
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive Peak Reverse Voltage VRRM 200 V GBU602 column (02) 1
Maximum RMS Voltage VRMS 140 V GBU602 column (02) 1
Average Rectified Output Current IO 6 A 60Hz sine wave, R-load, with heatsink Tc=110℃ 1
Average Rectified Output Current IO 2.8 A 60Hz sine wave, R-load, without heatsink Ta=25℃ 1
Surge (Non-repetitive) Forward Current IFSM 175 A 60Hz sine wave, 1 cycle, Tj=25℃ 1
Current Squared Time I2t 127 A2S 1ms≤t<8.3ms, Tj=25℃, rating per diode 1
Dielectric Strength Vdis 2 KV Terminals to case, AC 1 minute 1
Mounting Torque Tor 8 kg·cm Recommend torque: 5kg·cm 1
Storage Temperature Tstg -55 150 ℃ 1
Junction Temperature Tj -55 150 ℃ 1
Peak Forward Voltage VFM 1 V IFM=3A, pulse measurement, rating of per diode 1
Peak Reverse Current IRRM 10 μA VRM=VRRM, pulse measurement, rating of per diode 1
Thermal Resistance Junction to Ambient RθJ-A 26 ℃/W Between junction and ambient, without heatsink 1
Thermal Resistance Junction to Case RθJ-C 3.4 ℃/W Between junction and case, with heatsink 1

CAD (KiCad official)

  • Symbol: GBU602
  • Footprint: Diode_THT:Diode_Bridge_Vishay_GBU
  • 3D model: GBU (KiCad packages3D, STEP)
  • 3D model files: gbu602-etched.step / gbu602-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gbu602.step / gbu602.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Changjing datasheet (3 pp, sha256 5c1039c8d4fbf62a, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF